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1. 发明申请

US20120175790A1 COMPOSITION FOR PATTERNABLE ADHESIVE FILM, PATTERNABLE ADHESIVE FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME 审中-公开
标题翻译：用于图案胶粘膜的组合物，可压电胶片和使用其制造半导体包装的方法
公开(公告)号：US20120175790A1
公开(公告)日：2012-07-12
申请号：US13198811
申请日：2011-08-05
申请人： Yong Seok HAN , Joon Yong PARK , Jae Jun LEE , Chul Ho JEONG
发明人： Yong Seok HAN , Joon Yong PARK , Jae Jun LEE , Chul Ho JEONG
IPC分类号： C08L33/08 , H01L21/02 , H01L23/00
CPC分类号： H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： A composition for a patternable adhesive film, a patternable adhesive film having the same, and a method of manufacturing a semiconductor package using the patternable adhesive film are provided. The composition contains a binder resin, a radical-polymerizable acrylate monomer, a photo-radical initiator, and a thermal-radical initiator without an epoxy resin. The composition may have good patternability, adhesiveness, and low-temperature stability, and be rapidly cured at a low temperature.
摘要翻译：提供了一种可图案化粘合剂膜的组合物，具有该组合物的可图案的粘合膜，以及使用该可图案的粘合剂膜制造半导体封装的方法。组合物含有粘合剂树脂，可自由基聚合的丙烯酸酯单体，光自由基引发剂和没有环氧树脂的热自由基引发剂。组合物可以具有良好的图案性，粘合性和低温稳定性，并且可以在低温下快速固化。

2. 发明申请

US20120181702A1 PHOTOSENSITIVE ADHESIVE COMPOSITION HAVING ALKALI SOLUBLE EPOXY RESIN, AND PATTERNABLE ADHESIVE FILM USING THE SAME 审中-公开
标题翻译：具有ALKALI可溶性环氧树脂的光敏性粘合剂组合物和使用该粘合剂的不透水胶膜
公开(公告)号：US20120181702A1
公开(公告)日：2012-07-19
申请号：US13224636
申请日：2011-09-02
申请人： Jae Jun LEE , Joon Yong PARK , Chul Ho JEONG , Yong Seok HAN
发明人： Jae Jun LEE , Joon Yong PARK , Chul Ho JEONG , Yong Seok HAN
IPC分类号： H01L23/538 , G03F7/028
CPC分类号： C08G59/3209 , C08F2220/325 , C08L33/06 , C08L61/06 , C08L75/04 , C09J163/00 , G03F7/033 , G03F7/038 , G03F7/0388
摘要： Provided are a photosensitive adhesive composition having an alkali soluble epoxy resin and a patternable adhesive film using the same. The photosensitive adhesive composition has good pattern formability and adhesiveness since the photosensitive adhesive composition includes the alkali soluble epoxy resin.
摘要翻译：提供具有碱溶性环氧树脂的感光性粘合剂组合物和使用其的可图案化粘合膜。感光性粘合剂组合物由于感光性粘接剂组合物含有碱溶性环氧树脂，因此具有良好的图案形成性和粘合性。

3. 发明申请

US20120181686A1 METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体封装的制备方法和半导体封装的半导体器件
公开(公告)号：US20120181686A1
公开(公告)日：2012-07-19
申请号：US13303938
申请日：2011-11-23
申请人： Joon Yong PARK , Yong Seok HAN , Jae Jun LEE , Chul Ho JEONG
发明人： Joon Yong PARK , Yong Seok HAN , Jae Jun LEE , Chul Ho JEONG
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L21/561 , H01L21/486 , H01L21/6835 , H01L21/6836 , H01L23/147 , H01L23/3114 , H01L23/49827 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/03002 , H01L2224/0345 , H01L2224/0401 , H01L2224/0557 , H01L2224/05571 , H01L2224/11002 , H01L2224/11009 , H01L2224/1146 , H01L2224/13009 , H01L2224/13021 , H01L2224/13025 , H01L2224/13082 , H01L2224/13111 , H01L2224/13116 , H01L2224/16145 , H01L2224/16225 , H01L2224/27002 , H01L2224/27009 , H01L2224/27416 , H01L2224/27422 , H01L2224/27436 , H01L2224/27515 , H01L2224/27622 , H01L2224/2781 , H01L2224/2919 , H01L2224/30181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73103 , H01L2224/73204 , H01L2224/81801 , H01L2224/83855 , H01L2224/9211 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/1434 , H01L2924/15311 , H01L2924/181 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/05552
摘要： A method of preparing a semiconductor package including disposing photosensitive adhesive film on a reinterconnected rear surface of a wafer on which the through electrodes are disposed, and forming a pattern corresponding to the through electrodes to prepare the semiconductor package.
摘要翻译：一种制备半导体封装件的方法，包括将感光性粘合剂膜设置在其上设置有通孔的晶片的再连接后表面上，并且形成与通孔电极对应的图案以制备半导体封装。

