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1. 发明授权

US6133637A Semiconductor device having a plurality of semiconductor chips 有权
标题翻译：具有多个半导体芯片的半导体装置
公开(公告)号：US6133637A
公开(公告)日：2000-10-17
申请号：US155134
申请日：1998-09-18
申请人： Junichi Hikita , Kazutaka Shibata , Tsunemori Yamaguchi , Tadahiro Morifuji , Osamu Miyata
发明人： Junichi Hikita , Kazutaka Shibata , Tsunemori Yamaguchi , Tadahiro Morifuji , Osamu Miyata
IPC分类号： G01P3/488 , H01L21/56 , H01L21/60 , H01L23/31 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/18 , H01L29/40
CPC分类号： H01L23/544 , G01P3/488 , H01L21/563 , H01L23/3135 , H01L23/49575 , H01L23/49816 , H01L23/49827 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L25/18 , H01L2223/54426 , H01L2224/05554 , H01L2224/1147 , H01L2224/13016 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/2939 , H01L2224/29444 , H01L2224/29455 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/78281 , H01L2224/78301 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83136 , H01L2224/8319 , H01L2224/83851 , H01L2224/83856 , H01L2224/83907 , H01L2224/85181 , H01L2224/90 , H01L2224/92247 , H01L2225/0651 , H01L2225/06513 , H01L2225/06555 , H01L2225/06562 , H01L2225/06582 , H01L2225/06586 , H01L2225/06593 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L24/90 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/18161
摘要： A semiconductor device includes first and second semiconductor chips. The first semiconductor chip is formed with a plurality of first electrodes on a surface thereof, while the second semiconductor chip is formed with a plurality of second electrodes on a surface thereof. These surfaces are positioned facing to each other, thereby connecting between the first electrode and the second electrode. The respective surfaces are formed with circuit elements. The circuit elements are covered by the first semiconductor chip and the second semiconductor chip The first semiconductor chip and the second semiconductor chip at their connecting portions are encapsulated by a synthetic resin that is excellent in moisture resistance. The first semiconductor chip and the second semiconductor chip are entirely packaged by a second synthetic resin that is excellent in adhesibility.
摘要翻译： PCT No.PCT / JP98 / 00281 Sec。 371日期：1998年9月18日 102（e）1998年9月18日PCT PCT。1998年1月22日PCT公布。出版物WO98 / 33217 日期：1998年7月30日半导体器件包括第一和第二半导体芯片。第一半导体芯片在其表面上形成有多个第一电极，而第二半导体芯片在其表面上形成有多个第二电极。这些表面被定位成彼此面对，由此连接在第一电极和第二电极之间。各个表面形成有电路元件。电路元件由第一半导体芯片和第二半导体芯片覆盖。第一半导体芯片和第二半导体芯片在其连接部分由耐湿性优异的合成树脂封装。第一半导体芯片和第二半导体芯片由粘合性优异的第二合成树脂完全包装。

2. 发明授权

US06458609B1 Semiconductor device and method for manufacturing thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06458609B1
公开(公告)日：2002-10-01
申请号：US09612480
申请日：2000-07-07
申请人： Junichi Hikita , Kazutaka Shibata , Tsunemori Yamaguchi , Tadahiro Morifuji , Osamu Miyata
发明人： Junichi Hikita , Kazutaka Shibata , Tsunemori Yamaguchi , Tadahiro Morifuji , Osamu Miyata
IPC分类号： H01L2100
CPC分类号： H01L23/544 , G01P3/488 , H01L21/563 , H01L23/3135 , H01L23/49575 , H01L23/49816 , H01L23/49827 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/90 , H01L25/0657 , H01L25/18 , H01L2223/54426 , H01L2224/05554 , H01L2224/1147 , H01L2224/13016 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/2939 , H01L2224/29444 , H01L2224/29455 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/78281 , H01L2224/78301 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83136 , H01L2224/8319 , H01L2224/83851 , H01L2224/83856 , H01L2224/83907 , H01L2224/85181 , H01L2224/90 , H01L2224/92247 , H01L2225/0651 , H01L2225/06513 , H01L2225/06555 , H01L2225/06562 , H01L2225/06582 , H01L2225/06586 , H01L2225/06593 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10162 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes first and second semiconductor chips. The first semiconductor chip is formed with a plurality of first electrodes on a surface thereof, while the second semiconductor chip is formed with a plurality of second electrodes on a surface thereof. These surfaces are positioned facing to each other, thereby connecting between the first electrode and the second electrode. The respective surfaces are formed with circuit elements. The circuit elements are covered by the first semiconductor chip and the second semiconductor chip The first semiconductor chip and the second semiconductor chip at their connecting portions are encapsulated by a synthetic resin that is excellent in moisture resistance. The first semiconductor chip and the second semiconductor chip are entirely packaged by a second synthetic resin that is excellent in adhesibility.
摘要翻译：半导体器件包括第一和第二半导体芯片。第一半导体芯片在其表面上形成有多个第一电极，而第二半导体芯片在其表面上形成有多个第二电极。这些表面被定位成彼此面对，由此连接在第一电极和第二电极之间。各个表面形成有电路元件。电路元件由第一半导体芯片和第二半导体芯片覆盖。第一半导体芯片和第二半导体芯片在其连接部分由耐湿性优异的合成树脂封装。第一半导体芯片和第二半导体芯片由粘合性优异的第二合成树脂完全包装。

