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1. 发明申请

US20130122610A1 Apparatus and Method for Die Bonding 审中-公开
标题翻译： Die Bonding的装置和方法
公开(公告)号：US20130122610A1
公开(公告)日：2013-05-16
申请号：US13460901
申请日：2012-05-01
申请人： Jun-Wei Chung , Wei-Cheng Lou , Jung-Kun Wu , Chung-I Chiang
发明人： Jun-Wei Chung , Wei-Cheng Lou , Jung-Kun Wu , Chung-I Chiang
IPC分类号： H01L21/66 , B32B41/00 , B32B38/18
CPC分类号： H01L24/97 , H01L21/6838 , H01L24/75 , H01L33/0095 , H01L2224/75745 , H01L2224/75753 , H01L2224/75842 , H01L2224/7598 , H01L2224/97 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , Y10T156/1702 , H01L2924/00
摘要： A die bonding apparatus and a die bonding method are provided, which are capable of simultaneously bonding a plurality of dies from a first placement area onto a substrate disposed on a second placement area. The die bonding apparatus includes a die sucking device which is movably located above the first placement area and a second placement area. The die sucking device includes a plurality of nozzles. The nozzles can suck the dies disposed on the first placement area, and then simultaneously bond the dies onto the substrate.
摘要翻译：提供了一种芯片接合装置和芯片接合方法，其能够将多个模具从第一放置区域同时接合到布置在第二放置区域上的基板上。芯片接合装置包括可移动地位于第一放置区域上方的模具吸附装置和第二放置区域。模具吸引装置包括多个喷嘴。喷嘴可以吸附设置在第一放置区域上的模具，然后同时将模具结合到基板上。

2. 发明申请

US20120318850A1 CHIP BONDING APPARATUS 审中-公开
标题翻译：芯片连接装置
公开(公告)号：US20120318850A1
公开(公告)日：2012-12-20
申请号：US13280477
申请日：2011-10-25
申请人： Wei-Cheng LOU , Ming-Tang Chen , Ting-Yu Chou , Jung-Kun Wu , Chung-I Chiang
发明人： Wei-Cheng LOU , Ming-Tang Chen , Ting-Yu Chou , Jung-Kun Wu , Chung-I Chiang
IPC分类号： B23K37/04
CPC分类号： H01L24/75 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/97 , H01L2224/29144 , H01L2224/75102 , H01L2224/75272 , H01L2224/7565 , H01L2224/7598 , H01L2224/8121 , H01L2224/83075 , H01L2224/83192 , H01L2224/97 , H01L2924/01006 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/15311 , H01L2924/15788 , H01L2224/83 , H01L2924/0105 , H01L2924/00014 , H01L2924/00
摘要： A chip bonding apparatus includes a chamber, a chip transportation device, a heating device and a ventilation device. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The heating device is used for providing heat to the at least one chip and/or the carrier within the chamber. The ventilation device communicates gas to flow through the chamber to form a negative pressure environment therein. The negative pressure environment is provided when the chip transportation device transfers at least one chip onto the carrier within the chamber, and a positive pressure is applied onto the at least one chip when the heating device provides heat to the at least one chip and/or the carrier.
摘要翻译：芯片接合装置包括室，芯片输送装置，加热装置和通风装置。芯片运输装置用于将至少一个芯片转移到腔室内的载体上。芯片运输装置用于将至少一个芯片转移到腔室内的载体上。加热装置用于向室内的至少一个芯片和/或载体提供热量。通风装置使气体流过腔室以在其中形成负压环境。当芯片输送装置将至少一个芯片转移到室内的载体上时，提供负压环境，并且当加热装置向至少一个芯片提供热量时，并且在至少一个芯片上施加正压力，和/或承运人

3. 发明授权

US08643273B2 Light emitting diode device having pillars disposed such that light efficiency of the device is improved 失效
标题翻译：发光二极管装置具有设置成提高装置的光效率的支柱
公开(公告)号：US08643273B2
公开(公告)日：2014-02-04
申请号：US13562024
申请日：2012-07-30
申请人： Chung-I Chiang , Chuan-Fa Lin , Ching-Huan Liao
发明人： Chung-I Chiang , Chuan-Fa Lin , Ching-Huan Liao
IPC分类号： H05B33/12
CPC分类号： H01L33/52 , H01L33/46 , H01L33/507 , H01L33/58 , H01L2933/0083
摘要： A light emitting diode device is provided. The light emitting diode device comprises a light emitting diode element, an encapsulation layer, and a plurality of pillars. The encapsulation layer is disposed on the light emitting diode element, and the pillars are disposed on the encapsulation layer. The pillars are formed by a light transmissible material.
摘要翻译：提供一种发光二极管装置。发光二极管装置包括发光二极管元件，封装层和多个支柱。封装层设置在发光二极管元件上，并且支柱设置在封装层上。支柱由透光材料形成。

