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1. 发明申请

US20110080108A1 Color tunable light emitting diode 审中-公开
标题翻译：彩色可调光发光二极管
公开(公告)号：US20110080108A1
公开(公告)日：2011-04-07
申请号：US12588131
申请日：2009-10-06
申请人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
发明人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
IPC分类号： H05B37/02
CPC分类号： H05B33/086
摘要： A color tunable light emitting diode is disclosed in the present invention. At least two light emitting chip groups each has a number of light emitting chips mixed with at least one phosphor to produce light with a specific correlated color temperature. By supplying tunable currents to the light emitting chip groups, properly arranging the light emitting chips and providing a suitable substrate, the color tunable light emitting diode can be achieved. The present invention provides a simple and workable method to manufacture tunable light emitting diodes which fulfill the requirement of compact design of modern electronic products.
摘要翻译：在本发明中公开了一种颜色可调谐发光二极管。至少两个发光芯片组各自具有与至少一个磷光体混合的多个发光芯片，以产生具有特定相关色温的光。通过向发光芯片组提供可调谐电流，适当地布置发光芯片并提供合适的基板，可以实现颜色可调谐发光二极管。本发明提供了一种简单且可行的制造可调谐发光二极管的方法，其可满足现代电子产品紧凑设计的要求。

2. 发明申请

US20110163679A1 AC LIGHT EMITTING DIODE DEVICE HAVING INTEGRATED PASSIVE DEVICE 审中-公开
标题翻译：具有集成无源器件的交流发光二极管器件
公开(公告)号：US20110163679A1
公开(公告)日：2011-07-07
申请号：US12683490
申请日：2010-01-07
申请人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
发明人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
IPC分类号： H05B37/02
CPC分类号： H05B33/0809 , Y02B20/341 , Y02B20/342 , Y02B20/348
摘要： A light emitting diode device is disclosed in the present invention. The device includes a substrate, an integrated passive device, at least four rectifying diodes and several light emitting diodes. The rectifying diodes form a bridge rectifier to rectify an external alternating current (AC) inputted into a direct current so that the light emitting diodes can lighten. Furthermore, the light emitting diode device has a Zener diode, formed on the substrate and connected with the integrated passive device for regulating the direct current. It can also have a varistor, connected with the Zener diode in parallel, for protecting the light emitting diode device from surges.
摘要翻译：在本发明中公开了一种发光二极管器件。该器件包括衬底，集成无源器件，至少四个整流二极管和几个发光二极管。整流二极管形成桥式整流器，以对输入到直流电流的外部交流电（AC）进行整流，使得发光二极管可以减轻。此外，发光二极管器件具有形成在衬底上的齐纳二极管，并与用于调节直流电的集成无源器件连接。它还可以具有与齐纳二极管并联连接的变阻器，用于保护发光二极管器件免受浪涌。

3. 发明申请

US20110068356A1 Method of manufacturing light emitting diode packaging lens and light emmiting diode package 失效
标题翻译：制造发光二极管封装透镜和发光二极管封装的方法
公开(公告)号：US20110068356A1
公开(公告)日：2011-03-24
申请号：US12585642
申请日：2009-09-21
申请人： Chung-I Chiang , Tsan Lu , Hung-Yi Lin , Hsien-Lung Ho
发明人： Chung-I Chiang , Tsan Lu , Hung-Yi Lin , Hsien-Lung Ho
IPC分类号： H01L33/00 , H01L21/56
CPC分类号： C23C28/00 , C23C28/04 , C23C28/322 , C23C28/345 , H01L33/507 , H01L33/508 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/8592 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.
摘要翻译：在本发明中公开了使用该方法制造发光二极管封装透镜和封装的方法。通过使用电泳沉积，将一层或多层磷光体涂覆到具有弯曲部分的杯的一个表面上。该杯子用于包装镜头。荧光体层的厚度可以被控制，荧光体颗粒的分布是均匀的。因此，具有透镜的发光二极管封装可以是均匀的光源。

4. 发明授权

US08455910B2 Method of manufacturing light emitting diode packaging lens and light emitting diode package 失效
标题翻译：制造发光二极管封装透镜和发光二极管封装的方法
公开(公告)号：US08455910B2
公开(公告)日：2013-06-04
申请号：US12585642
申请日：2009-09-21
申请人： Chung-I Chiang , Tsan Lu , Hung-Yi Lin , Hsien-Lung Ho
发明人： Chung-I Chiang , Tsan Lu , Hung-Yi Lin , Hsien-Lung Ho
IPC分类号： H01L33/00
CPC分类号： C23C28/00 , C23C28/04 , C23C28/322 , C23C28/345 , H01L33/507 , H01L33/508 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/8592 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.
摘要翻译：在本发明中公开了使用该方法制造发光二极管封装透镜和封装的方法。通过使用电泳沉积，将一层或多层磷光体涂覆到具有弯曲部分的杯的一个表面上。该杯子用于包装镜头。荧光体层的厚度可以被控制，荧光体颗粒的分布是均匀的。因此，具有透镜的发光二极管封装可以是均匀的光源。

