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1. 发明授权

US07350686B2 Method for supplying solder 失效
标题翻译：焊料供应方法
公开(公告)号：US07350686B2
公开(公告)日：2008-04-01
申请号：US10530548
申请日：2002-12-13
申请人： Junichi Onozaki , Masahiko Furuno , Hiroshi Saito , Haruhiko Andou , Isao Sakamoto , Masaru Shirai , Yuji Ohashi
发明人： Junichi Onozaki , Masahiko Furuno , Hiroshi Saito , Haruhiko Andou , Isao Sakamoto , Masaru Shirai , Yuji Ohashi
IPC分类号： B23K31/02
CPC分类号： H01L24/12 , B23K3/0623 , H01L21/288 , H01L24/10 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05124 , H01L2224/05155 , H01L2224/05568 , H01L2224/05644 , H01L2224/13 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3484 , H05K2203/0425 , H05K2203/0776 , H01L2924/00 , H01L2924/00014
摘要： Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containing solder fine particles is fed from a solder fine particle forming unit to the liquid tank and the solder fine particles are dropped from a supply pipe onto the substrate in the inert liquid. The solder fine particles naturally fall down by the gravity, thereby reaching the substrate. The solder fine particles reached on the pad electrodes on the substrate stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.
摘要翻译：获得的是细小的焊盘电极以及具有大量焊料的焊料凸块和少量的差异。首先，在液体槽中的惰性液体中，将基板面朝上定位。随后，将含有焊料细颗粒的惰性液体从焊料细颗粒形成单元供给到液体槽，并且将焊料细颗粒从供给管中滴落到惰性液体中的基板上。焊料细颗粒自然地因重力而下降，从而到达基板。在基板上的焊盘电极上达到的焊料细颗粒由于重力而停留在其上，并且在焊料湿润时间之后在焊盘电极的表面上扩散，从而形成焊料涂层。

2. 发明申请

US20060054667A1 Method for supplying solder 失效
标题翻译：焊料供应方法
公开(公告)号：US20060054667A1
公开(公告)日：2006-03-16
申请号：US10530548
申请日：2002-12-13
申请人： Junichi Onozaki , Masahiko Furuno , Hiroshi Saito , Haruhiko Andou , Isao Sakamoto , Masaru Shirai , Yuji Ohashi
发明人： Junichi Onozaki , Masahiko Furuno , Hiroshi Saito , Haruhiko Andou , Isao Sakamoto , Masaru Shirai , Yuji Ohashi
IPC分类号： B23K31/02 , B23K35/12 , B23K1/20
CPC分类号： H01L24/12 , B23K3/0623 , H01L21/288 , H01L24/10 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05124 , H01L2224/05155 , H01L2224/05568 , H01L2224/05644 , H01L2224/13 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3484 , H05K2203/0425 , H05K2203/0776 , H01L2924/00 , H01L2924/00014
摘要： Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid (13) in a liquid tank (11), a substrate (20) is positioned with a surface (21) facing up. Subsequently, the inert liquid (13) containing solder fine particles (14) is fed from a solder fine particle forming unit (15) to the liquid tank (11) and the solder fine particles (14) are dropped from a supply pipe (16) onto the substrate (20) in the inert liquid (13). The solder fine particles (14) naturally fall down by the gravity, thereby reaching the substrate (20). The solder fine particles (14) reached on the pad electrodes on the substrate (20) stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.
摘要翻译：获得的是细小的焊盘电极以及具有大量焊料的焊料凸块和少量的差异。首先，在液体罐（11）中的惰性液体（13）中，将表面（21）面向上的基板（20）定位。随后，将含有焊料细颗粒（14）的惰性液体（13）从焊料细颗粒形成单元（15）供给到液体罐（11），并且焊料细颗粒（14）从供给管（16））到惰性液体（13）中的基底（20）上。焊料细颗粒（14）自然地因重力而下落，从而到达衬底（20）。到达衬底（20）上的焊盘电极上的焊料细颗粒（14）由于重力而停留在其上，并且在焊料湿润时间之后扩散在焊盘电极的表面上，从而形成焊料涂层。

