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    • 2. 发明授权
    • Process for manufacture of micro electromechanical devices having high electrical isolation
    • 具有高电绝缘性的微机电装置的制造方法
    • US06617657B1
    • 2003-09-09
    • US09710326
    • 2000-11-09
    • Jun J. YaoRobert J. Anderson
    • Jun J. YaoRobert J. Anderson
    • H01L2982
    • B81C1/00484B81B2203/0118B81C2201/0108B81C2201/014B81C2201/019
    • The present invention relates to a fabrication process relating to a fabrication process for manufacture of micro-electromechanical (MEM) devices such as cantilever supported beams. This fabrication process requires only two lithographic masking steps and offers moveable electromechanical devices with high electrical isolation. A preferred embodiment of the process uses electrically insulating glass substrate as the carrier substrate and single crystal silicon as the MEM component material. The process further includes deposition of an optional layer of insulating material such as silicon dioxide on top of a layer of doped silicon grown on a silicon substrate. The silicon dioxide is epoxy bonded to the glass substrate to create a silicon-silicon dioxide-epoxy-glass structure. The silicon is patterned using anisotropic plasma dry etching techniques. A second patterning then follows to pattern the silicon dioxide layer and an oxygen plasma etch is performed to undercut the epoxy film and to release the silicon MEM component. This two-mask process provides single crystal silicon MEMs with electrically isolated MEM component. Retaining silicon dioxide insulating material in selected areas mechanically supports the MEM component.
    • 本发明涉及涉及用于制造诸如悬臂支撑梁的微机电(MEM)装置的制造工艺的制造工艺。 该制造工艺仅需要两个光刻掩模步骤,并提供具有高电绝缘性的可移动机电装置。 该方法的优选实施方案使用电绝缘玻璃基材作为载体基材,将单晶硅用作MEM组分材料。 该方法还包括在硅衬底上生长的掺杂硅层上沉积绝缘材料如二氧化硅的任选层。 二氧化硅是环氧键合到玻璃基底上以产生硅 - 二氧化硅 - 环氧玻璃结构。 使用各向异性等离子体干蚀刻技术将硅图案化。 然后进行第二图案化以对二氧化硅层进行图案化,并且执行氧等离子体蚀刻以切割环氧树脂膜并释放硅MEM组分。 该双掩模工艺提供具有电隔离的MEM组分的单晶硅MEM。 在选定区域保持二氧化硅绝缘材料机械地支撑MEM部件。
    • 7. 发明授权
    • Micro electromechanical isolator
    • 微机电隔离器
    • US06417743B1
    • 2002-07-09
    • US09400125
    • 1999-09-21
    • Robert E. MihailovichJun J. Yao
    • Robert E. MihailovichJun J. Yao
    • H03H900
    • H03H9/462
    • The present invention relates to a micro electromechanical (MEM) isolator in which an input signal induces an output signal by means of electrically insulating mechanical motion. The MEM isolator device comprises a dielectric moveable platform suspended above a substrate by flexible beams. A drive and a control capacitor each have one electrode supported by the platform and one electrode supported by the substrate. Coupling between electrical and mechanical energies is achieved by providing an input signal to the drive capacitor to induce platform motion. When the input signal is fed to the drive capacitor, it actuates electrostatic motion of the platform resulting in a change in the value of the control capacitance. The change in the control capacitance is converted via a simple electronics circuit into an output that mirrors the input but is electrically isolated therefrom. The advantages of such a device include simple electrical isolation provided by the dielectric platform, built in signal-debounce inherent to the structure mechanics, and economical integration with silicon integrated circuits.
    • 本发明涉及一种微机电(MEM)隔离器,其中输入信号通过电绝缘的机械运动来感应输出信号。 MEM隔离器装置包括通过柔性梁悬挂在衬底上的介电可移动平台。 驱动器和控制电容器各自具有由平台支撑的一个电极和由基板支撑的一个电极。 通过向驱动电容器提供输入信号以引起平台运动来实现电和机械能之间的耦合。 当输入信号被馈送到驱动电容器时,它致动平台的静电运动,导致控制电容值的变化。 控制电容的变化通过简单的电子电路转换成反映输入的输出,但与之电隔离。 这种器件的优点包括由介电平台提供的简单的电隔离,内置于结构力学固有的信号去抖动,以及与硅集成电路的经济集成。
    • 10. 发明授权
    • Micro electromechanical RF switch
    • 微机电RF开关
    • US5578976A
    • 1996-11-26
    • US493445
    • 1995-06-22
    • Jun J. Yao
    • Jun J. Yao
    • H01H1/20H01H59/00H01P1/10H01H57/00
    • H01H59/0009H01H1/20
    • A micro electromechanical RF switch is fabricated on a substrate using a suspended microbeam as a cantilevered actuator arm. From an anchor structure, the cantilever arm extends over a ground line and a gapped signal line that comprise microstrips on the substrate. A metal contact formed on the bottom of the cantilever arm remote from the anchor is positioned facing the signal line gap. An electrode atop the cantilever arm forms a capacitor structure above the ground line. The capacitor structure may include a grid of holes extending through the top electrode and cantilever arm to reduce structural mass and the squeeze damping effect during switch actuation. The switch is actuated by application of a voltage on the top electrode, which causes electrostatic forces to attract the capacitor structure toward the ground line so that the metal contact closes the gap in the signal line. The switch functions from DC to at least 4 GHz with an electrical isolation of -50 dB and an insertion loss of 0.1 dB at 4 GHz. A low temperature fabrication process allows the switch to be monolithically integrated with microwave and millimeter wave integrated circuits (MMICs). The RF switch has applications in telecommunications, including signal routing for microwave and millimeter wave IC designs, MEMS impedance matching networks, and band-switched tunable filters for frequency-agile communications.
    • 使用悬臂微束作为悬臂式致动器臂,在基板上制造微机电RF开关。 从锚结构中,悬臂在地线和覆盖信号线上延伸,该信号线在衬底上包括微带。 形成在远离锚固件的悬臂的底部上的金属接触件被定位成面对信号线间隙。 悬臂上方的电极在地线上方形成电容器结构。 电容器结构可以包括延伸穿过顶部电极和悬臂的孔格栅,以减少开关致动期间的结构质量和挤压阻尼效应。 通过在顶部电极上施加电压来致动开关,这导致静电力将电容器结构吸引到接地线,使得金属触点闭合信号线中的间隙。 该开关从DC到至少4 GHz,电隔离为-50 dB,在4 GHz时插入损耗为0.1 dB。 低温制造工艺允许开关与微波和毫米波集成电路(MMIC)单片集成。 RF开关具有电信应用,包括用于微波和毫米波IC设计的信号路由,MEMS阻抗匹配网络和用于频率敏捷通信的带通可调谐滤波器。