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    • 1. 发明授权
    • High molecular weight silicone compounds, resist compositions, and patterning method
    • 高分子量硅氧烷化合物,抗蚀剂组合物和图案化方法
    • US06730453B2
    • 2004-05-04
    • US09887320
    • 2001-06-25
    • Mutsuo NakashimaIchiro KanekoToshinobu IshiharaJunji TsuchiyaJun HatakeyamaShigehiro Nagura
    • Mutsuo NakashimaIchiro KanekoToshinobu IshiharaJunji TsuchiyaJun HatakeyamaShigehiro Nagura
    • G03F7075
    • G03F7/0045C08G77/14C08G77/38C08G77/388C08G77/50G03F7/0392G03F7/0757
    • The invention provides a high molecular weight silicone compound comprising recurring units of formula (1) and having a weight average molecular weight of 1,000-50,000. Some or all of the hydrogen atoms of carboxyl groups or carboxyl and hydroxyl groups in the silicone compound may be replaced by acid labile groups. Z is a di- to hexavalent, non-aromatic, monocyclic or polycyclic hydrocarbon or bridged cyclic hydrocarbon group; Z is a di- to hexavalent, normal or branched hydrocarbon group or non-aromatic, monocyclic or polycyclic hydrocarbon or bridged cyclic hydrocarbon group; x, y and z are integers of 1-5 corresponding to the valence of Z and Z′; R1 is —OCHR—R′—OH or —NHCHR—R′—OH; R2 is alkyl or alkenyl or a monovalent, non-aromatic, polycyclic hydrocarbon or bridged cyclic hydrocarbon group; p1, p2, p3 and p4 are 0 or positive numbers. A resist composition comprising the high molecular weight silicone compound as a base resin is sensitive to actinic radiation and has a high sensitivity and resolution so that it is suitable for microfabrication with electron beams or deep UV. Since the composition has low absorption at the exposure wavelength of an ArF or KrF excimer laser, a finely defined pattern having walls perpendicular to the substrate can be readily formed.
    • 本发明提供了包含式(1)的重复单元并且具有1,000-50,000重均分子量的高分子量硅氧烷化合物。 硅氧烷化合物中的羧基或羧基和羟基的一些或全部氢原子可被酸不稳定基团取代.Z为二价至六价,非芳香族,单环或多环烃或桥环状烃基; Z是二价至六价,正或支链烃基或非芳香族单环或多环烃或桥环状烃基; x,y和z是对应于Z和Z'的化合价的1-5的整数; R 1是-OCHR-R'-OH或-NHCHR-R'-OH; R 2是烷基或烯基或单价,非芳族,多环烃或桥连环烃基; p1,p2,p3和p4为0或正数。 包含作为基础树脂的高分子量硅氧烷化合物的抗蚀剂组合物对光化辐射敏感,并且具有高灵敏度和分辨率,使得它适合于用电子束或深紫外线的微细加工。 由于组成在ArF或KrF准分子激光器的曝光波长处具有低吸收,因此可以容易地形成具有垂直于衬底的壁的精细限定图案。
    • 2. 发明授权
    • High molecular weight silicone compounds resist compositions, and patterning method
    • 高分子量硅氧烷化合物抵抗组合物和图案化方法
    • US06309796B1
    • 2001-10-30
    • US09129950
    • 1998-08-06
    • Mutsuo NakashimaIchiro KanekoToshinobu IshiharaJunji TsuchiyaJun HatakeyamaShigehiro Nagura
    • Mutsuo NakashimaIchiro KanekoToshinobu IshiharaJunji TsuchiyaJun HatakeyamaShigehiro Nagura
    • G03F7075
    • G03F7/0045C08G77/14C08G77/38C08G77/388C08G77/50G03F7/0392G03F7/0757
    • The invention provides a high molecular weight silicone compound comprising recurring units of formula (1) and having a weight average molecular weight of 1,000-50,000. Some or all of the hydrogen atoms of carboxyl groups or carboxyl and hydroxyl groups in the silicone compound may be replaced by acid labile groups. Z is di- to hexavalent, non-aromatic, monocyclic or polycyclic hydrocarbon or bridged cyclic hydrocarbon group; Z′ is a di- to hexavalent, normal or branched hydrocarbon group or non-aromatic, monocyclic or polycyclic hydrocarbon or bridged cyclic hydrocarbon group; x, y and z are integers of 1-5 corresponding to the valence of Z and Z′; R1 is —OCHR—R′ —OH or —NHCHR—R′ —OH; R2 is alkyl or alkenyl or a monovalent, non-aromatic, polycyclic hydrocarbon or bridged cyclic hydrocarbon group; p1, p2, p3 and p4 are 0 or positive numbers. A resist composition comprising the high molecular weight silicone compound as a base resin is sensitive to actinic radiation and has a high sensitivity and resolution so that it is suitable for microfabrication with electron beams or deep UV. Since the composition has low absorption at the exposure wavelength of an ArF or KrF excimer laser, a finely defined pattern having walls perpendicular to the substrate can be readily formed.