3. 发明授权

US08042727B2 Heater, reflow apparatus, and solder bump forming method and apparatus 有权
标题翻译：加热器，回流装置和焊料凸块形成方法和装置
公开(公告)号：US08042727B2
公开(公告)日：2011-10-25
申请号：US10598142
申请日：2005-03-29
申请人： Masaru Shirai , Junichi Onozaki , Hiroshi Saito , Isao Sakamoto , Masahiko Furuno , Haruhiko Ando , Atsushi Hiratsuka
发明人： Masaru Shirai , Junichi Onozaki , Hiroshi Saito , Isao Sakamoto , Masahiko Furuno , Haruhiko Ando , Atsushi Hiratsuka
IPC分类号： B23K31/02
CPC分类号： B23K1/012 , B23K1/0016 , B23K3/0623 , B23K3/08 , B23K2101/42 , F27B17/0025 , H01L21/4853 , H01L24/11 , H01L24/12 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/056 , H01L2224/05624 , H01L2224/1131 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/3025 , H05K3/3436 , H05K3/3494 , H01L2924/00 , H01L2924/00014 , H01L2924/01014
摘要： An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side. With the former feature, oxidization of the solder paste on the substrate where no hot air comes and adhesion of particles to the substrate can be prevented, and with the latter feature, solder particles near the pad electrode are melted earlier and wet and spread over the pad electrode, solder particles above and far from the pad electrode are not melted sufficiently, and an effect of reducing the possibility that solder particles join together can be expected.
摘要翻译：一种装置，其特征在于，在安装有基板或夹具的夹具的阶段中，设置安装基板或夹具时封闭的开口，并且通过向基板或夹具吹入热空气来加热基板或夹具基板或夹具的下部以及通过加热或回流焊料组合物形成焊料凸块的特征，焊料组合物是含有焊料颗粒，助熔剂组分和正常液体的液体材料的混合物温度或加热时变成液体，并且从基材侧加热组合物。利用前面的特征，可以防止在没有热空气的基板上的焊膏的氧化，并且可以防止颗粒附着到基板上，并且随后的特征是焊垫电极附近的焊料颗粒早期熔化并且分散在焊盘电极，焊盘电极上方和远离焊料电极的熔融物不能充分熔化，并且可以预期降低焊料颗粒接合在一起的可能性的效果。

4. 发明申请

US20070158387A1 Heater, reflow apparatus, and solder bump forming method and apparatus 有权
标题翻译：加热器，回流装置和焊料凸块形成方法和装置
公开(公告)号：US20070158387A1
公开(公告)日：2007-07-12
申请号：US10598142
申请日：2005-03-29
申请人： Masaru Shirai , Junichi Onozaki , Hiroshi Saito , Isao Sakamoto , Masahiko Furuno , Haruhiko Ando , Atsushi Hiratsuka
发明人： Masaru Shirai , Junichi Onozaki , Hiroshi Saito , Isao Sakamoto , Masahiko Furuno , Haruhiko Ando , Atsushi Hiratsuka
IPC分类号： A47J36/02
CPC分类号： B23K1/012 , B23K1/0016 , B23K3/0623 , B23K3/08 , B23K2101/42 , F27B17/0025 , H01L21/4853 , H01L24/11 , H01L24/12 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/056 , H01L2224/05624 , H01L2224/1131 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/3025 , H05K3/3436 , H05K3/3494 , H01L2924/00 , H01L2924/00014 , H01L2924/01014
摘要： An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side. With the former feature, oxidization of the solder paste on the substrate where no hot air comes and adhesion of particles to the substrate can be prevented, and with the latter feature, solder particles near the pad electrode are melted earlier and wet and spread over the pad electrode, solder particles above and far from the pad electrode are not melted sufficiently, and an effect of reducing the possibility that solder particles join together can be expected.
摘要翻译：一种装置，其特征在于，在安装有基板或夹具的夹具的阶段中，设置安装基板或夹具时封闭的开口，并且通过向基板或夹具吹入热空气来加热基板或夹具基板或夹具的下部以及通过加热或回流焊料组合物形成焊料凸块的特征，焊料组合物是含有焊料颗粒，助熔剂组分和正常液体的液体材料的混合物温度或加热时变成液体，并且从基材侧加热组合物。利用前面的特征，可以防止在没有热空气的基板上的焊膏的氧化，并且可以防止颗粒附着到基板上，并且随后的特征是焊垫电极附近的焊料颗粒早期熔化并且分散在焊盘电极，焊盘电极上方和远离焊料电极的熔融物不能充分熔化，并且可以预期降低焊料颗粒接合在一起的可能性的效果。

