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1. 发明申请

US20120181686A1 METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体封装的制备方法和半导体封装的半导体器件
公开(公告)号：US20120181686A1
公开(公告)日：2012-07-19
申请号：US13303938
申请日：2011-11-23
申请人： Joon Yong PARK , Yong Seok HAN , Jae Jun LEE , Chul Ho JEONG
发明人： Joon Yong PARK , Yong Seok HAN , Jae Jun LEE , Chul Ho JEONG
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L21/561 , H01L21/486 , H01L21/6835 , H01L21/6836 , H01L23/147 , H01L23/3114 , H01L23/49827 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/03002 , H01L2224/0345 , H01L2224/0401 , H01L2224/0557 , H01L2224/05571 , H01L2224/11002 , H01L2224/11009 , H01L2224/1146 , H01L2224/13009 , H01L2224/13021 , H01L2224/13025 , H01L2224/13082 , H01L2224/13111 , H01L2224/13116 , H01L2224/16145 , H01L2224/16225 , H01L2224/27002 , H01L2224/27009 , H01L2224/27416 , H01L2224/27422 , H01L2224/27436 , H01L2224/27515 , H01L2224/27622 , H01L2224/2781 , H01L2224/2919 , H01L2224/30181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73103 , H01L2224/73204 , H01L2224/81801 , H01L2224/83855 , H01L2224/9211 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/1434 , H01L2924/15311 , H01L2924/181 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/05552
摘要： A method of preparing a semiconductor package including disposing photosensitive adhesive film on a reinterconnected rear surface of a wafer on which the through electrodes are disposed, and forming a pattern corresponding to the through electrodes to prepare the semiconductor package.
摘要翻译：一种制备半导体封装件的方法，包括将感光性粘合剂膜设置在其上设置有通孔的晶片的再连接后表面上，并且形成与通孔电极对应的图案以制备半导体封装。

2. 发明申请

US20120181702A1 PHOTOSENSITIVE ADHESIVE COMPOSITION HAVING ALKALI SOLUBLE EPOXY RESIN, AND PATTERNABLE ADHESIVE FILM USING THE SAME 审中-公开
标题翻译：具有ALKALI可溶性环氧树脂的光敏性粘合剂组合物和使用该粘合剂的不透水胶膜
公开(公告)号：US20120181702A1
公开(公告)日：2012-07-19
申请号：US13224636
申请日：2011-09-02
申请人： Jae Jun LEE , Joon Yong PARK , Chul Ho JEONG , Yong Seok HAN
发明人： Jae Jun LEE , Joon Yong PARK , Chul Ho JEONG , Yong Seok HAN
IPC分类号： H01L23/538 , G03F7/028
CPC分类号： C08G59/3209 , C08F2220/325 , C08L33/06 , C08L61/06 , C08L75/04 , C09J163/00 , G03F7/033 , G03F7/038 , G03F7/0388
摘要： Provided are a photosensitive adhesive composition having an alkali soluble epoxy resin and a patternable adhesive film using the same. The photosensitive adhesive composition has good pattern formability and adhesiveness since the photosensitive adhesive composition includes the alkali soluble epoxy resin.
摘要翻译：提供具有碱溶性环氧树脂的感光性粘合剂组合物和使用其的可图案化粘合膜。感光性粘合剂组合物由于感光性粘接剂组合物含有碱溶性环氧树脂，因此具有良好的图案形成性和粘合性。

3. 发明申请

US20120175790A1 COMPOSITION FOR PATTERNABLE ADHESIVE FILM, PATTERNABLE ADHESIVE FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME 审中-公开
标题翻译：用于图案胶粘膜的组合物，可压电胶片和使用其制造半导体包装的方法
公开(公告)号：US20120175790A1
公开(公告)日：2012-07-12
申请号：US13198811
申请日：2011-08-05
申请人： Yong Seok HAN , Joon Yong PARK , Jae Jun LEE , Chul Ho JEONG
发明人： Yong Seok HAN , Joon Yong PARK , Jae Jun LEE , Chul Ho JEONG
IPC分类号： C08L33/08 , H01L21/02 , H01L23/00
CPC分类号： H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： A composition for a patternable adhesive film, a patternable adhesive film having the same, and a method of manufacturing a semiconductor package using the patternable adhesive film are provided. The composition contains a binder resin, a radical-polymerizable acrylate monomer, a photo-radical initiator, and a thermal-radical initiator without an epoxy resin. The composition may have good patternability, adhesiveness, and low-temperature stability, and be rapidly cured at a low temperature.
摘要翻译：提供了一种可图案化粘合剂膜的组合物，具有该组合物的可图案的粘合膜，以及使用该可图案的粘合剂膜制造半导体封装的方法。组合物含有粘合剂树脂，可自由基聚合的丙烯酸酯单体，光自由基引发剂和没有环氧树脂的热自由基引发剂。组合物可以具有良好的图案性，粘合性和低温稳定性，并且可以在低温下快速固化。

