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1. 发明授权

US06344752B1 Contactor and production method for contractor 有权
标题翻译：承包商的接触器和生产方法
公开(公告)号：US06344752B1
公开(公告)日：2002-02-05
申请号：US09509546
申请日：2000-04-12
申请人： Junichi Hagihara , Shinji Iino
发明人： Junichi Hagihara , Shinji Iino
IPC分类号： G01R3102
CPC分类号： G01R3/00 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/07342
摘要： A conventional probe card is very complex in a support structure of probe terminals and it has been difficult to change an array of the probe terminals correspondingly to various arrays of electrode pads of an object to be checked. A contactor (1) of the present invention simultaneously sets its probe terminals in contact with a plurality of electrode pads of an object to be checked and electrical checking of the object is made once or a plurality of times. It has a plurality of first electrodes (3) arranged on a first substrate (silicon substrate) (2) and probe terminals (4) respectively provided on these electrodes (3). The probe terminal (4) has a conductive support (7) provided on the first electrode, elastic support plate (8) whose one end is fixed to the upper end of the conductive support column (7), and probe terminal (bump) 9 fixed to the free end portion of the elastic support plate (8).
摘要翻译：常规探针卡在探针端子的支撑结构中非常复杂，并且难以根据要检查的对象的各种电极焊盘阵列改变探针端子的阵列。本发明的接触器（1）同时将其探针端子与待检查物体的多个电极焊盘接触，并且对物体的电气检查进行一次或多次。它具有布置在分别设置在这些电极（3）上的第一衬底（硅衬底）（2）和探针端子（4）上的多个第一电极（3）。探针端子（4）具有设置在第一电极上的导电支撑（7），其一端固定在导电支柱（7）的上端的弹性支撑板（8）和探针端子（凸块）9 固定到弹性支撑板（8）的自由端部。

2. 再颁专利

USRE41515E1 Contactor and production method for contactor 有权
标题翻译：接触器接触器和接触器的生产方法
公开(公告)号：USRE41515E1
公开(公告)日：2010-08-17
申请号：US10772174
申请日：1999-07-29
申请人： Junichi Hagihara , Shinji Iino
发明人： Junichi Hagihara , Shinji Iino
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/07342
摘要： A conventional probe card is very complex in a support structure of probe terminals and it has been difficult to change an array of the probe terminals correspondingly to various arrays of electrode pads of an object to be checked. A contactor (1) of the present invention simultaneously sets its probe terminals in contact with a plurality of electrode pads of an object to be checked and electrical checking of the object is made once or a plurality of times. It has a plurality of first electrodes (3) arranged on a first substrate (silicon substrate) (2) and probe terminals (4) respectively provided on these electrodes (3). The probe terminal (4) has a conductive support (7) provided on the first electrode, elastic support plate (8) whose one end is fixed to the upper end of the conductive support column (7), and probe terminal (bump) 9 fixed to the free end portion of the elastic support plate (8).
摘要翻译：常规探针卡在探针端子的支撑结构中非常复杂，并且难以根据要检查的对象的各种电极焊盘阵列改变探针端子的阵列。本发明的接触器（1）同时将其探针端子与待检查物体的多个电极焊盘接触，并且对物体的电气检查进行一次或多次。它具有布置在分别设置在这些电极（3）上的第一衬底（硅衬底）（2）和探针端子（4）上的多个第一电极（3）。探针端子（4）具有设置在第一电极上的导电支撑（7），其一端固定在导电支柱（7）的上端的弹性支撑板（8）和探针端子（凸块）9 固定到弹性支撑板（8）的自由端部。

