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1. 发明授权

US06737265B2 Microelectronic unit forming methods and materials 失效
标题翻译：微电子单元成型方法和材料
公开(公告)号：US06737265B2
公开(公告)日：2004-05-18
申请号：US10242017
申请日：2002-09-12
申请人： Masud Beroz , Joseph Fjelstad , Belgacem Haba , Christopher M. Pickett , John Smith
发明人： Masud Beroz , Joseph Fjelstad , Belgacem Haba , Christopher M. Pickett , John Smith
IPC分类号： C12M100
CPC分类号： H01L24/02 , H01L2221/68359 , H01L2221/68381 , H01L2224/02313 , H01L2224/02319 , H01L2224/02331 , H01L2224/02333 , H01L2224/02335 , H01L2224/0235 , H01L2224/02377 , H01L2224/0401 , H01L2224/04042 , H01L2224/13024 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/48472 , H01L2224/94 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H01L2924/00015 , H01L2224/03 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： Releasable leads having an elongated fixed portion extend over a surface defined by a dielectric material of a component or by a semiconductor body. A semiconductor element having a conductive structure connected to a set of contacts is also disclosed. A method of making the conductive structure is disclosed.
摘要翻译：具有细长固定部分的可释放引线在由部件的介电材料或半导体本体限定的表面上延伸。还公开了具有连接到一组触点的导电结构的半导体元件。公开了制造导电结构的方法。

2. 发明授权

US06361959B1 Microelectronic unit forming methods and materials 有权
标题翻译：微电子单元成型方法和材料
公开(公告)号：US06361959B1
公开(公告)日：2002-03-26
申请号：US09317675
申请日：1999-05-24
申请人： Masud Beroz , Joseph Fjelstad , Belgacem Haba , Christopher M. Pickett , John Smith
发明人： Masud Beroz , Joseph Fjelstad , Belgacem Haba , Christopher M. Pickett , John Smith
IPC分类号： C12Q154
CPC分类号： C12Q1/00 , C12Q1/54 , H01L2224/48091 , H01L2224/48227 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Electrically conductive elements such as terminals and leads are held on a support structure by a degradable connecting layer such as a adhesive degradable by heat or radiant energy. After connecting these elements to a microelectronic element such as a chip or wafer, the conductive elements are released from the support structure by degrading the connecting layer. The support structure desirably has a predictable, isotropic coefficient of thermal expansion and such coefficient of thermal expansion may be close to that of silicon to minimize the effect of the temperature changes. The conductive elements may be mounted on a plurality of individual tiles rather than on an unitary sheet covering an entire wafer to minimize dimensional changes when the dielectric is released from the support structure.
摘要翻译：诸如端子和引线的导电元件通过可降解的连接层（例如通过热或辐射能降解的粘合剂）保持在支撑结构上。在将这些元件连接到诸如芯片或晶片的微电子元件之后，通过降低连接层而将导电元件从支撑结构释放。支撑结构理想地具有可预测的各向同性热膨胀系数，并且这种热膨胀系数可能接近于硅的热膨胀系数以最小化温度变化的影响。导电元件可以安装在多个单独的瓦片上，而不是在覆盖整个晶片的整体片材上安装，以便当电介质从支撑结构释放时最小化尺寸变化。

3. 发明申请

US20050155223A1 Methods of making microelectronic assemblies 审中-公开
标题翻译：制造微电子组件的方法
公开(公告)号：US20050155223A1
公开(公告)日：2005-07-21
申请号：US11043354
申请日：2005-01-26
申请人： Joseph Fjelstad , Masud Beroz , John Smith , Belgacem Haba
发明人： Joseph Fjelstad , Masud Beroz , John Smith , Belgacem Haba
IPC分类号： H01L21/44 , H01L23/48 , H01L23/52 , H01L29/40 , H01R43/02 , H05K3/34
CPC分类号： H01L24/29 , H01L23/49811 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/78 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L2224/0401 , H01L2224/05553 , H01L2224/05599 , H01L2224/131 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/49431 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/78 , H01L2224/83138 , H01L2224/8319 , H01L2224/838 , H01L2224/8393 , H01L2224/85186 , H01L2224/85205 , H01L2224/85207 , H01L2224/85399 , H01L2224/8593 , H01L2224/92247 , H01L2225/0651 , H01L2225/06558 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/014 , H01L2924/0665 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T29/49179 , H01L2924/00 , H01L2224/45099 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method of making a microelectronic assembly includes juxtaposing a first element having conductive leads thereon with a second element having contacts thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads and the contacts. After the wire bonding step, the first and second elements are moved through a preselected displacement relative to one another so as to deform the bonding wires.
摘要翻译：制造微电子组件的方法包括：在其上具有导电引线的第一元件与其上具有触点的第二元件并置，并将第一元件上的导电引线接合到第二元件上的触点，使得细长的接合线在导电领导和联系人。在引线接合步骤之后，第一和第二元件相对于彼此移动通过预选位移，以使接合线变形。