4. 发明申请

US20120181703A1 PATTERNABLE ADHESIVE COMPOSITION, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE 有权
标题翻译：可压电胶组合物，使用其的半导体封装以及制造半导体封装的方法
公开(公告)号：US20120181703A1
公开(公告)日：2012-07-19
申请号：US13291588
申请日：2011-11-08
申请人： Joon-Yong PARK , Yong Seok HAN , Jae Jun LEE , Chul Ho JEONG
发明人： Joon-Yong PARK , Yong Seok HAN , Jae Jun LEE , Chul Ho JEONG
IPC分类号： H01L23/48 , C09J133/06 , H01L21/301
CPC分类号： H01L24/81 , C09J133/06 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05009 , H01L2224/05568 , H01L2224/05571 , H01L2224/06181 , H01L2224/13009 , H01L2224/13021 , H01L2224/13082 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/27436 , H01L2224/27515 , H01L2224/27622 , H01L2224/2781 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73103 , H01L2224/73204 , H01L2224/8181 , H01L2224/83855 , H01L2224/9211 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/1434 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
摘要： A patternable adhesive composition including at least one alkali soluble resin including an alkali soluble group and an acryloyl group, at least one radically polymerizable compound, at least one thermosettable compound, and at least one photo-radical initiator.
摘要翻译：包含至少一种包括碱溶性基团和丙烯酰基的碱溶性树脂，至少一种自由基聚合性化合物，至少一种可热固化合物和至少一种光自由基引发剂的图案化粘合剂组合物。

5. 发明申请

US20120135251A1 PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME 审中-公开
标题翻译：具有硅改性基团的粘合性聚酰亚胺，粘合组合物和包括其的半导体包装
公开(公告)号：US20120135251A1
公开(公告)日：2012-05-31
申请号：US13165292
申请日：2011-06-21
申请人： Chul Ho JEONG , Joon Yong PARK , Jae Jun LEE , Yong Seok HAN , Mi Jeong SONG
发明人： Chul Ho JEONG , Joon Yong PARK , Jae Jun LEE , Yong Seok HAN , Mi Jeong SONG
IPC分类号： B32B7/12 , C09J179/08 , B32B15/088 , C08G73/10
CPC分类号： C09J179/08 , C08G73/1025 , H01L23/293 , H01L24/29 , H01L2224/2919 , H01L2924/12041 , H01L2924/12044 , Y10T428/31721 , H01L2924/00
摘要： A photosensitive polyimide and an adhesive composition and adhesive film containing the same are provided. The photosensitive polyimide has an imide backbone and grafted side chains including a methacrylate-based side chain and a silicon-modified side chain.
摘要翻译：提供感光性聚酰亚胺和含有它们的粘合剂组合物和粘合剂膜。光敏聚酰亚胺具有酰亚胺主链和包含甲基丙烯酸酯侧链和硅改性侧链的接枝侧链。

6. 发明申请

US20110091811A1 DOUBLE-LAYERED PATTERNABLE ADHESIVE FILM, METHOD OF FORMING THE SAME, AND METHOD OF FORMING PATTERNABLE ADHESIVE LAYER USING THE SAME 审中-公开
标题翻译：双层可分散胶粘膜，其形成方法和使用该方法形成不可分散粘合层的方法
公开(公告)号：US20110091811A1
公开(公告)日：2011-04-21
申请号：US12757229
申请日：2010-04-09
申请人： Sun Jin SONG , Chul Ho JEONG , Yong Seok HAN , Yi Yeol LYU
发明人： Sun Jin SONG , Chul Ho JEONG , Yong Seok HAN , Yi Yeol LYU
IPC分类号： G03F7/20 , B05D1/36 , H05K3/00 , H01L21/46 , G03C1/00
CPC分类号： H05K3/305 , C09J7/35 , C09J2201/28 , C09J2201/36 , C09J2433/00 , G03F7/027 , G03F7/033 , G03F7/035 , G03F7/09 , G03F7/40 , H01L24/28 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01051 , H01L2924/01056 , H01L2924/01072 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H01L2924/15788 , H05K2201/0195 , H05K2203/0525 , Y02P70/613 , H01L2924/01083 , H01L2924/00
摘要： A patternable adhesive film is formed in a double-layered structure of an adhesive layer having patternability and an adhesive layer having both adhesion and developability. Thus, the double-layered patternable adhesive film can effectively have both patternability and adhesion.
摘要翻译：以具有图案性的粘合剂层和具有粘合性和显影性的粘合剂层的双层结构形成可图案化的粘合剂膜。因此，双层可图案的粘合剂膜可以有效地具有图案化和粘附性。