4. 发明申请

US20110080108A1 Color tunable light emitting diode 审中-公开
标题翻译：彩色可调光发光二极管
公开(公告)号：US20110080108A1
公开(公告)日：2011-04-07
申请号：US12588131
申请日：2009-10-06
申请人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
发明人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
IPC分类号： H05B37/02
CPC分类号： H05B33/086
摘要： A color tunable light emitting diode is disclosed in the present invention. At least two light emitting chip groups each has a number of light emitting chips mixed with at least one phosphor to produce light with a specific correlated color temperature. By supplying tunable currents to the light emitting chip groups, properly arranging the light emitting chips and providing a suitable substrate, the color tunable light emitting diode can be achieved. The present invention provides a simple and workable method to manufacture tunable light emitting diodes which fulfill the requirement of compact design of modern electronic products.
摘要翻译：在本发明中公开了一种颜色可调谐发光二极管。至少两个发光芯片组各自具有与至少一个磷光体混合的多个发光芯片，以产生具有特定相关色温的光。通过向发光芯片组提供可调谐电流，适当地布置发光芯片并提供合适的基板，可以实现颜色可调谐发光二极管。本发明提供了一种简单且可行的制造可调谐发光二极管的方法，其可满足现代电子产品紧凑设计的要求。

5. 发明授权

US07120317B1 Method and system for a programmable image transformation 有权
标题翻译：可编程图像变换的方法和系统
公开(公告)号：US07120317B1
公开(公告)日：2006-10-10
申请号：US09798616
申请日：2001-03-01
申请人： Terry Wu , Chung-I Chiang
发明人： Terry Wu , Chung-I Chiang
IPC分类号： G06K9/32
CPC分类号： G06T3/606
摘要： A method and system for a programmable image transformation is disclosed. In one embodiment of the present invention, a method for transforming an image comprises rotating an image by a predetermined angle. The image is copied from a first memory location associated with a first location of a display device to a second memory location associated with a second location of a display device.
摘要翻译：公开了一种用于可编程图像变换的方法和系统。在本发明的一个实施例中，用于变换图像的方法包括以预定角度旋转图像。将图像从与显示设备的第一位置相关联的第一存储位置复制到与显示设备的第二位置相关联的第二存储器位置。

6. 发明授权

US6073355A Method for inclination measurement using piezoelectric effect 失效
标题翻译：使用压电效应的倾斜测量方法
公开(公告)号：US6073355A
公开(公告)日：2000-06-13
申请号：US291532
申请日：1999-04-14
申请人： Chung-I Chiang , Chih-Wen Hsieh , Long-Jang Hu , Ming-Shing Jou , Shun-Lih Tu , Horng Chang
发明人： Chung-I Chiang , Chih-Wen Hsieh , Long-Jang Hu , Ming-Shing Jou , Shun-Lih Tu , Horng Chang
IPC分类号： G01C9/06
CPC分类号： G01C9/06
摘要： A method using piezoelectric effect is provided for measuring an angle between a reference plane and a plane to be measured. The method can be used to measure the inclination of a plane or for leveling purpose. The method employs an apparatus wherein the main characteristics of the apparatus are simple in structure with no limitation in the measurement range and fewer limitations to the environment. The method may also have the following advantages compact, quick and accurate measurement, easy for multiaxial measurement.
摘要翻译：提供了一种使用压电效应的方法来测量参考平面和待测平面之间的角度。该方法可用于测量平面的倾斜度或用于调平目的。该方法采用一种装置，其中装置的主要特征结构简单，测量范围无限制，对环境的限制较少。该方法还可以具有以下优点：紧凑，快速，准确的测量，便于多轴测量。