3. 发明授权

US06782615B2 Method of surface-mounting electronic components 有权
标题翻译：表面贴装电子元件的方法
公开(公告)号：US06782615B2
公开(公告)日：2004-08-31
申请号：US09204123
申请日：1998-12-02
申请人： Kazutaka Shibata , Tsunemori Yamaguchi
发明人： Kazutaka Shibata , Tsunemori Yamaguchi
IPC分类号： H05K302
CPC分类号： H05K3/323 , H05K2201/10636 , H05K2201/10689 , H05K2201/10727 , Y02P70/611 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155
摘要： A plurality of electronic components having conductive connecting members are surface-mounted to a target surface of a circuit board by specifying terminal-forming areas that are each no greater than the corresponding one of the electronic components and each include at least one terminal part such that at least one of these terminal-forming areas includes a plurality of terminal parts directly and that each pair of the terminal parts within any one of the terminal-forming areas is closer to each other than any pair of the terminal parts in different ones of the terminal-forming areas. An anisotropic conductive layer is formed on this target surface so as to span these terminal-forming areas, and the plurality of electronic components are placed on this anisotropic conductive layer individually above the plurality of terminal-forming areas. As the layer is heated, these electronic components are pressed against the layer such that the conductive connecting members of the electronic components become attached to and electrically conductive with corresponding ones of the terminal parts on the circuit board. The anisotropic conductive layer remains electrically insulative elsewhere.
摘要翻译：具有导电连接构件的多个电子部件通过规定不大于相应的一个电子部件的端子形成区域来表面安装到电路板的目标表面，并且每个端子形成区域包括至少一个端子部分，使得这些端子形成区域中的至少一个直接包括多个端子部，并且在任一个端子形成区域内的每对端子部分彼此之间的任何一对端子部分彼此更靠近终端形成区域。在该目标表面上形成各向异性导电层，以跨越这些端子形成区域，并且将多个电子部件分别放置在多个端子形成区域上方的该各向异性导电层上。当层被加热时，这些电子部件被压靠在层上，使得电子部件的导电连接部件被附接到电路板上的对应的端子部分并与其导电。各向异性导电层在其他地方保持电绝缘。

4. 发明申请

US20100001413A1 Semiconductor Device and Semiconductor Device Manufacturing Method 有权
标题翻译：半导体器件和半导体器件制造方法
公开(公告)号：US20100001413A1
公开(公告)日：2010-01-07
申请号：US11918407
申请日：2006-04-14
申请人： Hideki Hiromoto , Sadamasa Fujii , Tsunemori Yamaguchi
发明人： Hideki Hiromoto , Sadamasa Fujii , Tsunemori Yamaguchi
IPC分类号： H01L23/49 , H01L21/60
CPC分类号： H01L24/85 , H01L23/3107 , H01L23/49503 , H01L23/49517 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/4554 , H01L2224/45669 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48475 , H01L2224/4848 , H01L2224/48997 , H01L2224/4911 , H01L2224/49429 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85951 , H01L2224/85986 , H01L2924/00014 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2224/48455 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： The present invention aims at providing a semiconductor device capable of reliably preventing a wire bonded to an island from being disconnected due to a thermal shock, a temperature cycle and the like in mounting and capable of preventing remarkable increase in the process time. In the semiconductor device according to the present invention, a semiconductor chip is die-bonded to the surface of an island, one end of a first wire is wire-bonded to an electrode formed on the surface of the semiconductor chip to form a first bonding section and the other end of the first wire is wire-bonded to the island to form a second bonding section, while the semiconductor device is resin-sealed. A double bonding section formed by wire-bonding a second wire is provided on the second bonding section of the first wire wire-bonded onto the island.
摘要翻译：本发明的目的在于提供一种能够可靠地防止由于安装时的热冲击，温度循环等而使与岛部接合的引线断线的半导体装置，能够防止显着增加处理时间。在根据本发明的半导体器件中，半导体芯片被芯片接合到岛的表面，第一线的一端被引线接合到形成在半导体芯片的表面上的电极，以形成第一接合并且第一线的另一端被引线接合到岛以形成第二接合部，同时半导体器件被树脂密封。在第一导线接合到岛上的第二接合部上设置有通过引线接合第二线形成的双接合部。