5. 发明授权

US08104661B2 Heating device, reflow device, heating method, and bump forming method 有权
标题翻译：加热装置，回流装置，加热方法和凸块形成方法
公开(公告)号：US08104661B2
公开(公告)日：2012-01-31
申请号：US11909326
申请日：2006-03-22
申请人： Junichi Onozaki , Masahiko Furuno , Hiroshi Saito , Isao Sakamoto , Masaru Shirai
发明人： Junichi Onozaki , Masahiko Furuno , Hiroshi Saito , Isao Sakamoto , Masaru Shirai
IPC分类号： B23K1/00 , B23K1/08 , B23K31/02
CPC分类号： H05K3/3484 , B23K1/012 , B23K3/0623 , B23K2101/38 , H01L21/4853 , H01L24/11 , H01L24/12 , H01L2224/1131 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3494 , H05K2203/0425 , H05K2203/0557 , H05K2203/0776 , H05K2203/081
摘要： A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.
摘要翻译：通过使用加热装置在基板上形成焊料凸块，其中盖结构阻挡热空气直接吹向焊料组合物。加热装置可以减少与焊料组合物接触的高温氧分子，抑制焊料组合物的氧化。结果，虽然热空气用于加热，但是可以通过液体状焊料组合物形成焊料凸块。此外，由于盖结构被热空气均匀地加热，来自盖结构的辐射热也是均匀的，并且容器被更均匀地加热。此外，由于抑制热空气直接吹向液面，液态焊料组合物不会被热空气散射。

6. 发明申请

US20090008432A1 HEATING DEVICE, REFLOW DEVICE, HEATING METHOD, AND BUMP FORMING METHOD 有权
标题翻译：加热装置，回流装置，加热方法和BUMP形成方法
公开(公告)号：US20090008432A1
公开(公告)日：2009-01-08
申请号：US11909326
申请日：2006-03-22
申请人： Junichi Onozaki , Masahiko Furuno , Hiroshi Saito , Isao Sakamoto , Masaru Shirai
发明人： Junichi Onozaki , Masahiko Furuno , Hiroshi Saito , Isao Sakamoto , Masaru Shirai
IPC分类号： B23K31/02 , F24C7/00 , F26B19/00
CPC分类号： H05K3/3484 , B23K1/012 , B23K3/0623 , B23K2101/38 , H01L21/4853 , H01L24/11 , H01L24/12 , H01L2224/1131 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3494 , H05K2203/0425 , H05K2203/0557 , H05K2203/0776 , H05K2203/081
摘要： A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.
摘要翻译：通过使用加热装置在基板上形成焊料凸块，其中盖结构阻挡热空气直接吹向焊料组合物。加热装置可以减少与焊料组合物接触的高温氧分子，抑制焊料组合物的氧化。结果，虽然热空气用于加热，但是可以通过液体状焊料组合物形成焊料凸块。此外，由于盖结构被热空气均匀地加热，来自盖结构的辐射热也是均匀的，并且容器被更均匀地加热。此外，由于抑制热空气直接吹向液面，液态焊料组合物不会被热空气散射。

7. 发明申请

US20070181218A1 Solder composition and method of bump formation therewith 审中-公开
标题翻译：焊料组成及其形成凸块的方法
公开(公告)号：US20070181218A1
公开(公告)日：2007-08-09
申请号：US10598124
申请日：2005-03-17
申请人： Isao Sakamoto , Junichi Onozaki , Masahiko Furuno , Hiroshi Saito , Haruhiko Ando , Masaru Shirai , Atsushi Hiratsuka
发明人： Isao Sakamoto , Junichi Onozaki , Masahiko Furuno , Hiroshi Saito , Haruhiko Ando , Masaru Shirai , Atsushi Hiratsuka
IPC分类号： B23K35/34
CPC分类号： H01L24/12 , B23K1/0016 , B23K1/203 , B23K35/0244 , B23K35/262 , B23K35/36 , B23K2101/40 , H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/056 , H01L2224/131 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H05K3/3484 , H05K3/3489 , H05K2203/0425 , H05K2203/043 , H05K2203/0776 , H01L2224/13099 , H01L2924/00 , H01L2924/00014 , H01L2924/01014 , H01L2924/013
摘要： A solder composition capable of in the bump formation on a substrate, simplifying the coating operation. There is provided solder composition (10) comprising a mixture of liquid substance (12) and solder particles (11), wherein the liquid substance (12) contains a flux component of organic acid whose reaction temperature for oxide film removal is in the vicinity of the melting point of the solder particles and has such a viscosity that the liquid substance flows at ordinary temperature and accumulates in the form of a layer on substrate (20). The solder particles (11) consist of a particulate agent that settles in the liquid substance (12) toward a solder base material, having a particle diameter and mixing ratio enabling uniform dispersion in the liquid substance (12). By application of this solder composition onto substrate (20) with pad electrode (22) followed by heating, solder particles (11) adhere to the pad electrode (22) having its surface oxide film removed through reaction with the flux component to thereby promote soldering between any solder film formed on the base material and the solder particles (11), and further, aggregation of the solder particles (11) can be inhibited by a reaction product of the flux component to thereby form unbridged solder bumps (23).
摘要翻译：能够在基板上形成凸起的焊料组合物，简化了涂布操作。提供了包含液体物质（12）和焊料颗粒（11）的混合物的焊料组合物（10），其中液体物质（12）含有氧化膜去除的反应温度在焊料颗粒的熔点并且具有液体物质在常温下流动并以基板（20）上的层的形式积聚的粘度。焊料颗粒（11）由将液体物质（12）朝向焊料基材沉降的颗粒剂组成，其具有能使液体物质（12）均匀分散的粒径和混合比例。通过将这种焊料组合物施加到具有焊盘电极（22）的衬底（20）上，然后加热，焊料颗粒（11）粘附到焊盘电极（22）上，焊盘电极（22）的表面氧化膜通过与助焊剂组分反应去除，从而促进焊接在基材上形成的焊料膜与焊料粒子（11）之间，焊料粒子（11）的聚集也可以通过助焊剂成分的反应产物来抑制，从而形成非桥接的焊料凸块（23）。