4. 发明授权

US06261863B1 Components with releasable leads and methods of making releasable leads 有权
标题翻译：具有可释放引线的部件和制造可释放引线的方法
公开(公告)号：US06261863B1
公开(公告)日：2001-07-17
申请号：US09471973
申请日：1999-12-23
申请人： Masud Beroz , Thomas H. DiStefano , Anthony B. Faraci , Joseph Fjelstad , Belgacem Haba
发明人： Masud Beroz , Thomas H. DiStefano , Anthony B. Faraci , Joseph Fjelstad , Belgacem Haba
IPC分类号： H01L2144
CPC分类号： H05K3/4092 , H01L23/49811 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions. A method of making a connection component includes removing material from the conductive structures or the support layer or both to form the anchors.
摘要翻译：用于诸如半导体芯片的微电子器件的连接部件包括支撑层和延伸穿过支撑层的表面的导电结构。导电结构具有将它们连接到支撑层，以及可释放或未锚定部分的锚固件。制造连接部件的方法包括从导电结构或支撑层或两者移除材料以形成锚固件。

5. 发明授权

US06848173B2 Microelectric packages having deformed bonded leads and methods therefor 失效
标题翻译：具有变形的接合引线的微电子封装及其方法
公开(公告)号：US06848173B2
公开(公告)日：2005-02-01
申请号：US09766814
申请日：2001-01-22
申请人： Joseph Fjelstad , Masud Beroz , John W. Smith , Belgacem Haba
发明人： Joseph Fjelstad , Masud Beroz , John W. Smith , Belgacem Haba
IPC分类号： H01L21/44 , H01L23/48 , H01L23/52 , H01L29/40 , H01R43/02 , H05K3/34
CPC分类号： H01L24/29 , H01L23/49811 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/78 , H01L24/83 , H01L24/85 , H01L24/86 , H01L25/0657 , H01L2224/0401 , H01L2224/05553 , H01L2224/05599 , H01L2224/131 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/49431 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/78 , H01L2224/83138 , H01L2224/8319 , H01L2224/838 , H01L2224/8393 , H01L2224/85186 , H01L2224/85205 , H01L2224/85207 , H01L2224/85399 , H01L2224/8593 , H01L2224/92247 , H01L2225/0651 , H01L2225/06558 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/014 , H01L2924/0665 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T29/49179 , H01L2924/00 , H01L2224/45099 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads and the contacts. After the wire bonding step, the first and second elements are moved through a pre-selected displacement relative to one another so as to deform the bonding wires. A flowable dielectric material may be introduced between the first and second elements and around the bonding wires during or after the moving step. The flowable material may be cured to form an encapsulant around at least a portion of the bonding wires.
摘要翻译：一种制造微电子组件的方法包括将第一元件（例如具有导电引线的电介质片）与其上接触的第二元件（例如半导体芯片）并置，将第一元件上的导电引线接合到触点上在第二元件上，使得细长的接合线在导电引线和触点之间延伸。在引线接合步骤之后，第一和第二元件相对于彼此移动通过预先选择的位移，以使接合线变形。可移动介电材料可以在移动步骤期间或之后在第一和第二元件之间以及接合线周围引入。可流动材料可以固化以形成围绕至少一部分接合线的密封剂。

6. 发明授权

US06541845B2 Components with releasable leads and methods of making releasable leads 有权
标题翻译：具有可释放引线的部件和制造可释放引线的方法
公开(公告)号：US06541845B2
公开(公告)日：2003-04-01
申请号：US09777781
申请日：2001-02-06
申请人： Masud Beroz , Thomas H. DiStefano , Anthony B. Faraci , Joseph Fjelstad , Belgacem Haba
发明人： Masud Beroz , Thomas H. DiStefano , Anthony B. Faraci , Joseph Fjelstad , Belgacem Haba
IPC分类号： H01L2144
CPC分类号： H05K3/4092 , H01L23/49811 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions.
摘要翻译：用于诸如半导体芯片的微电子器件的连接部件包括支撑层和延伸穿过支撑层的表面的导电结构。导电结构具有将它们连接到支撑层，以及可释放或未锚定部分的锚固件。

7. 发明授权

US08207604B2 Microelectronic package comprising offset conductive posts on compliant layer 有权
标题翻译：微电子封装包括柔性层上的偏移导电柱
公开(公告)号：US08207604B2
公开(公告)日：2012-06-26
申请号：US10985126
申请日：2004-11-10
申请人： Belgacem Haba , Masud Beroz , Giles Humpston , Jae M. Park
发明人： Belgacem Haba , Masud Beroz , Giles Humpston , Jae M. Park
IPC分类号： H01L23/485
CPC分类号： H01L23/13 , H01L21/4846 , H01L2924/0002 , H01R13/2414 , H01R13/2464 , H01L2924/00
摘要： A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.
摘要翻译：微电子封装包括安装结构，与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱。导电柱从安装结构沿向上的方向突出，至少一个导电柱是偏移柱。每个偏移柱具有连接到安装结构的基座，每个偏置柱的基部限定质心。每个偏移柱还限定具有质心的上肢，上肢的质心在垂直于向上方向的水平偏移方向上偏离基部的质心。安装结构适于允许每个偏移柱绕水平轴线倾斜，使得上端部可以擦过相对电路板的接触垫。

