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1. 发明申请

US20110216516A1 Semiconductor Module, Socket For The Same, And Semiconductor Module/Socket Assembly 有权
标题翻译：半导体模块，插座和半导体模块/插座组件
公开(公告)号：US20110216516A1
公开(公告)日：2011-09-08
申请号：US13006692
申请日：2011-01-14
申请人： Jung-hoon Kim , Seong-chan Han , Dong-chun Lee , Jae-hoon Choi , Sun-kyu Hwang
发明人： Jung-hoon Kim , Seong-chan Han , Dong-chun Lee , Jae-hoon Choi , Sun-kyu Hwang
IPC分类号： H05K7/00
CPC分类号： H05K7/00
摘要： A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.
摘要翻译：公开了半导体模块，用于其的插座和半导体模块/插座组件。半导体模块包括具有多个半导体器件，多个绝缘层和多个金属层的印刷电路板，多个绝缘层和多个金属层交替堆叠。金属层的露出部分在印刷电路板的第一和第二端处暴露于半导体模块的外部。第一端和第二端位于印刷电路板的相对端。

2. 发明申请

US20110168761A1 APPARATUS FOR REPAIRING SEMICONDUCTOR MODULE 审中-公开
标题翻译：修理半导体模块的装置
公开(公告)号：US20110168761A1
公开(公告)日：2011-07-14
申请号：US12987550
申请日：2011-01-10
申请人： Sun-kyu Hwang , Seong-chan Han , Kwang-ho Chun , Jung-hoon Kim , Dong-su Han
发明人： Sun-kyu Hwang , Seong-chan Han , Kwang-ho Chun , Jung-hoon Kim , Dong-su Han
IPC分类号： B23K1/018
CPC分类号： B23K1/018 , B23K1/0016 , B23K1/206 , B23K3/047 , B23K3/08 , B23K2101/42 , H01L24/75 , H01L24/799 , H01L2224/81
摘要： An apparatus for repairing a semiconductor module including: a heating block comprising a thermal contact surface for contacting a defective semiconductor package mounted on a substrate of the semiconductor module to heat the defective semiconductor package using a conduction method and to melt a solder of the defective semiconductor package, and a vacuum adsorption line for adsorbing the defective semiconductor package and separating the defective semiconductor package from the substrate; and a heater installed in the heating block.
摘要翻译：一种用于修复半导体模块的装置，包括：加热块，其包括热接触表面，用于接触安装在半导体模块的基板上的有缺陷的半导体封装，以使用导电方法加热缺陷半导体封装并熔化缺陷半导体的焊料封装，以及用于吸附有缺陷的半导体封装并将有缺陷的半导体封装与衬底分离的真空吸附线; 以及安装在加热块中的加热器。

3. 发明授权

US07902664B2 Semiconductor package having passive component and semiconductor memory module including the same 有权
标题翻译：具有无源元件的半导体封装和包括该元件的半导体存储器模块
公开(公告)号：US07902664B2
公开(公告)日：2011-03-08
申请号：US11878084
申请日：2007-07-20
申请人： Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Kyung-du Kim , Sun-kyu Hwang
发明人： Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Kyung-du Kim , Sun-kyu Hwang
IPC分类号： H01L23/34
CPC分类号： H01L23/13 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L24/45 , H01L24/48 , H01L25/105 , H01L25/16 , H01L2224/32225 , H01L2224/45139 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/12041 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H05K1/0231 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.
摘要翻译：示例实施例涉及半导体封装。半导体封装可以包括安装基板，安装到安装基板的半导体芯片，穿过其中并安装到安装基板的至少一个无源部件，以及覆盖安装基板，半导体芯片和至少一个无源部件。

4. 发明申请

US20080023812A1 Semiconductor package having passive component and semiconductor memory module including the same 有权
标题翻译：具有无源元件的半导体封装和包括该元件的半导体存储器模块
公开(公告)号：US20080023812A1
公开(公告)日：2008-01-31
申请号：US11878084
申请日：2007-07-20
申请人： Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Kyung-du Kim , Sun-kyu Hwang
发明人： Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Kyung-du Kim , Sun-kyu Hwang
IPC分类号： H01L23/488
CPC分类号： H01L23/13 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L24/45 , H01L24/48 , H01L25/105 , H01L25/16 , H01L2224/32225 , H01L2224/45139 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/12041 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H05K1/0231 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.
摘要翻译：示例实施例涉及半导体封装。半导体封装可以包括安装基板，安装到安装基板的半导体芯片，穿过其中并安装到安装基板的至少一个无源部件，以及覆盖安装基板，半导体芯片和至少一个无源部件。

5. 发明授权

US08218330B2 Reworkable passive element embedded printed circuit board 有权
标题翻译：可重构无源元件嵌入式印刷电路板
公开(公告)号：US08218330B2
公开(公告)日：2012-07-10
申请号：US11862521
申请日：2007-09-27
申请人： Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Jun-young Lee , Jung-hyeon Kim
发明人： Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Jun-young Lee , Jung-hyeon Kim
IPC分类号： H05K1/18
CPC分类号： H05K1/183 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/15153 , H01L2924/15165 , H01L2924/19106 , H05K1/0231 , H05K1/184 , H05K3/3442 , H05K2201/09981 , H05K2201/10015 , H05K2201/10022 , H05K2201/10515 , H05K2201/10545 , H05K2201/10636 , H05K2201/10734 , H05K2203/0242 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , H01L2224/0401
摘要： A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.
摘要翻译：一种可重复操作的无源元件嵌入式印刷电路板（PCB），其包括板构件，第一和第二填充物以及第一无源元件。板构件具有彼此间隔开的第一和第二通孔。第一和第二填充物分别埋在第一和第二通孔中，并由可回流的导电材料形成。第一无源元件包括第一和第二电极。第一插入槽形成在第一和第二通孔之间的板构件的表面的一部分中，以及第一和第二填充物的一部分。第一无源元件安装在第一插入槽上。第一电极包括底表面和接触第一填充物的一侧和暴露的上表面。第二电极包括底表面和接触第二填充物的一侧和暴露的上表面。