3. 发明授权

US06590381B1 Contactor holding mechanism and automatic change mechanism for contactor 有权
标题翻译：接触器保持机构和接触器自动更换机构
公开(公告)号：US06590381B1
公开(公告)日：2003-07-08
申请号：US09646951
申请日：2000-09-25
申请人： Shinji Iino , Junichi Hagihara , Kiyoshi Takekoshi
发明人： Shinji Iino , Junichi Hagihara , Kiyoshi Takekoshi
IPC分类号： G01R3102
CPC分类号： G01R31/2887 , G01R31/2851 , H01L21/6838 , H01L21/68714
摘要： Disclosed are a holding mechanism of a contactor and an automatic renewing mechanism of a contactor provided with the holding mechanism of the contactor. The contactor holding mechanism includes a frame (11) fixed to a performance board (P), a plurality of latch mechanisms (13) for holding the contactor inside the frame, and a suction fixing mechanism (14) for fixing the contactor held by the latch mechanisms inside the frame by a vacuum suction force. The automatic renewing mechanism of the contactor includes a holding mechanism (10) for detachably holding the contactor, and a delivery mechanism (16) for delivering the contactor (12) to and from the holding mechanism. Further, the delivery mechanism includes a suction holding section (17) for holding the contactor (12) by suction, an arm (18) having the suction holding section formed at the distal end portion and arranged swingable and movable in a vertical direction, and an arm driving section (19) for swinging and moving in a vertical direction the arm (18).
摘要翻译：公开了一种接触器的保持机构和设置有接触器的保持机构的接触器的自动更新机构。接触器保持机构包括：固定到执行板（P）的框架（11），用于将接触器保持在框架内的多个闩锁机构（13），以及用于固定由接触器通过真空抽吸力在框架内部的闩锁机构。接触器的自动更新机构包括用于可拆卸地保持接触器的保持机构（10）和用于将接触器（12）输送到保持机构和从保持机构输送的输送机构（16）。此外，输送机构包括：吸引用于保持接触器（12）的吸引保持部（17），具有形成在前端部的吸引保持部并且能够在垂直方向上可移动地设置的臂（18），以及用于在垂直方向上摆动和移动臂（18）的臂驱动部分（19）。

4. 发明申请

US20090212803A1 PROBE APPARATUS, PROBING METHOD, AND STORAGE MEDIUM 有权
标题翻译：探测设备，探测方法和存储介质
公开(公告)号：US20090212803A1
公开(公告)日：2009-08-27
申请号：US12389913
申请日：2009-02-20
申请人： Yasuhito Yamamoto , Masaru Suzuki , Junichi Hagihara
发明人： Yasuhito Yamamoto , Masaru Suzuki , Junichi Hagihara
IPC分类号： G01R31/02
CPC分类号： G01R31/2893
摘要： A probe apparatus is capable of being scaled-down and reducing a manufacturing cost thereof in a probe apparatus having a plurality of probe apparatus main bodies. A loader unit for transferring a wafer between carriers accommodating therein wafers and the probe apparatus main bodies includes: an upper camera for imaging the arrangement of chips to be inspected of the wafer; a lower camera for imaging probe needles; an X-Y-Θ stage for moving the position of the wafer W in a horizontal direction and a second loader mechanism for moving the wafer in a vertical direction. Accordingly, a fine alignment of the wafer is performed by the loader unit to adjust the position of the wafer.
摘要翻译：探针装置能够在具有多个探针装置主体的探针装置中进行比例缩小并降低其制造成本。用于在容纳晶片的载体和所述探针装置主体之间传送晶片的装载单元包括：用于对要被检查的晶片的芯片的布置进行成像的上摄像机; 用于成像探针的下部相机; 用于在水平方向上移动晶片W的位置的X-Y-θ级和用于沿垂直方向移动晶片的第二加载机构。因此，通过装载单元执行晶片的精细对准以调整晶片的位置。