    • 本发明提供了包含式(1)的重复单元并且具有1,000-50,000重均分子量的高分子量硅氧烷化合物。 硅烷化合物中的羧基或羧基和羟基的一部分或全部氢原子可被酸不稳定基团取代.Z为二价至六价,非芳香族,单环或多环烃基或桥环状烃基; Z'是二价至六价,正或支链烃基或非芳香族单环或多环烃或桥连环烃基; x,y和z是对应于Z和Z'的化合价的1-5的整数; R 1是-OCHR-R'-OH或-NHCHR-R'-OH; R2是烷基或链烯基或单价,非芳族,多环烃或桥连环烃基; p1,p2,p3和p4为0或正数。 包含作为基础树脂的高分子量硅氧烷化合物的抗蚀剂组合物对光化辐射敏感,并且具有高灵敏度和分辨率,使得它适合于用电子束或深紫外线的微细加工。 由于组成在ArF或KrF准分子激光器的曝光波长处具有低吸收,因此可以容易地形成具有垂直于衬底的壁的精细限定图案。
    • 6. 发明授权
    • Polymeric compounds, chemically amplified positive type resist materials
and process for pattern formation
    • 聚合化合物,化学放大正型抗蚀剂材料和图案形成工艺
    • US6048661A
    • 2000-04-11
    • US33147
    • 1998-03-02
    • Tsunehiro NishiJun HatakeyamaShigehiro NaguraToshinobu Ishihara
    • Tsunehiro NishiJun HatakeyamaShigehiro NaguraToshinobu Ishihara
    • G03F7/004G03F7/039
    • G03F7/0045G03F7/039Y10S430/106Y10S430/11Y10S430/111
    • Provided are polymeric compounds which, when used as base resins in resist materials, can yield chemical resist materials having high sensitivity, high resolution, a high exposure latitude, and good process adaptability, exhibiting excellent resistance to plasma etching, and giving resist patterns having high thermal resistance, as well as chemically amplified positive type resist materials using such polymeric compounds as base resins. These chemically amplified positive type resist materials use a base resin comprising a polymeric compound having a weight-average molecular weight of 1,000 to 500,000 and having one or more hydroxyl and/or carboxyl groups in the molecule, part or all of the hydrogen atoms of the hydroxyl and/or carboxyl groups being replaced by groups of the following general formula ##STR1## and additionally contain an acid generator, a dissolution inhibitor, a basic compound, and an aromatic compound having a group of the formula .tbd.C--COOH.
