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    • 1. 发明授权
    • Fiber optic ferrule
    • 光纤套圈
    • US07802924B2
    • 2010-09-28
    • US12239848
    • 2008-09-29
    • Joseph Edward RiskaChristopher E. Young
    • Joseph Edward RiskaChristopher E. Young
    • G02B6/38
    • G02B6/40G02B6/255G02B6/2558
    • Consistent with the present disclosure, a ferrule is provided that includes first and second channels, for example. Multiple fibers of a ribbon cable, for example, are divided into groups and fed into corresponding channels of the ferrule. Since multiple channels are provided, however, each channel can be made relatively narrow. Thus, by providing smaller channel widths, the fibers in those channels experience less thermal stress. Moreover, the channels are spaced from one another so that the lateral spacing between adjacent fibers in the ribbon cable is maintained in the ferrule. As a result, the fibers are not bent laterally, and thus may experience little bending stress.
    • 根据本公开,提供了例如包括第一和第二通道的套圈。 例如,带状电缆的多根纤维被分成组并且被馈送到套圈的相应通道中。 然而,由于提供了多个通道,所以可以使每个通道相对较窄。 因此,通过提供较小的通道宽度,那些通道中的光纤经受较少的热应力。 此外,通道彼此间隔开,使得带状电缆中的相邻纤维之间的横向间隔保持在套圈中。 结果,纤维不侧向弯曲,因此可能会产生很小的弯曲应力。
    • 6. 发明申请
    • LOW STRESS PACKAGE
    • 低压包装
    • US20100158436A1
    • 2010-06-24
    • US12344127
    • 2008-12-24
    • Joseph Edward Riska
    • Joseph Edward Riska
    • G02B6/12H01L21/50
    • G02B6/12007G02B6/12
    • Consistent with the present disclosure, a package is provided in which the PLC substrate, for example, is bonded to the underlying carrier though a limited contact area. The rest of the substrate is detached from the carrier so that stresses are applied to a limited portion of the PLC substrate. The PLC itself, however, is provided over that portion of the substrate that is detached from the carrier, and thus experiences reduced stress. Accordingly, high modulus adhesives, as well as solders, may be used to bond the PLC substrate to the carrier, thereby resulting in a more robust mechanical structure.
    • 根据本公开,提供了一种封装,其中例如通过有限的接触区域将PLC基板结合到底层载体。 基板的其余部分与载体分离,使得应力施加到PLC基板的有限部分。 然而,PLC本身设置在与载体分离的基板的那部分上,从而经受减小的应力。 因此,可以使用高模量粘合剂以及焊料来将PLC基板粘合到载体上,由此导致更坚固的机械结构。