5. 发明申请

US20090175705A1 SUBSTRATE TRANSFER APPARATUS AND VERTICAL HEAT PROCESSING APPARATUS 有权
标题翻译：基板传送装置和垂直加热装置
公开(公告)号：US20090175705A1
公开(公告)日：2009-07-09
申请号：US12225920
申请日：2007-04-23
申请人： Ken Nakao , Hitoshi Kato , Junichi Hagihara
发明人： Ken Nakao , Hitoshi Kato , Junichi Hagihara
IPC分类号： H01L21/677 , B25B11/00 , H01L21/673 , H01L21/68
CPC分类号： H01L21/67098 , H01L21/6838 , H01L21/68707
摘要： The present invention restrains, during a transfer of a substrate, a central portion of the substrate from being warped by its own weight, which might be caused by a super-enlargement of a diameter of the substrate. A substrate transfer apparatus 18 includes: a support part 17 which is moved above a substrate w of a large diameter; and an upside grip mechanism 28 disposed on the support part 17, the upside grip mechanism 28 capable of supporting a peripheral portion of the substrate w from above. The support part 17 is provided with a non-contact sucking and holding part 30 having a suction hole 31 and a blow hole 32. The non-contact sucking and holding part 30 sucks and holds the substrate w in a non-contact manner, by blowing a gas onto the central portion of the upper surface of the substrate w and sucking the central portion to form an air layer 50 such that the central portion of the wafer w is not warped.
摘要翻译：本发明在衬底的转移期间抑制衬底的中心部分被自身的重量扭曲，这可能是由于衬底的直径的过度扩大引起的。基板转印装置18包括：支撑部17，其在大直径的基板w上方移动; 以及设置在支撑部17上的上侧夹持机构28，能够从上方支撑基板w的周边部的上侧夹持机构28。支撑部17设置有具有吸入孔31和气孔32的非接触式吸持保持部30.非接触吸引保持部30以非接触的方式吸附并保持基板w，通过将气体吹送到基板w的上表面的中心部分并吸附中心部分以形成空气层50，使得晶片w的中心部分不翘曲。

6. 发明授权

US07091733B2 Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method 有权
公开(公告)号：US07091733B2
公开(公告)日：2006-08-15
申请号：US10813257
申请日：2004-03-31
申请人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
发明人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
IPC分类号： G01R31/02
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

7. 发明授权

US5708222A Inspection apparatus, transportation apparatus, and temperature control apparatus 失效
标题翻译：检查装置，运输装置和温度控制装置
公开(公告)号：US5708222A
公开(公告)日：1998-01-13
申请号：US509284
申请日：1995-07-31
申请人： Toshihiro Yonezawa , Tsuyoshi Argua , Kunihiro Furuya , Junichi Hagihara
发明人： Toshihiro Yonezawa , Tsuyoshi Argua , Kunihiro Furuya , Junichi Hagihara
IPC分类号： G01R31/28 , G01M19/00 , H02P1/42
CPC分类号： G01R31/2887 , Y10S414/141
摘要： There is provided an inspection apparatus comprises, a transportation unit for transporting the object of inspection to a position opposite to the contact portion, a sucking holder movable toward and away from the contact portion and adapted to hold the object of inspection by suction; and a pressure contact mechanism provided separately from the transportation unit and adapted to press the sucking holder, thereby pressing the object of inspection against the contact portion. Thus the tranportation mechanism is separated from the pressure contact mechanism, the transportation mechanism can be reduced in weight, and the pressure contact mechanism can ensure setting of appropriate pressing. The operation time can be shortened, moreover, since the object of inspection is kept attached to the contact portion by the transportation mechanism as it is pressed against the contact portion. There is provided a transportation apparatus in which objects of transportation or inspection can be stably attracted or released without the possibility of their being broken by static electricity and without being influenced by their attitude. There is provided a temperature control apparatus used in an inspection apparatus and capable of efficiently heating or cooling an object of inspection, further, wherein a carrier plate section can be used in common for objects of inspection of different descriptions.
摘要翻译：提供了一种检查装置，包括：用于将检查对象传送到与接触部相对的位置的传送单元，能够朝向和远离接触部分移动并适于通过抽吸来保持检查对象的吸持保持器; 以及压力接触机构，与所述输送单元分开设置并且适于按压所述吸持保持器，从而将所述检查对象压靠在所述接触部分上。因此，运送机构与压力接触机构分离，输送机构的重量可以减轻，压力接触机构可以确保适当的按压设定。此外，由于当按压被接触部分时检查对象被传送机构保持在接触部分上，所以可以缩短操作时间。提供了一种运输装置，其中可以稳定地吸引或释放运输或检查对象，而不会被静电破坏的可能性，而不受其姿态的影响。提供了一种在检查装置中使用并且能够有效地加热或冷却检查对象的温度控制装置，此外，其中可以共同使用承载板部分用于不同描述的检查对象。