4. 发明申请

US20120181703A1 PATTERNABLE ADHESIVE COMPOSITION, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE 有权
标题翻译：可压电胶组合物，使用其的半导体封装以及制造半导体封装的方法
公开(公告)号：US20120181703A1
公开(公告)日：2012-07-19
申请号：US13291588
申请日：2011-11-08
申请人： Joon-Yong PARK , Yong Seok HAN , Jae Jun LEE , Chul Ho JEONG
发明人： Joon-Yong PARK , Yong Seok HAN , Jae Jun LEE , Chul Ho JEONG
IPC分类号： H01L23/48 , C09J133/06 , H01L21/301
CPC分类号： H01L24/81 , C09J133/06 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05009 , H01L2224/05568 , H01L2224/05571 , H01L2224/06181 , H01L2224/13009 , H01L2224/13021 , H01L2224/13082 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/27436 , H01L2224/27515 , H01L2224/27622 , H01L2224/2781 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73103 , H01L2224/73204 , H01L2224/8181 , H01L2224/83855 , H01L2224/9211 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/1434 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
摘要： A patternable adhesive composition including at least one alkali soluble resin including an alkali soluble group and an acryloyl group, at least one radically polymerizable compound, at least one thermosettable compound, and at least one photo-radical initiator.
摘要翻译：包含至少一种包括碱溶性基团和丙烯酰基的碱溶性树脂，至少一种自由基聚合性化合物，至少一种可热固化合物和至少一种光自由基引发剂的图案化粘合剂组合物。

5. 发明申请

US20120135251A1 PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME 审中-公开
标题翻译：具有硅改性基团的粘合性聚酰亚胺，粘合组合物和包括其的半导体包装
公开(公告)号：US20120135251A1
公开(公告)日：2012-05-31
申请号：US13165292
申请日：2011-06-21
申请人： Chul Ho JEONG , Joon Yong PARK , Jae Jun LEE , Yong Seok HAN , Mi Jeong SONG
发明人： Chul Ho JEONG , Joon Yong PARK , Jae Jun LEE , Yong Seok HAN , Mi Jeong SONG
IPC分类号： B32B7/12 , C09J179/08 , B32B15/088 , C08G73/10
CPC分类号： C09J179/08 , C08G73/1025 , H01L23/293 , H01L24/29 , H01L2224/2919 , H01L2924/12041 , H01L2924/12044 , Y10T428/31721 , H01L2924/00
摘要： A photosensitive polyimide and an adhesive composition and adhesive film containing the same are provided. The photosensitive polyimide has an imide backbone and grafted side chains including a methacrylate-based side chain and a silicon-modified side chain.
摘要翻译：提供感光性聚酰亚胺和含有它们的粘合剂组合物和粘合剂膜。光敏聚酰亚胺具有酰亚胺主链和包含甲基丙烯酸酯侧链和硅改性侧链的接枝侧链。