7. 发明申请

US20100197821A1 ADHESIVE COMPOSITION AND ADHESIVE FILM MADE THEREFROM 失效
标题翻译：胶粘组合物和粘合胶片
公开(公告)号：US20100197821A1
公开(公告)日：2010-08-05
申请号：US12539303
申请日：2009-08-11
申请人： Chul Ho JEONG , Yi Yeol LYU , Sun Jin SONG
发明人： Chul Ho JEONG , Yi Yeol LYU , Sun Jin SONG
IPC分类号： C08F2/50 , C09J135/02
CPC分类号： C09J133/14 , C08L33/08 , C08L33/14 , C08L2666/02 , C08L2666/04 , C09J4/00 , C09J133/08 , C09J167/00
摘要： Disclosed is an adhesive composition including a compound having a multi-functional urethane (meth)acrylate group and an adhesive film prepared by using it. The adhesive composition includes compounds represented by Chemical Formulae 1 to 3. The compound represented by Chemical Formulae 1 to 3 includes an urethane (meth)acrylate group represented by the Chemical Formula 1-1 or 1-2.
摘要翻译：公开了一种粘合剂组合物，其包含具有多官能氨基甲酸酯（甲基）丙烯酸酯基团的化合物和使用它制备的粘合剂膜。粘合剂组合物包括由化学式1至3表示的化合物。化学式1至3表示的化合物包括由化学式1-1或1-2表示的氨基甲酸酯（甲基）丙烯酸酯基团。

8. 发明申请

US20080090627A1 MOBILE COMMUNICATION TERMINAL 有权
标题翻译：移动通信终端
公开(公告)号：US20080090627A1
公开(公告)日：2008-04-17
申请号：US11871763
申请日：2007-10-12
申请人： Chul Ho JEONG , Kyung Taek Lim
发明人： Chul Ho JEONG , Kyung Taek Lim
IPC分类号： H04M1/00
CPC分类号： H04M1/0237
摘要： A mobile communication terminal is provided. The mobile communication terminal includes a first body, a second body slidably moveable between a first position and a second position, a plate located between the first body and the second body, the plate being connected to one of the first body and the second body, a slider supported by the plate to be slidably moveable thereon, the slider being connected to the other of the first body and the second body. An elastic supporter may be located on at least one of the plate and a first surface of the slider. A buffering part may be located on the slider. Alternatively, the buffering part may be located on one of the first body and the second body.
摘要翻译：提供移动通信终端。移动通信终端包括第一主体，可在第一位置和第二位置之间可滑动地移动的第二主体，位于第一主体与第二主体之间的板，该板连接到第一主体和第二主体之一，由所述板支撑以可滑动地移动的滑块，所述滑块连接到所述第一主体和所述第二主体中的另一个。弹性支撑件可以位于板的至少一个和滑块的第一表面上。缓冲部分可以位于滑块上。或者，缓冲部可以位于第一主体和第二主体中的一个上。

9. 发明申请

US20120264963A1 PHOTOCURABLE COMPOUND 审中-公开
标题翻译：光电化合物
公开(公告)号：US20120264963A1
公开(公告)日：2012-10-18
申请号：US13492340
申请日：2012-06-08
申请人： Yi Yeol LYU , Chul Ho JEONG , Sun Jin SONG
发明人： Yi Yeol LYU , Chul Ho JEONG , Sun Jin SONG
IPC分类号： C07C271/54 , C07F7/10
CPC分类号： C07C271/48 , C07F7/081 , C07F7/10 , C08F220/36 , C08F222/1006
摘要： Disclosed is a compound having a photocurable urethane(meth)acrylate group, its manufacturing method, and a photocurable composition including the compound. The compound is represented by Chemical Formulae 1 to 6. Each of Chemical Formulae 1 to 6 includes a urethane(meth)acrylate group represented by Chemical Formula 1-1 or 1-2.
摘要翻译：公开了具有可光固化的氨基甲酸酯（甲基）丙烯酸酯基的化合物，其制造方法和包含该化合物的光固化性组合物。化合物由化学式1〜6表示。化学式1〜6各自包含由化学式1-1或1-2表示的氨基甲酸酯（甲基）丙烯酸酯基。

10. 发明申请

US20100197876A1 PHOTOCURABLE COMPOUND 有权
标题翻译：光电化合物
公开(公告)号：US20100197876A1
公开(公告)日：2010-08-05
申请号：US12539326
申请日：2009-08-11
申请人： Yi Yeol LYU , Chul Ho JEONG , Sun Jin SONG
发明人： Yi Yeol LYU , Chul Ho JEONG , Sun Jin SONG
IPC分类号： C08F20/06
CPC分类号： C07C271/48 , C07F7/081 , C07F7/10 , C08F220/36 , C08F222/1006
摘要： Disclosed is a compound having a photocurable urethane (meth)acrylate group, its manufacturing method, and a photocurable composition including the compound. The compound is represented by Chemical Formulae 1 to 6. Each of Chemical Formulae 1 to 6 includes a urethane (meth)acrylate group represented by Chemical Formula 1-1 or 1-2.
摘要翻译：公开了具有可光固化的氨基甲酸酯（甲基）丙烯酸酯基的化合物，其制造方法和包含该化合物的光固化性组合物。化合物由化学式1〜6表示。化学式1〜6各自包含由化学式1-1或1-2表示的氨基甲酸酯（甲基）丙烯酸酯基。

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