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    • 9. 发明授权
    • Touch substrate and touch display panel
    • 触摸基板和触摸显示面板
    • US08614680B2
    • 2013-12-24
    • US12725463
    • 2010-03-17
    • Yu-Chuan LinChun-Chi LaiJing-Tin KuoKuo-Hsing Cheng
    • Yu-Chuan LinChun-Chi LaiJing-Tin KuoKuo-Hsing Cheng
    • G06F3/041G06F3/045G02F1/1345H01L23/495
    • G06F3/044
    • A touch substrate including a substrate, a plurality of first sensing series, a plurality of second sensing series, a plurality of signal pads, a plurality of signal transmission lines, and a plurality of conductive patterns is provided. The substrate has an active region and a peripheral region located outside the active region. The first and the second sensing series are disposed on the substrate and located in the active region. The signal pads are disposed on the substrate and located at the peripheral region. The signal transmission lines are disposed on the substrate and located in the peripheral region, and connect the first sensing series and the second sensing series to the corresponding signal pads. Each signal transmission line includes a winding portion disposed adjacent to one corresponding signal pad. Each conductive pattern is disposed on one signal pad and extends above the winding portion of one signal transmission line.
    • 提供了包括基板,多个第一感测系列,多个第二感测系列,多个信号焊盘,多个信号传输线以及多个导电图案的触摸基板。 衬底具有位于有源区之外的有源区和周边区。 第一和第二感测系列设置在基板上并且位于有源区域中。 信号焊盘设置在基板上并位于周边区域。 信号传输线设置在基板上并位于周边区域中,并将第一感测系列和第二感测系列连接到相应的信号焊盘。 每个信号传输线包括邻近一个对应的信号焊盘设置的绕组部分。 每个导电图案设置在一个信号焊盘上并在一个信号传输线的绕组部分上方延伸。
    • 10. 发明授权
    • Light emitting device and manufacture method thereof
    • 发光元件及其制造方法
    • US08158462B2
    • 2012-04-17
    • US12964862
    • 2010-12-10
    • Yu-Chuan LinShau-Yu Tsai
    • Yu-Chuan LinShau-Yu Tsai
    • H01L21/44
    • H05K1/117H05K1/029H05K1/0295H05K2201/09954H05K2201/10106H05K2201/10189H05K2203/173Y10T29/49117
    • A manufacture method of a light emitting device is provided. Firstly, at least one circuit board is provided. A plurality of light emitting packages, a first undetermined power input end and a second undetermined power input end are disposed at the circuit board. The light emitting packages are electrically connected to the first undetermined power input end and the second undetermined power input end. Each of the first undetermined power input end and the second undetermined power input end has at least two first pads. The first pads of each of the first undetermined power input end and the second undetermined power input end are electrically isolated from each other. Next, the first undetermined power input end is selected to be a power input region for inputting an external power signal. Then, the first pads of the second undetermined power input end are electrically connected to each other.
    • 提供一种发光器件的制造方法。 首先,提供至少一个电路板。 多个发光封装,第一未确定电源输入端和第二未确定电源输入端设置在电路板上。 发光封装电连接到第一未确定电源输入端和第二未确定电源输入端。 第一未确定功率输入端和第二未确定功率输入端中的每一个具有至少两个第一焊盘。 第一未确定电源输入端和第二未确定电源输入端中的每一个的第一焊盘彼此电隔离。 接下来,将第一未确定电力输入端选择为用于输入外部电力信号的电力输入区域。 然后,第二未确定电源输入端的第一焊盘彼此电连接。