6. 发明申请

US20090066386A1 MTCMOS FLIP-FLOP WITH RETENTION FUNCTION 审中-公开
标题翻译：具有保留功能的MTCMOS FLIP-FLOP
公开(公告)号：US20090066386A1
公开(公告)日：2009-03-12
申请号：US12195075
申请日：2008-08-20
申请人： Jae Jun LEE
发明人： Jae Jun LEE
IPC分类号： H03K3/289
CPC分类号： H03K3/35625 , H03K3/012
摘要： There is provided a MTCMOS flip-flop configured to operate at high speed and to reduce leakage current while realizing a retention function in a sleep mode. The MTCMOS flip-flop may include a signal generator adapted to output an internal clock signal or a sleep mode control signal based on changes in a retention signal and an external clock signal, a master latch adapted to latch an input signal and to output a master latch output signal based on the internal clock signal, and a slave latch connected to an actual ground and adapted to latch the master latch signal, to output a slave latch output signal under control of the internal clock signal, and to maintain the latched signal under control of the sleep mode control signal in the sleep mode.
摘要翻译：提供了一种MTCMOS触发器，配置为在休眠模式下实现保持功能，高速运行并减少漏电流。 MTCMOS触发器可以包括适于基于保持信号和外部时钟信号的改变来输出内部时钟信号或睡眠模式控制信号的信号发生器，适于锁存输入信号的主锁存器和输出主器件基于内部时钟信号的锁存输出信号，以及连接到实际地线并适于锁存主锁存信号的从锁存器，在内部时钟信号的控制下输出从锁存器输出信号，并将锁存信号保持在在休眠模式下控制睡眠模式控制信号。

7. 发明申请

US20090075207A1 NORBORNENE POLYMER FOR PHOTORESIST AND PHOTORESIST COMPOSITION COMPRISING THE SAME 有权
标题翻译：用于光刻胶的NORBENNENE聚合物和包含它们的光催化组合物
公开(公告)号：US20090075207A1
公开(公告)日：2009-03-19
申请号：US12272168
申请日：2008-11-17
申请人： Jae Jun LEE , Do Yun KIM , Myung Sup JUNG
发明人： Jae Jun LEE , Do Yun KIM , Myung Sup JUNG
IPC分类号： G03F7/004 , G03F7/20
CPC分类号： G03F7/0395 , C08F232/08 , G03F7/40 , Y10S430/106
摘要： Disclosed herein is a photoresist composition which includes a norbornene copolymer having an epoxy group, an acid generator, and an organic solvent. The norbornene polymer shows superior mechanical and thermal properties, high transparency, excellent insulating properties, and particularly, improved mechanical properties due to the presence of an epoxy group. The photosensitive resin composition shows superior performance, e.g., transparence, developing properties, residual film characteristics, chemical resistance, heat resistance, and flatness. Particularly, since the photosensitive resin composition enables easy formation of a pattern as an interlayer insulating film and shows a high light transmittance even when being formed into a thin film with a relatively large thickness, it is suitable for the production of an interlayer insulating film used in the fabrication processes of LCDs.
摘要翻译：本文公开了包含具有环氧基的降冰片烯共聚物，酸产生剂和有机溶剂的光致抗蚀剂组合物。降冰片烯聚合物显示出优异的机械和热性能，高透明度，优异的绝缘性能，特别是由于存在环氧基团而改善的机械性能。感光性树脂组合物显示出优异的性能，例如透明性，显影性，残留膜特性，耐化学性，耐热性和平坦性。特别是，由于感光性树脂组合物能够容易地形成作为层间绝缘膜的图案，并且即使形成厚度较薄的薄膜也显示高透光性，因此适用于制造使用的层间绝缘膜在LCD的制造过程中。