5. 发明授权

US08604627B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08604627B2
公开(公告)日：2013-12-10
申请号：US11918407
申请日：2006-04-14
申请人： Hideki Hiromoto , Sadamasa Fujii , Tsunemori Yamaguchi
发明人： Hideki Hiromoto , Sadamasa Fujii , Tsunemori Yamaguchi
IPC分类号： H01L23/49
CPC分类号： H01L24/85 , H01L23/3107 , H01L23/49503 , H01L23/49517 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/4554 , H01L2224/45669 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48475 , H01L2224/4848 , H01L2224/48997 , H01L2224/4911 , H01L2224/49429 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85951 , H01L2224/85986 , H01L2924/00014 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2224/48455 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： The present invention aims at providing a semiconductor device capable of reliably preventing a wire bonded to an island from being disconnected due to a thermal shock, a temperature cycle and the like in mounting and capable of preventing remarkable increase in the process time. In the semiconductor device according to the present invention, a semiconductor chip is die-bonded to the surface of an island, one end of a first wire is wire-bonded to an electrode formed on the surface of the semiconductor chip to form a first bonding section and the other end of the first wire is wire-bonded to the island to form a second bonding section, while the semiconductor device is resin-sealed. A double bonding section formed by wire-bonding a second wire is provided on the second bonding section of the first wire wire-bonded onto the island.
摘要翻译：本发明的目的在于提供一种能够可靠地防止由于安装时的热冲击，温度循环等而使与岛部接合的引线断线的半导体装置，能够防止显着增加处理时间。在根据本发明的半导体器件中，半导体芯片被芯片接合到岛的表面，第一线的一端被引线接合到形成在半导体芯片的表面上的电极，以形成第一接合并且第一线的另一端被引线接合到岛以形成第二接合部，同时半导体器件被树脂密封。在第一导线接合到岛上的第二接合部上设置有通过引线接合第二线形成的双接合部。

6. 发明申请

US20120286412A1 SEMICONDUCTOR DEVEICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120286412A1
公开(公告)日：2012-11-15
申请号：US13522853
申请日：2011-01-17
申请人： Akihiro Kimura , Tsunemori Yamaguchi
发明人： Akihiro Kimura , Tsunemori Yamaguchi
IPC分类号： H01L23/495 , H01L21/78
CPC分类号： H01L23/49513 , H01L23/3107 , H01L23/3135 , H01L23/49503 , H01L23/49541 , H01L23/49551 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/07802 , H01L2924/14 , H01L2924/17738 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01015 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512
摘要： A semiconductor device 100 includes a first insulating material 110 attached to a second main surface 106b of a semiconductor chip 106, and a second insulating material 112 attached to side surfaces of the semiconductor chip 106, the first insulating material 110 and an island 102. The semiconductor chip 106 is fixed to the island 102 via the first insulating material 110 and the second insulating material 112. The first insulating material 110 ensures a high dielectric strength between the semiconductor chip 106 and the island 102. Though the second insulating material 112 having a modulus of elasticity greater than that of the first insulating material 110, the semiconductor chip 106 is firmly attached to the island 102.
摘要翻译：半导体器件100包括附接到半导体芯片106的第二主表面106b的第一绝缘材料110和附接到半导体芯片106，第一绝缘材料110和岛102的侧表面的第二绝缘材料112。半导体芯片106经由第一绝缘材料110和第二绝缘材料112固定到岛102.第一绝缘材料110确保半导体芯片106和岛102之间的高介电强度。虽然第二绝缘材料112具有弹性模量大于第一绝缘材料110的弹性模量，半导体芯片106牢固地附接到岛102。