8. 发明授权

US08167521B2 Substrate transfer apparatus and vertical heat processing apparatus 有权
标题翻译：基板转印装置和立式热处理装置
公开(公告)号：US08167521B2
公开(公告)日：2012-05-01
申请号：US12225920
申请日：2007-04-23
申请人： Ken Nakao , Hitoshi Kato , Junichi Hagihara
发明人： Ken Nakao , Hitoshi Kato , Junichi Hagihara
IPC分类号： H01L21/677
CPC分类号： H01L21/67098 , H01L21/6838 , H01L21/68707
摘要： The present invention restrains, during a transfer of a substrate, a central portion of the substrate from being warped by its own weight, which might be caused by a super-enlargement of a diameter of the substrate. A substrate transfer apparatus 18 includes: a support part 17 which is moved above a substrate w of a large diameter; and an upside grip mechanism 28 disposed on the support part 17, the upside grip mechanism 28 capable of supporting a peripheral portion of the substrate w from above. The support part 17 is provided with a non-contact sucking and holding part 30 having a suction hole 31 and a blow hole 32. The non-contact sucking and holding part 30 sucks and holds the substrate w in a non-contact manner, by blowing a gas onto the central portion of the upper surface of the substrate w and sucking the central portion to form an air layer 50 such that the central portion of the wafer w is not warped.
摘要翻译：本发明在衬底的转移期间抑制衬底的中心部分被自身的重量扭曲，这可能是由于衬底的直径的过度扩大引起的。基板转印装置18包括：支撑部17，其在大直径的基板w上方移动; 以及设置在支撑部17上的上侧夹持机构28，能够从上方支撑基板w的周边部的上侧夹持机构28。支撑部17设置有具有吸入孔31和气孔32的非接触式吸持保持部30.非接触吸引保持部30以非接触的方式吸附并保持基板w，通过将气体吹送到基板w的上表面的中心部分并吸附中心部分以形成空气层50，使得晶片w的中心部分不翘曲。

9. 发明申请

US20080185176A1 Wiring Board Member For Forming Multilayer Wiring Board, Method of Manufacturing the Same, and Multilayer Wiring Board 审中-公开
标题翻译：多层接线板，制造方法和多层接线板的接线董事会成员
公开(公告)号：US20080185176A1
公开(公告)日：2008-08-07
申请号：US10562923
申请日：2004-06-29
申请人： Junichi Hagihara
发明人： Junichi Hagihara
IPC分类号： H05K1/11 , H01B13/00 , H05K3/46
CPC分类号： H05K3/4617 , H05K3/007 , H05K3/20 , H05K3/4007 , H05K2201/0367 , H05K2201/09481 , H05K2203/016 , H05K2203/0733
摘要： A wiring board member for forming a multilayer wiring board includes an insulation layer (11) having a hole (11a) and a metal layer (12) as a conductive layer joined to the insulation layer. The metal layer (12) includes a via portion (12b) occupying the hold of the insulation layer, a bump portion (12a) integrally connected to the via portion, and a wiring part (12c). The bump portion is disposed on one surface of the insulation layer, and has a substantially truncated quadrangular pyramid shape with a bottom surface thereof being integrally connected to the via portion. The wiring part is disposed on the other surface of the insulation layer, and has a certain pattern.
摘要翻译：用于形成多层布线板的布线板部件包括具有连接到绝缘层的作为导电层的孔（11a）和金属层（12）的绝缘层（11）。金属层（12）包括占据绝缘层保持的通孔部分（12b），与通孔部分一体连接的凸起部分（12a）和布线部分（12c）。凸起部分设置在绝缘层的一个表面上，并且具有基本上截头的四边形棱锥形状，其底表面与通孔部分一体地连接。布线部分设置在绝缘层的另一个表面上，具有一定的图案。

10. 发明授权

US07242206B2 Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method 有权
标题翻译：可靠性评估试验装置，可靠性评价试验系统，接触器和可靠性评价试验方法
公开(公告)号：US07242206B2
公开(公告)日：2007-07-10
申请号：US11179538
申请日：2005-07-13
申请人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
发明人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
IPC分类号： G01R31/06 , G01R31/04 , G01R27/26
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要翻译：本发明的可靠性评价试验装置包括晶片存储部，其以形成在晶片上的多个器件的电极焊盘和接触器的凸块完全电接触的状态存储晶片。晶片存储部分向/从测量部分发送/接收测试信号，并具有密封和隔热结构。晶片存储部分具有压力接触器的压力机构和将与接触器完全接触的晶片直接加热到预定高温的加热机构。在加速条件下评估形成在半导体晶片上的互连膜和绝缘膜的可靠性。

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