5. 发明申请

US20110164223A1 MICROMINIATURIZED PROJECTION MODULE FOR PROJECTING IMAGE ONTO OBJECT 失效
标题翻译：用于投影图像到对象的微型投影模块
公开(公告)号：US20110164223A1
公开(公告)日：2011-07-07
申请号：US12652801
申请日：2010-01-06
申请人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
发明人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
IPC分类号： G03B21/28
CPC分类号： G03B37/04 , G03B21/005 , H04N9/3129 , H04N9/3147
摘要： A microminiaturized projection module for projecting an image onto an object is disclosed in the present invention. The module includes a number of light units each for providing red, green, and blue beams; an image processing unit for receiving the image, dividing the image into n×m image signals, and transforming each of the image signals into a modulating signal and a direction signal, where n and in are integrals not less than 2, respectively; a number of modulation units for modulating the beams from one light unit according to the modulating signal received from the image processing unit and sending out the modulated beams simultaneously; and an array of n×m mirrors for projecting the modulated beams to form the image onto the object according to the direction signal received from the image processing unit. The invention has advantages that can reduce modulation speed, undergo slight shock and be free from raster pinch effect.
摘要翻译：在本发明中公开了一种用于将图像投影到物体上的微型投影模块。该模块包括多个用于提供红色，绿色和蓝色光束的光单元; 图像处理单元，用于接收图像，将图像划分成n×m个图像信号，并将每个图像信号变换成分别为n和in的调制信号和方向信号，其中n和in分别为不小于2的积分; 多个调制单元，用于根据从图像处理单元接收的调制信号调制来自一个光单元的波束，并同时发出调制波束; 以及n×m个反射镜的阵列，用于根据从图像处理单元接收的方向信号投影调制的光束以将图像形成到对象上。本发明具有可以降低调制速度，经受轻微冲击并且不受光栅夹紧效应的优点。

6. 发明授权

US08217329B2 Microminiaturized projection module having an image processing unit for transforming each of image signals into a modulating signal and a direction signal for projecting image onto object 失效
标题翻译：微型投影模块具有图像处理单元，用于将每个图像信号变换成调制信号和用于将图像投影到对象上的方向信号
公开(公告)号：US08217329B2
公开(公告)日：2012-07-10
申请号：US12652801
申请日：2010-01-06
申请人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
发明人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
IPC分类号： H01L27/00
CPC分类号： G03B37/04 , G03B21/005 , H04N9/3129 , H04N9/3147
摘要： A microminiaturized projection module for projecting an image onto an object is disclosed in the present invention. The module includes a number of light units each for providing red, green, and blue beams; an image processing unit for receiving the image, dividing the image into n×m image signals, and transforming each of the image signals into a modulating signal and a direction signal, where n and in are integrals not less than 2, respectively; a number of modulation units for modulating the beams from one light unit according to the modulating signal received from the image processing unit and sending out the modulated beams simultaneously; and an array of n×m mirrors for projecting the modulated beams to form the image onto the object according to the direction signal received from the image processing unit. The invention has advantages that can reduce modulation speed, undergo slight shock and be free from raster pinch effect.
摘要翻译：在本发明中公开了一种用于将图像投影到物体上的微型投影模块。该模块包括多个用于提供红色，绿色和蓝色光束的光单元; 图像处理单元，用于接收图像，将图像划分成n×m个图像信号，并将每个图像信号变换成分别为n和in的调制信号和方向信号，其中n和in分别为不小于2的积分; 多个调制单元，用于根据从图像处理单元接收的调制信号调制来自一个光单元的波束，并同时发出调制波束; 以及n×m个反射镜的阵列，用于根据从图像处理单元接收的方向信号投影调制的光束以将图像形成到对象上。本发明具有可以降低调制速度，经受轻微冲击并且不受光栅夹紧效应的优点。

7. 发明授权

US08643273B2 Light emitting diode device having pillars disposed such that light efficiency of the device is improved 失效
标题翻译：发光二极管装置具有设置成提高装置的光效率的支柱
公开(公告)号：US08643273B2
公开(公告)日：2014-02-04
申请号：US13562024
申请日：2012-07-30
申请人： Chung-I Chiang , Chuan-Fa Lin , Ching-Huan Liao
发明人： Chung-I Chiang , Chuan-Fa Lin , Ching-Huan Liao
IPC分类号： H05B33/12
CPC分类号： H01L33/52 , H01L33/46 , H01L33/507 , H01L33/58 , H01L2933/0083
摘要： A light emitting diode device is provided. The light emitting diode device comprises a light emitting diode element, an encapsulation layer, and a plurality of pillars. The encapsulation layer is disposed on the light emitting diode element, and the pillars are disposed on the encapsulation layer. The pillars are formed by a light transmissible material.
摘要翻译：提供一种发光二极管装置。发光二极管装置包括发光二极管元件，封装层和多个支柱。封装层设置在发光二极管元件上，并且支柱设置在封装层上。支柱由透光材料形成。