7. 发明授权

US08779569B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08779569B2
公开(公告)日：2014-07-15
申请号：US13522853
申请日：2011-01-17
申请人： Akihiro Kimura , Tsunemori Yamaguchi
发明人： Akihiro Kimura , Tsunemori Yamaguchi
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/49513 , H01L23/3107 , H01L23/3135 , H01L23/49503 , H01L23/49541 , H01L23/49551 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/07802 , H01L2924/14 , H01L2924/17738 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01015 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512
摘要： A semiconductor device 100 includes a first insulating material 110 attached to a second main surface 106b of a semiconductor chip 106, and a second insulating material 112 attached to side surfaces of the semiconductor chip 106, the first insulating material 110 and an island 102. The semiconductor chip 106 is fixed to the island 102 via the first insulating material 110 and the second insulating material 112. The first insulating material 110 ensures a high dielectric strength between the semiconductor chip 106 and the island 102. Though the second insulating material 112 having a modulus of elasticity greater than that of the first insulating material 110, the semiconductor chip 106 is firmly attached to the island 102.
摘要翻译：半导体器件100包括附接到半导体芯片106的第二主表面106b的第一绝缘材料110和附接到半导体芯片106，第一绝缘材料110和岛102的侧表面的第二绝缘材料112。半导体芯片106经由第一绝缘材料110和第二绝缘材料112固定到岛102.第一绝缘材料110确保半导体芯片106和岛102之间的高介电强度。虽然第二绝缘材料112具有弹性模量大于第一绝缘材料110的弹性模量，半导体芯片106牢固地附接到岛102。

8. 发明授权

US07638860B2 Semiconductor device and lead frame 有权
公开(公告)号：US07638860B2
公开(公告)日：2009-12-29
申请号：US11918410
申请日：2006-04-12
申请人： Hideki Hiromoto , Sadamasa Fujii , Tsunemori Yamaguchi
发明人： Hideki Hiromoto , Sadamasa Fujii , Tsunemori Yamaguchi
IPC分类号： H01L23/52
CPC分类号： H01L23/49503 , H01L23/49513 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/27013 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device which can surely prevent a wire bonded to an island from breaking due to, for instance, thermal shock and temperature cycle upon mounting. The semiconductor device includes a semiconductor chip; an island die bonded with the semiconductor chip on the surface; and a wire for electrically connecting the electrode formed on the surface of the semiconductor chip with the island. The semiconductor device is further characterized in that the island has a die bonding region where the semiconductor chip is die bonded, a wire bonding region where the wire is wire bonded, and a continuous groove reaching a circumference of the island are formed between the die bonding region and the wire bonding region of the island.

9. 发明申请

US20090032919A1 Semiconductor device and lead frame 有权
标题翻译：半导体器件和引线框架
公开(公告)号：US20090032919A1
公开(公告)日：2009-02-05
申请号：US11918410
申请日：2006-04-12
申请人： Hideki Hiromoto , Sadamasa Fujii , Tsunemori Yamaguchi
发明人： Hideki Hiromoto , Sadamasa Fujii , Tsunemori Yamaguchi
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/49513 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/27013 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device which can surely prevent a wire bonded to an island from breaking due to, for instance, thermal shock and temperature cycle upon mounting. The semiconductor device includes a semiconductor chip; an island die bonded with the semiconductor chip on the surface; and a wire for electrically connecting the electrode formed on the surface of the semiconductor chip with the island. The semiconductor device is further characterized in that the island has a die bonding region where the semiconductor chip is die bonded, a wire bonding region where the wire is wire bonded, and a continuous groove reaching a circumference of the island are formed between the die bonding region and the wire bonding region of the island.
摘要翻译：可以可靠地防止由于例如在安装时的热冲击和温度循环而导致岛上的引线断裂的半导体器件。半导体器件包括半导体芯片; 表面上与半导体芯片接合的岛状芯片; 以及用于将形成在半导体芯片的表面上的电极与岛电连接的导线。该半导体器件的特征还在于，该岛具有芯片接合的芯片接合区域，其中导线被接合的引线接合区域和到达岛的周边的连续槽形成在芯片接合之间区域和岛的引线键合区域。

10. 发明申请

US20090032977A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20090032977A1
公开(公告)日：2009-02-05
申请号：US11910912
申请日：2006-03-28
申请人： Tsunemori Yamaguchi
发明人： Tsunemori Yamaguchi
IPC分类号： H01L23/28
CPC分类号： H01L23/49548 , H01L23/3107 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/181 , H05K3/3426 , H05K3/3442 , H05K2201/10689 , H05K2201/1084 , Y02P70/613 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention is disclosed a semiconductor device which enables to easily perform a visual inspection of the bonded state between a lead and a land of wiring board. This semiconductor device comprises a lead in which at least a part of the lower surface thereof is exposed form the lower surface of the encapsulation resin and the end face thereof is exposed from the lateral surface of the encapsulation resin. The lower surface of the lead is provided with a groove which reaches the outer end edge of the lead.
摘要翻译：本发明公开了一种半导体装置，其能够容易地进行对配线基板的引线与焊盘之间的接合状态的目视检查。该半导体器件包括引线，其中其下表面的至少一部分从密封树脂的下表面暴露，并且其端面从封装树脂的侧表面露出。引线的下表面设有一个到达引线外端边缘的凹槽。

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