8. 发明申请

US20080296717A1 Packages and assemblies including lidded chips 审中-公开
标题翻译：包装和组件，包括带芯片
公开(公告)号：US20080296717A1
公开(公告)日：2008-12-04
申请号：US11809780
申请日：2007-06-01
申请人： Masud Beroz , Belgacem Haba , Michael J. Nystrom , Richard Dewitt Crisp , Giles Humpston
发明人： Masud Beroz , Belgacem Haba , Michael J. Nystrom , Richard Dewitt Crisp , Giles Humpston
IPC分类号： H01L31/0203 , H01L21/58 , H01L23/02
CPC分类号： H01L31/0203 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/81 , H01L25/03 , H01L25/0657 , H01L25/50 , H01L27/14618 , H01L27/14632 , H01L2224/05554 , H01L2224/05568 , H01L2224/05571 , H01L2224/05573 , H01L2224/10126 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48464 , H01L2224/4911 , H01L2224/49171 , H01L2224/49175 , H01L2224/81192 , H01L2225/06506 , H01L2225/06517 , H01L2225/06568 , H01L2225/06589 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15787 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2224/29099 , H01L2224/45099 , H01L2224/81805 , H01L2224/05599
摘要： A lidded chip is provided which includes a chip having a major surface and a plurality of first chip contacts exposed at the major surface. A lid overlies the major surface. A chip carrier is disposed between the chip and the lid, the chip carrier having an inner surface confronting the major surface and an outer surface confronting the lid. A plurality of first carrier contacts of the chip carrier are conductively connected to the first chip contacts. A plurality of second carrier contacts extend upwardly at least partially through the openings in the lid.
摘要翻译：提供了一种带芯的芯片，其包括具有主表面的芯片和在主表面处暴露的多个第一芯片触点。盖子盖在主表面上。芯片载体设置在芯片和盖之间，芯片载体具有面向主表面的内表面和面对盖的外表面。芯片载体的多个第一载体触点导电地连接到第一芯片触点。多个第二载体触点至少部分地向上延伸穿过盖中的开口。

9. 发明授权

US07453157B2 Microelectronic packages and methods therefor 有权
标题翻译：微电子封装及其方法
公开(公告)号：US07453157B2
公开(公告)日：2008-11-18
申请号：US11140312
申请日：2005-05-27
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of etched conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes an encapsulating mold material in contact with the microelectronic element and the compliant layer, whereby the encapsulating mold material overlies the outer region of the flexible substrate.
摘要翻译：微电子封装包括具有面，触点和外周边的微电子元件，以及覆盖并与微电子元件的第一面间隔开的柔性基板，柔性基板的外部区域延伸超出微电子元件的外周边。所述封装包括多个蚀刻的导电柱，其暴露在所述柔性基板的表面处并与所述微电子元件电互连，其中所述导电柱中的至少一个设置在所述柔性基板的外部区域中，并且设置柔性层在微电子元件的第一面和柔性基板之间，其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。该封装包括与微电子元件和柔性层接触的封装模具材料，由此封装模具材料覆盖在柔性基板的外部区域上。

10. 发明授权

US07361979B2 Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates 有权
标题翻译：用于微电子器件的多片导电衬底以及用于形成这种衬底的方法
公开(公告)号：US07361979B2
公开(公告)日：2008-04-22
申请号：US11025401
申请日：2004-12-29
申请人： Masud Beroz , Belgacem Haba
发明人： Masud Beroz , Belgacem Haba
IPC分类号： H01L23/02 , H05K1/00
CPC分类号： H01L23/49833 , H01L23/4985 , H01L2224/48227 , H01L2224/49109 , H05K1/112 , H05K3/4611 , H05K2201/09472
摘要： A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major surface of a sheet faces the second major surface of another. At least one electrically conductive region of each sheet is partially or fully exposed. At least one electrically conductive region of a sheet is partially or fully covered, e.g., by one or more electrically conductive regions of another sheet. A method for forming such a substrate is also provided.
摘要翻译：提供具有多个片材的基片。每个片材具有包含多个导电区域的第一主表面和与第一主表面相对的第二主表面。片材布置成使得片材的第一主表面面对另一片材的第二主表面。每个片材的至少一个导电区域部分或全部暴露。片材的至少一个导电区域被部分或完全覆盖，例如由另一片材的一个或多个导电区域覆盖。还提供了一种用于形成这种基板的方法。

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