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    • 5. 发明授权
    • Forming surface features using self-assembling masks
    • 使用自组装掩模形成表面特征
    • US07828986B2
    • 2010-11-09
    • US11926722
    • 2007-10-29
    • Joy ChengMark W. HartHiroshi ItoHo-Cheol KimRobert Miller
    • Joy ChengMark W. HartHiroshi ItoHo-Cheol KimRobert Miller
    • B44C1/22H01L21/302
    • H01L21/0337B81C1/00031B81C2201/0149B81C2201/0198H01L21/0271H01L21/0332
    • A method. A combination is provided of a block copolymer and additional material. The copolymer includes a first block of a first polymer covalently bonded to a second block of a second polymer. The additional material is miscible with the first polymer. The first polymer includes polystyrene and the second polymer includes poly(ethylene oxide). A first layer including polydimethylglutarimide is adhered onto a surface of a substrate including a dielectric coated silicon wafer. A film is formed of the combination directly onto a surface of the first layer. Nanostructures of the additional material self-assemble within the first polymer block. The film and the first layer are simultaneously etched. The nanostructures have an etch rate lower than an etch rate of the block copolymer and lower than an etch rate of the first layer. Portions of the film are removed. Features remain on the surface of the first layer.
    • 一个方法。 提供了一种嵌段共聚物和另外的材料的组合。 共聚物包括共价键合到第二聚合物的第二嵌段的第一聚合物的第一嵌段。 附加材料与第一聚合物混溶。 第一聚合物包括聚苯乙烯,第二聚合物包括聚(环氧乙烷)。 包括聚二甲基戊二酰亚胺的第一层粘附到包括电介质涂覆的硅晶片的基材的表面上。 该组合物直接由第一层的表面形成。 附加材料的纳米结构在第一聚合物嵌段内自组装。 同时蚀刻膜和第一层。 纳米结构的蚀刻速率低于嵌段共聚物的蚀刻速率,并且低于第一层的蚀刻速率。 部分电影被删除。 特征保留在第一层的表面上。
    • 6. 发明申请
    • FORMING SURFACE FEATURES USING SELF-ASSEMBLING MASKS
    • 使用自组装面膜形成表面特征
    • US20090107950A1
    • 2009-04-30
    • US11926722
    • 2007-10-29
    • Joy ChengMark W. HartHiroshi ItoHo-Cheol KimRobert Miller
    • Joy ChengMark W. HartHiroshi ItoHo-Cheol KimRobert Miller
    • H01B13/00
    • H01L21/0337B81C1/00031B81C2201/0149B81C2201/0198H01L21/0271H01L21/0332
    • A method for producing surface features and an etch masking method. A combination is provided of a block copolymer and additional material. The block copolymer includes a first block of a first polymer covalently bonded to a second block of a second polymer. The additional material is miscible with the first polymer. A film is formed of the combination directly onto a surface of a first layer. Nanostructures of the additional material self-assemble within the first polymer block. The film of the combination and the first layer are etched. The nanostructures have an etch rate lower than an etch rate of the block copolymer and lower than an etch rate of the first layer. The film is removed and features remain on the surface of the first layer. Also included is an etch masking method where the nanostructures mask portions of the first layer from said etchant.
    • 一种用于产生表面特征的方法和蚀刻掩模方法。 提供了一种嵌段共聚物和另外的材料的组合。 嵌段共聚物包括共价键合到第二聚合物的第二嵌段的第一聚合物的第一嵌段。 附加材料与第一聚合物混溶。 膜由直接形成在第一层的表面上。 附加材料的纳米结构在第一聚合物嵌段内自组装。 蚀刻组合和第一层的膜。 纳米结构的蚀刻速率低于嵌段共聚物的蚀刻速率,并且低于第一层的蚀刻速率。 去除膜并且特征保留在第一层的表面上。 还包括蚀刻掩模法,其中纳米结构掩盖了来自所述蚀刻剂的第一层的部分。
    • 7. 发明申请
    • METHODS FOR FORMING SURFACE FEATURES USING SELF-ASSEMBLING MASKS
    • 使用自组装掩模形成表面特征的方法
    • US20090107953A1
    • 2009-04-30
    • US12057565
    • 2008-03-28
    • Joy ChengMark W. HartHiroshi ItoHo-Cheol KimRobert Miller
    • Joy ChengMark W. HartHiroshi ItoHo-Cheol KimRobert Miller
    • C23F1/00
    • H01L21/0337B81C1/00031B81C2201/0149B81C2201/0198H01L21/0271H01L21/0332
    • A method for producing surface features and an etch masking method. A combination is provided of a block copolymer and additional material. The block copolymer includes a first block of a first polymer covalently bonded to a second block of a second polymer. The additional material is miscible with the first polymer. A film is formed of the combination directly onto a surface of a first layer. Nanostructures of the additional material self-assemble within the first polymer block. The film of the combination and the first layer are etched. The nanostructures have an etch rate lower than an etch rate of the block copolymer and lower than an etch rate of the first layer. The film is removed and features remain on the surface of the first layer. Also included is an etch masking method where the nanostructures mask portions of the first layer from said etchant.
    • 一种用于产生表面特征的方法和蚀刻掩模方法。 提供了一种嵌段共聚物和另外的材料的组合。 嵌段共聚物包括共价键合到第二聚合物的第二嵌段的第一聚合物的第一嵌段。 附加材料与第一聚合物混溶。 膜由直接形成在第一层的表面上。 附加材料的纳米结构在第一聚合物嵌段内自组装。 蚀刻组合和第一层的膜。 纳米结构的蚀刻速率低于嵌段共聚物的蚀刻速率,并且低于第一层的蚀刻速率。 去除膜并且特征保留在第一层的表面上。 还包括蚀刻掩模法,其中纳米结构掩盖了来自所述蚀刻剂的第一层的部分。