8. 发明申请

US20080035710A1 Solder Composition and Solder Layer Forming Method Using the Same 审中-公开
标题翻译：焊料组合物和焊锡层的形成方法
公开(公告)号：US20080035710A1
公开(公告)日：2008-02-14
申请号：US11571546
申请日：2005-08-08
申请人： Masahiko Furuno , Hiroshi Saito , Isao Sakamoto , Masaru Shirai
发明人： Masahiko Furuno , Hiroshi Saito , Isao Sakamoto , Masaru Shirai
IPC分类号： B23K35/22
CPC分类号： H05K3/3484 , B22F2998/10 , B23K35/0244 , B23K35/22 , B23K35/26 , B23K35/262 , C22C13/00 , H05K2203/0425 , B22F9/04 , B22F1/02
摘要： [Problem to be Solved] [Solution] A solder composition 10 is for forming a solder layer on an electrode 21 provided on a substrate 20. The solder composition 10 includes solder powder composed of a plurality of solder particles 12 coated with organic films 11, and a medium 13 having a boiling point not lower than the melting point of the solder powder. The solder layer on the electrode 21 grows by coalescence of the solder particles 12 with the solder layer. Therefore, when the coalescence of the solder particles proceeds and the amount of the organic film per unit surface area of the solder layer reaches a certain level, the growth of the solder layer stops. Namely, the final solder amount of the solder layer is determined depending on the initial size of the solder particle 12 and amount of the organic film 11. Thereby, it is possible to inhibit coalescence of the solder particles 12 on the electrode 21 beyond necessity, so a short-circuit failure of the electrode 21 can be prevented.
摘要翻译： [待解决的问题] [解决方案]焊料组合物10用于在设置在基板20上的电极21上形成焊料层。焊料组合物10包括由多个涂有有机膜11的焊料颗粒12组成的焊料粉末，以及沸点不低于焊料粉末的熔点的介质13。电极21上的焊料层通过焊料颗粒12与焊料层的聚结而生长。因此，当焊料颗粒的聚结进行并且焊料层的每单位表面积的有机膜的量达到一定水平时，停止焊料层的生长。也就是说，焊料层的最终焊料量根据焊料粒子12的初始尺寸和有机膜11的量来确定。由此，可以不必要地抑制焊料颗粒12在电极21上的聚结，因此可以防止电极21的短路故障。

9. 发明授权

US5845797A Rubber plug for drug vessel 失效
标题翻译：药瓶用橡胶塞
公开(公告)号：US5845797A
公开(公告)日：1998-12-08
申请号：US801114
申请日：1997-02-14
申请人： Morihiro Sudo , Masaru Shirai , Kohichi Asai
发明人： Morihiro Sudo , Masaru Shirai , Kohichi Asai
IPC分类号： A61J1/00 , A61J1/14 , B65D39/00 , B65D51/16
CPC分类号： B65D39/0011 , B65D39/00 , A61J1/14 , B65D2539/005 , B65D2539/006
摘要： A rubber plug for a drug vessel has at least one convexity formed on a surface of the rubber plug so that the rubber plug is prevented from sticking together, joining together under compression or joining together under suction with another rubber plug of a similar type. The convexity may preferably be a grain pattern formed on at least a part of the surface of the rubber plug by transferring same from a mold. A rubber plug for a drug vessel may also be composed of a leg portion and a head portion formed integrally with the leg portion and may have at least one convexity on at least one of the leg portion and the head portion.
摘要翻译：用于药物容器的橡胶塞具有形成在橡胶塞的表面上的至少一个凸起，从而防止橡胶塞粘在一起，在压缩下接合在一起或者在吸附下与另一类似类型的橡胶塞接合在一起。优选的凸起可以是通过从模具转移而在橡胶塞的表面的至少一部分上形成的颗粒图案。用于药物容器的橡胶塞还可以由腿部和与腿部一体形成的头部组成，并且在腿部和头部中的至少一个上可以具有至少一个凸起。

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