    • 提供了当作为抗蚀剂材料中的基础树脂使用时,可以产生具有高灵敏度,高分辨率,高曝光宽容度和良好的工艺适应性的化学抗蚀剂材料,表现出优异的等离子体蚀刻性,并且具有高抗蚀剂图案的抗蚀剂图案 耐热性以及使用这种聚合物作为基础树脂的化学放大正型抗蚀剂材料。 这些化学放大正型抗蚀剂材料使用包含重均分子量为1,000至500,000并且在分子中具有一个或多个羟基和/或羧基的聚合化合物的基础树脂,部分或全部氢原子 羟基和/或羧基被下列通式的基团取代,另外含有酸产生剂,溶解抑制剂,碱性化合物和具有式3BOND C-COOH基团的芳族化合物。
    • 9. 发明授权
    • Patterning method
    • 图案化方法
    • US6117621A
    • 2000-09-12
    • US48022
    • 1998-03-26
    • Jun HatakeyamaShigehiro Nagura
    • Jun HatakeyamaShigehiro Nagura
    • G03F7/004G03F7/039G03F7/30
    • G03F7/0045G03F7/039Y10S430/106Y10S430/111
    • A method for patterning a chemically amplified positive resist material comprising a base polymer having acid labile groups which are eliminated by acid, a photoacid generator and an organic solvent, in which the resist material is applied onto a substrate to a uniform thickness so as to form a resist film that is subsequently exposed, baked, then developed with a developer to form a positive pattern is characterized by using as the base polymer a mixture of at least two base polymers having mutually differing acid labile groups or a base polymer having at least two mutually differing acid labile groups on the same molecule and adjusting the types of the mutually differing acid labile groups and their contents within the base polymer such that, when the chemically amplified positive resist material is applied onto a substrate to a uniform thickness so as to form a resist film that is subsequently exposed, baked, then dissolved with a developer, the exposure E1 which results in an average dissolution rate of 100 .ANG./s for 500 .ANG. from the surface of the resist film toward the substrate and the exposure E2 which results in an average dissolution rate of 100 .ANG./s for 1000 .ANG. from the surface of the substrate toward the resist film surface satisfy the relationship: -0.2
    • 一种用于图案化化学放大正型抗蚀剂材料的方法,其包括具有酸不稳定基团的基础聚合物,其被酸,光致酸产生剂和有机溶剂除去,其中将抗蚀剂材料施加到基底上以形成均匀的厚度,以形成 随后用显影剂曝光,烘烤,然后显影以形成阳性图案的抗蚀剂膜的特征在于使用至少两种具有相互不同的酸不稳定基团的基础聚合物或具有至少两个 在相同分子上相互不同的酸不稳定基团并调节相互不同的酸不稳定基团的类型及其在基础聚合物内的含量,使得当将化学放大的正性抗蚀剂材料施加到基底上以均匀的厚度形成 随后暴露,烘烤,然后用显影剂溶解的抗蚀剂膜,曝光E1导致平均 从抗蚀剂膜的表面向衬底的500 ANGSTROM的100安培/秒的Ge溶解速率和曝光E2,其导致从基板表面到抗蚀剂膜的1000安培姆的平均溶解速率为100安培 表面满足关系:-0.2 <(E2-E1)/ E2 <0.2。
    • 10. 发明授权
    • Resist compositions
    • 抗蚀剂组合物
    • US06274286B1
    • 2001-08-14
    • US09105003
    • 1998-06-26
    • Jun HatakeyamaTsunehiro NishiTakeshi NagataShigehiro Nagura
    • Jun HatakeyamaTsunehiro NishiTakeshi NagataShigehiro Nagura
    • G03F7004
    • G03F7/0045Y10S430/106
    • A chemically amplified positive resist composition comprising at least one basic compound of the following general formula (1) or (2): wherein R1, R2, R3, R7, and R8 are independently normal, branched or cyclic alkylene groups having 1 to 20 carbon atoms, R4, R5, R6, R9, and R10 are independently hydrogen, alkyl groups having 1 to 20 carbon atoms or amino groups, R4 and R5, R5 and R6, R4 and R6, or R8, R5 and R5, and R9 and R10, taken together, may form a ring, letters k, m and n are integers of 0 to 20, with the proviso that hydrogen is excluded from R4, R5, R6, R9 and R10 when k, m or n is equal to 0. The resist compositions of the present invention are effective for preventing resist films from thinning and for increasing the focus margin of an isolated pattern.
    • 一种化学放大正型抗蚀剂组合物,其包含至少一种下列通式(1)或(2)的碱性化合物:其中R 1,R 2,R 3,R 7和R 8独立地为具有1至20个碳的正,支链或环状亚烷基 原子,R 4,R 5,R 6,R 9和R 10独立地是氢,具有1至20个碳原子的烷基或氨基,R 4和R 5,R 5和R 6,R 4和R 6,或R 8,R 5和R 5, R 10一起可以形成环,字母k,m和n是0至20的整数,条件是当k,m或n等于0时,从R4,R5,R6,R9和R10排除氢。 本发明的抗蚀剂组合物对于防止抗蚀剂膜变薄和增加隔离图案的聚焦边缘是有效的。