8. 发明授权

US07120317B1 Method and system for a programmable image transformation 有权
标题翻译：可编程图像变换的方法和系统
公开(公告)号：US07120317B1
公开(公告)日：2006-10-10
申请号：US09798616
申请日：2001-03-01
申请人： Terry Wu , Chung-I Chiang
发明人： Terry Wu , Chung-I Chiang
IPC分类号： G06K9/32
CPC分类号： G06T3/606
摘要： A method and system for a programmable image transformation is disclosed. In one embodiment of the present invention, a method for transforming an image comprises rotating an image by a predetermined angle. The image is copied from a first memory location associated with a first location of a display device to a second memory location associated with a second location of a display device.
摘要翻译：公开了一种用于可编程图像变换的方法和系统。在本发明的一个实施例中，用于变换图像的方法包括以预定角度旋转图像。将图像从与显示设备的第一位置相关联的第一存储位置复制到与显示设备的第二位置相关联的第二存储器位置。

9. 发明授权

US6073355A Method for inclination measurement using piezoelectric effect 失效
标题翻译：使用压电效应的倾斜测量方法
公开(公告)号：US6073355A
公开(公告)日：2000-06-13
申请号：US291532
申请日：1999-04-14
申请人： Chung-I Chiang , Chih-Wen Hsieh , Long-Jang Hu , Ming-Shing Jou , Shun-Lih Tu , Horng Chang
发明人： Chung-I Chiang , Chih-Wen Hsieh , Long-Jang Hu , Ming-Shing Jou , Shun-Lih Tu , Horng Chang
IPC分类号： G01C9/06
CPC分类号： G01C9/06
摘要： A method using piezoelectric effect is provided for measuring an angle between a reference plane and a plane to be measured. The method can be used to measure the inclination of a plane or for leveling purpose. The method employs an apparatus wherein the main characteristics of the apparatus are simple in structure with no limitation in the measurement range and fewer limitations to the environment. The method may also have the following advantages compact, quick and accurate measurement, easy for multiaxial measurement.
摘要翻译：提供了一种使用压电效应的方法来测量参考平面和待测平面之间的角度。该方法可用于测量平面的倾斜度或用于调平目的。该方法采用一种装置，其中装置的主要特征结构简单，测量范围无限制，对环境的限制较少。该方法还可以具有以下优点：紧凑，快速，准确的测量，便于多轴测量。

10. 发明申请

US20120318850A1 CHIP BONDING APPARATUS 审中-公开
标题翻译：芯片连接装置
公开(公告)号：US20120318850A1
公开(公告)日：2012-12-20
申请号：US13280477
申请日：2011-10-25
申请人： Wei-Cheng LOU , Ming-Tang Chen , Ting-Yu Chou , Jung-Kun Wu , Chung-I Chiang
发明人： Wei-Cheng LOU , Ming-Tang Chen , Ting-Yu Chou , Jung-Kun Wu , Chung-I Chiang
IPC分类号： B23K37/04
CPC分类号： H01L24/75 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/97 , H01L2224/29144 , H01L2224/75102 , H01L2224/75272 , H01L2224/7565 , H01L2224/7598 , H01L2224/8121 , H01L2224/83075 , H01L2224/83192 , H01L2224/97 , H01L2924/01006 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/15311 , H01L2924/15788 , H01L2224/83 , H01L2924/0105 , H01L2924/00014 , H01L2924/00
摘要： A chip bonding apparatus includes a chamber, a chip transportation device, a heating device and a ventilation device. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The heating device is used for providing heat to the at least one chip and/or the carrier within the chamber. The ventilation device communicates gas to flow through the chamber to form a negative pressure environment therein. The negative pressure environment is provided when the chip transportation device transfers at least one chip onto the carrier within the chamber, and a positive pressure is applied onto the at least one chip when the heating device provides heat to the at least one chip and/or the carrier.
摘要翻译：芯片接合装置包括室，芯片输送装置，加热装置和通风装置。芯片运输装置用于将至少一个芯片转移到腔室内的载体上。芯片运输装置用于将至少一个芯片转移到腔室内的载体上。加热装置用于向室内的至少一个芯片和/或载体提供热量。通风装置使气体流过腔室以在其中形成负压环境。当芯片输送装置将至少一个芯片转移到室内的载体上时，提供负压环境，并且当加热装置向至少一个芯片提供热量时，并且在至少一个芯片上施加正压力，和/或承运人

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