7. 发明申请

US20110163679A1 AC LIGHT EMITTING DIODE DEVICE HAVING INTEGRATED PASSIVE DEVICE 审中-公开
标题翻译：具有集成无源器件的交流发光二极管器件
公开(公告)号：US20110163679A1
公开(公告)日：2011-07-07
申请号：US12683490
申请日：2010-01-07
申请人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
发明人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
IPC分类号： H05B37/02
CPC分类号： H05B33/0809 , Y02B20/341 , Y02B20/342 , Y02B20/348
摘要： A light emitting diode device is disclosed in the present invention. The device includes a substrate, an integrated passive device, at least four rectifying diodes and several light emitting diodes. The rectifying diodes form a bridge rectifier to rectify an external alternating current (AC) inputted into a direct current so that the light emitting diodes can lighten. Furthermore, the light emitting diode device has a Zener diode, formed on the substrate and connected with the integrated passive device for regulating the direct current. It can also have a varistor, connected with the Zener diode in parallel, for protecting the light emitting diode device from surges.
摘要翻译：在本发明中公开了一种发光二极管器件。该器件包括衬底，集成无源器件，至少四个整流二极管和几个发光二极管。整流二极管形成桥式整流器，以对输入到直流电流的外部交流电（AC）进行整流，使得发光二极管可以减轻。此外，发光二极管器件具有形成在衬底上的齐纳二极管，并与用于调节直流电的集成无源器件连接。它还可以具有与齐纳二极管并联连接的变阻器，用于保护发光二极管器件免受浪涌。

8. 发明申请

US20060108518A1 Structure for calibrating packaging of electric micro-optic modules 审中-公开
标题翻译：用于校准电子微型光模块封装的结构
公开(公告)号：US20060108518A1
公开(公告)日：2006-05-25
申请号：US10989182
申请日：2004-11-15
申请人： James Lee , Chung-I Chiang
发明人： James Lee , Chung-I Chiang
IPC分类号： H01J3/14 , H01J5/16 , H01J5/02 , H01J40/14
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L31/0232 , H01L2924/0002 , H04N5/2254 , H01L2924/00
摘要： The present invention relates to a structure for calibrating the alignment between a lens set and an image sensor in the process of packaging such as an electric micro-optic module (EMOM) or compact camera module (CCM) by using a matching structure like sawteeth or V-grooves at contact surfaces or edges. Random variations due to manufacturing process can be averaged out by a plurality of the V-grooves and high precision can be obtained by the present invention.
摘要翻译：本发明涉及一种用于在诸如电动微光模块（EMOM）或小型照相机模块（CCM）的包装过程中校准透镜组和图像传感器之间的对准的结构，所述匹配结构如锯齿或接触面或边缘处的V形槽。可以通过多个V形槽平均化由制造工艺引起的随机变化，并且通过本发明可以获得高精度。

9. 发明申请

US20060103757A1 Iris apparatus and operating method thereof 审中-公开
标题翻译：虹膜装置及其操作方法
公开(公告)号：US20060103757A1
公开(公告)日：2006-05-18
申请号：US10989157
申请日：2004-11-15
申请人： James Lee , Chung-I Chiang
发明人： James Lee , Chung-I Chiang
IPC分类号： H04N5/235
CPC分类号： H04N5/2254 , G03B9/04 , H04N5/2253
摘要： The present invention discloses an iris apparatus and an operation method thereof, which iris apparatus can be used in an electrical micro-optic module or compact camera module. The iris apparatus is composed of a shifting board comprising one or at least two apertures thereon. By moving the shifting board, a required aperture can be transported to correct location so as to pass through or filter a path of light.
摘要翻译：本发明公开了一种虹膜装置及其操作方法，该虹膜装置可用于电微型光学模块或小型照相机模块。虹膜装置由在其上包括一个或至少两个孔的移位板组成。通过移动换档板，可以将所需的孔径运送到正确的位置，以便通过或过滤光路。

10. 发明授权

US06823761B2 Device for stripping coated optical fiber ribbons 失效
公开(公告)号：US06823761B2
公开(公告)日：2004-11-30
申请号：US10418163
申请日：2003-04-18
申请人： Chung-I Chiang , Ming-Jen Wang , Kun-Hsien Cheng , Hong-Jueng King , Huei-Pin Huang , Chwei-Jing Yeh
发明人： Chung-I Chiang , Ming-Jen Wang , Kun-Hsien Cheng , Hong-Jueng King , Huei-Pin Huang , Chwei-Jing Yeh
IPC分类号： H02G112
CPC分类号： G02B6/245
摘要： A device for stripping coated optical fiber ribbons, in cooperation with at least an optical fiber ribbon having a protective coating and an optical fiber array substrate having grooves, comprises a heating unit including at least a first trench and a cutting blade for gripping a first portion of the optical fiber ribbon having protective coatings and for heating; a stripping unit having at least a second trench, adjacent to and connected to the first trench, for gripping a second portion of the optical fiber ribbon having the protective coating; a fiber array seat for receiving an optical fiber array substrate; and a linear guiding unit for limitedly guiding the direction of the separation movement between the heating unit and the stripping unit.

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