8. 发明申请

US20100155120A1 THERMOSETTING OLIGOMER OR POLYMER, THERMOSETTING RESIN COMPOSITION INCLUDING THE OLIGOMER OR POLYMER, AND PRINTED CIRCUIT BOARD USING THE COMPOSITION 有权
标题翻译：热固性低聚物或聚合物，包括低聚物或聚合物的热固化树脂组合物和使用组合物印刷的电路板
公开(公告)号：US20100155120A1
公开(公告)日：2010-06-24
申请号：US12489881
申请日：2009-06-23
申请人： Jae Jun LEE , Mahn Jong KIM , Kwang Hee KIM
发明人： Jae Jun LEE , Mahn Jong KIM , Kwang Hee KIM
IPC分类号： H05K1/00 , C08G73/10 , C08L33/24
CPC分类号： C08G73/101 , C08G63/685 , C08G73/026 , C08J5/24 , C08J2377/12 , C08J2379/08 , H05K1/032 , Y10T428/16 , Y10T428/238 , Y10T428/23914 , Y10T428/24595 , Y10T428/24645 , Y10T428/31551 , Y10T428/31725 , Y10T428/31786
摘要： A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1: where repeating units include X1, A1, and Y1 subunits, sidechain units include linking unit L and thermosetting functional group Z, and n is an integer from 1 to 4. The thermosetting oligomer or thermosetting polymer has a low coefficient of thermal expansion and high or no glass transition temperature, stiffness, processability, heat resistance and mechanical properties. The thermosetting oligomer or thermosetting polymer is highly soluble, wettable and dimensionally stable and is suitable for use in films, prepregs and printed circuit boards. Further provided are a thermosetting resin composition including the thermosetting oligomer or thermosetting polymer and a printed circuit board using the composition.
摘要翻译：提供了一种热固性低聚物或热固性聚合物。热固性低聚物或热固性聚合物含有重复单元，每个重复单元在侧链中具有至少一个热固性官能团，由式1表示：其中重复单元包括X1，A1和Y1亚基，侧链单元包括连接单元L和热固性官能团Z，n为1至4的整数。热固性低聚物或热固性聚合物具有低的热膨胀系数，高玻璃化转变温度，刚度，加工性，耐热性和机械性能。热固性低聚物或热固性聚合物是高度可溶的，可湿润的和尺寸稳定的并且适用于薄膜，预浸料和印刷电路板。还提供了包含热固性低聚物或热固性聚合物的热固性树脂组合物和使用该组合物的印刷电路板。

9. 发明申请

US20100139961A1 COMPOSITION FOR PRODUCING A BOARD AND PRINTED CIRCUIT BOARD USING THE SAME 有权
标题翻译：用于制造板和印刷电路板的组合物
公开(公告)号：US20100139961A1
公开(公告)日：2010-06-10
申请号：US12633127
申请日：2009-12-08
申请人： Kwang Hee KIM , Myung Sup JUNG , Chung Kun CHO , Jae Jun LEE , Kalinina FEDOSYA
发明人： Kwang Hee KIM , Myung Sup JUNG , Chung Kun CHO , Jae Jun LEE , Kalinina FEDOSYA
IPC分类号： H05K1/00 , C08G69/48 , C08G65/32 , C09K19/32 , B32B15/08 , B32B15/092 , H05K1/16
CPC分类号： C09K19/322 , B32B5/022 , B32B5/024 , B32B15/08 , B32B15/14 , B32B15/20 , B32B27/20 , B32B27/22 , B32B27/24 , B32B27/281 , B32B27/38 , B32B2260/021 , B32B2260/046 , B32B2262/0261 , B32B2262/0276 , B32B2262/101 , B32B2262/106 , B32B2264/0235 , B32B2264/10 , B32B2264/102 , B32B2270/00 , B32B2307/21 , B32B2307/306 , B32B2307/3065 , B32B2307/308 , B32B2307/402 , B32B2307/704 , B32B2307/71 , B32B2307/734 , B32B2457/08 , C08G69/44 , C08G69/48 , C08L81/06 , H05K1/0353 , H05K1/0366 , H05K2201/0141 , Y10T428/10 , Y10T428/1036 , Y10T428/31529 , Y10T428/31681
摘要： A composition, including a liquid crystal polymer or oligomer having a terminal hydroxyl group, and a cross-linking agent including a bismaleimide compound, an epoxy resin or a combination thereof, wherein the liquid crystal polymer or oligomer is represented by Formula 1: Z1-(R1)m—(R2)n-Z2 (1), wherein R1 is represented by Formula 2: —X1—Ar1—Y1— (2), wherein X1 and Y1 are each independently selected from the group consisting of O, CO and NR″, in which R″ is independently selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C20 alkyl group, and a substituted or unsubstituted C6-C30 aryl group, and Ar1 includes at least one divalent aromatic or alicyclic organic group selected from the group consisting of Formula 3:
摘要翻译：包括具有末端羟基的液晶聚合物或低聚物的组合物和包含双马来酰亚胺化合物，环氧树脂或其组合的交联剂，其中液晶聚合物或低聚物由式1表示：Z1- （R1）m-（R2）n-Z2（1）其中R1由式2表示：-X1-Ar1-Y1-（2），其中X1和Y1各自独立地选自O，CO 和NR“，其中R”独立地选自氢原子，取代或未取代的C 1 -C 20烷基和取代或未取代的C 6 -C 30芳基，Ar 1包括至少一个二价芳族或选自式3的脂环族有机基团：

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