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    • 7. 发明申请
    • Method of production of a semiconductor memory device and semiconductor memory device
    • 半导体存储器件和半导体存储器件的制造方法
    • US20080081424A1
    • 2008-04-03
    • US11541458
    • 2006-09-29
    • Josef WillerKarl-Heinz Kuesters
    • Josef WillerKarl-Heinz Kuesters
    • H01L21/336
    • H01L27/11568H01L27/105H01L27/11573H01L29/665H01L29/6659H01L29/7833
    • A layer of electrically conductive material is applied above a carrier surface. Gate electrodes are formed above a first area of the carrier surface from the electrically conductive material. An implantation of a dopant that is provided for source/drain regions is performed in the first area. The implant is annealed, and an auxiliary layer of a dielectric material is applied to planarize the surface. The first area is covered with a mask, and a further implantation of a dopant provided for source/drain regions is performed in a second area of the carrier surface provided for a memory cell array. The implant is annealed, and the memory cells are formed in the second area. The semiconductor memory device may comprise a selectively deposited electrically conductive material on the gate electrodes of the periphery and on buried bitlines of the memory cell array.
    • 在载体表面上施加一层导电材料。 栅电极形成在载体表面的与导电材料的第一区域之上。 在第一区域中执行为源极/漏极区域提供的掺杂剂的注入。 将植入物退火,并且施加介电材料的辅助层以使表面平坦化。 第一区域被掩模覆盖,并且在为存储单元阵列提供的载体表面的第二区域中执行为源/漏区提供的掺杂剂的进一步注入。 将植入物退火,并且在第二区域中形成存储器单元。 半导体存储器件可以包括在周边的栅电极和存储单元阵列的掩埋位线上的选择性沉积的导电材料。
    • 9. 发明授权
    • Three-dimensional one-dimensional cell arrangement for dynamic
semiconductor memories and method for the manufacture of a bit line
contact
    • 用于动态半导体存储器的三维一维单元布置和用于制造位线接触的方法
    • US5025295A
    • 1991-06-18
    • US464685
    • 1990-01-16
    • Karl-Heinz KuestersWolfgang MuellerGerd Enders
    • Karl-Heinz KuestersWolfgang MuellerGerd Enders
    • H01L27/10H01L21/8242H01L27/108
    • H01L27/10861H01L27/10829
    • A three-dimensional, one transistor cell arrangement for dynamic semiconductor memories utilizing a trench capacitor in the substrate, and provided with a switching field effect transistor including an insulated gate electrode connected to the source/drain zone, the bit line contact for the connection of the switching transistor being arranged to be self-adjusted on the drain region in the semiconductor substrate, and overlapping the gate electrode with insulating layers on all sides. It also overlaps the neighboring field oxide region. The insulation layer laying beneath the bit line and over the gate level is a triple layer composed of silicon oxide/silicon nitride/silicon oxide, and in the through hole etching which is carried out by specific etching steps, there exists a self-adjusted overlapping contact. By eliminating the imprecision caused by the lithography, the space requirement of a memory cell can be reduced by about 20%. The invention is particularly utilized in the manufacture of 4 megabit DRAMs.
    • 一种用于在衬底中利用沟槽电容器的动态半导体存储器的三维一晶体管单元布置,并且设置有包括连接到源极/漏极区的绝缘栅电极的开关场效应晶体管,用于连接 所述开关晶体管被布置为在所述半导体衬底的漏极区域上自调节,并且在所述侧面上与所述栅电极重叠。 它也与相邻的场氧化物区域重叠。 位于位线下方和栅极层以下的绝缘层是由氧化硅/氮化硅/氧化硅构成的三层,并且在通过特定蚀刻步骤进行的通孔蚀刻中,存在自调整重叠 联系。 通过消除由光刻引起的不精确度,存储单元的空间需求可以减少大约20%。 本发明特别用于制造4兆比特DRAM。