6. 发明申请

US20080079118A1 REWORKABLE PASSIVE ELEMENT EMBEDDED PRINTED CIRCUIT BOARD 有权
标题翻译：可拆卸被动元件嵌入式印刷电路板
公开(公告)号：US20080079118A1
公开(公告)日：2008-04-03
申请号：US11862521
申请日：2007-09-27
申请人： Hyo-jae BANG , Dong-chun Lee , Seong-chan Han , Jun-young Lee , Jung-hyeon Kim
发明人： Hyo-jae BANG , Dong-chun Lee , Seong-chan Han , Jun-young Lee , Jung-hyeon Kim
IPC分类号： H01L29/00 , H05K3/30
CPC分类号： H05K1/183 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/15153 , H01L2924/15165 , H01L2924/19106 , H05K1/0231 , H05K1/184 , H05K3/3442 , H05K2201/09981 , H05K2201/10015 , H05K2201/10022 , H05K2201/10515 , H05K2201/10545 , H05K2201/10636 , H05K2201/10734 , H05K2203/0242 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , H01L2224/0401
摘要： A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.
摘要翻译：一种可重复操作的无源元件嵌入式印刷电路板（PCB），其包括板构件，第一和第二填充物以及第一无源元件。板构件具有彼此间隔开的第一和第二通孔。第一和第二填充物分别埋在第一和第二通孔中，并由可回流的导电材料形成。第一无源元件包括第一和第二电极。第一插入槽形成在第一和第二通孔之间的板构件的表面的一部分中，以及第一和第二填充物的一部分。第一无源元件安装在第一插入槽上。第一电极包括底表面和接触第一填充物的一侧和暴露的上表面。第二电极包括底表面和接触第二填充物的一侧和暴露的上表面。

7. 发明申请

US20110170264A1 Semiconductor Module Socket Apparatus 有权
标题翻译：半导体模块插座设备
公开(公告)号：US20110170264A1
公开(公告)日：2011-07-14
申请号：US12987552
申请日：2011-01-10
申请人： Joo-han Lee , Jung-hoon Kim , Seong-chan Han
发明人： Joo-han Lee , Jung-hoon Kim , Seong-chan Han
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/183 , H05K7/1431
摘要： A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.
摘要翻译：一种半导体模块插座装置，包括形成有与半导体模块相对应的插座槽的插座主体; 插座销安装在插座主体的插座槽中，以电连接到半导体模块的模块销; 以及散热构件，其安装在插座主体中，以便外部辐射在半导体模块中产生的热量，然后从插座槽和插座销传送。根据半导体模块插座装置，可以防止半导体模块中产生的热量被传送到主板，从而提高散热效率，显着地节省安装空间，降低安装成本，并且实现半导体模块插座装置的无噪声和无振动。

8. 发明申请

US20080044951A1 Semiconductor package and method of manufacturing the same 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20080044951A1
公开(公告)日：2008-02-21
申请号：US11812145
申请日：2007-06-15
申请人： Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Chang-yong Park , Hun Han
发明人： Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Chang-yong Park , Hun Han
IPC分类号： H01L23/52 , H01L21/00
CPC分类号： H01L21/563 , H01L24/10 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package may include a substrate having external contact terminals. A semiconductor chip having bonding pads may be formed on the substrate. Conductive bumps may connect the external contact terminals of the substrate to the bonding pads of the semiconductor chip. An underfill may be interposed between the substrate and the semiconductor chip. The underfill may include a first underfill region composed of a first material adjacent to the semiconductor chip and a second underfill region composed of a second material adjacent to the substrate, the first material having a higher glass transition temperature than the second material.
摘要翻译：半导体封装可以包括具有外部接触端子的衬底。具有接合焊盘的半导体芯片可以形成在基板上。导电凸块可以将衬底的外部接触端子连接到半导体芯片的接合焊盘。可以在基板和半导体芯片之间插入底部填充物。底部填充物可以包括由与半导体芯片相邻的第一材料组成的第一底部填充区域和由与基底相邻的第二材料构成的第二底部填充区域，第一材料具有比第二材料更高的玻璃化转变温度。

9. 发明授权

US08053889B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US08053889B2
公开(公告)日：2011-11-08
申请号：US12457522
申请日：2009-06-15
申请人： Seong-chan Han , Dong-woo Shin , Hyun-jong Oh , Nam-yong Oh
发明人： Seong-chan Han , Dong-woo Shin , Hyun-jong Oh , Nam-yong Oh
IPC分类号： H01L23/34 , H05K7/10
CPC分类号： H05K1/0271 , H01L2924/0002 , H05K1/144 , H05K1/181 , H05K2201/0133 , H05K2201/10159 , H05K2201/10265 , H05K2201/10734 , H01L2924/00
摘要： A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exposed surfaces of the substrate and the at least one semiconductor package. In accordance with example embodiments, the module body may also include a heat transfer member on the at least one semiconductor package and an exposed surface of the module body may include an exposed surface of the heat transfer member.
摘要翻译：提供了一种半导体模块，其包括在模块主体的暴露表面上的模块体和减震构件。模块体可以包括在衬底上的至少一个半导体封装，并且模块体的暴露表面可以包括衬底和至少一个半导体封装的暴露表面。根据示例实施例，模块主体还可以在至少一个半导体封装上包括传热构件，并且模块主体的暴露表面可以包括传热构件的暴露表面。

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