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1. 发明申请

US20060162748A1 Wafer guide and semiconductor wafer drying apparatus using the same 审中-公开
标题翻译：晶圆导向器和半导体晶片干燥装置使用它
公开(公告)号：US20060162748A1
公开(公告)日：2006-07-27
申请号：US11340325
申请日：2006-01-25
申请人： Jong-Jae Lee , Seung-Kun Lee , Man-Young Lee , Jae-Heung Jung , Yang-Ryul Park , Kyun-Tak Baek , Sung-Kook Choi
发明人： Jong-Jae Lee , Seung-Kun Lee , Man-Young Lee , Jae-Heung Jung , Yang-Ryul Park , Kyun-Tak Baek , Sung-Kook Choi
IPC分类号： B08B3/00 , A47G19/08
CPC分类号： H01L21/67313 , H01L21/67034
摘要： A wafer guide and a semiconductor wafer drying apparatus using the same are disclosed. The wafer guide includes a body and supporters formed on the body. The supporters present a plurality of grooves to engage and support a periphery of a wafer. A discharge structure, e.g., a discharging hole, promotes flow of a cleaning solution away from the grooves thereby more effectively drying the wafer by more readily discharging the cleaning solution by way of the discharging structure. The discharging structure reduces undesirable accumulation of the cleaning solution, such as deionized water, in the grooves during a wafer cleaning process. In some embodiments, a pump actively draws fluid away from the discharge structure.
摘要翻译：公开了一种晶片引导件和使用其的半导体晶片干燥装置。晶片引导件包括形成在主体上的主体和支撑件。支持者呈现多个槽以接合和支撑晶片的周边。诸如排放孔的排出结构促进清洁溶液远离凹槽的流动，从而通过更容易地通过排出结构排出清洁溶液更有效地干燥晶片。排出结构在晶片清洁过程中减少了在凹槽中的清洁溶液（例如去离子水）的不期望的积聚。在一些实施例中，泵主动地将流体从排放结构中吸取流体。

2. 发明申请

US20070081886A1 System and method for transferring and aligning wafers 审中-公开
标题翻译：用于传送和对准晶片的系统和方法
公开(公告)号：US20070081886A1
公开(公告)日：2007-04-12
申请号：US11523573
申请日：2006-09-20
申请人： Young-Kwang Myoung , Seung-Kun Lee , Man-Young Lee
发明人： Young-Kwang Myoung , Seung-Kun Lee , Man-Young Lee
IPC分类号： B65H1/00
CPC分类号： H01L21/67772 , H01L21/67775
摘要： There is provided a method and system for transferring wafers. Wafers in a FOUP are horizontally aligned by vibrating the FOUP before unloading the wafers from the FOUP. Thereafter, a mapping process may be accurately performed, and the wafers stably unloaded from the FOUP.
摘要翻译：提供了用于转移晶片的方法和系统。在从FOUP卸载晶片之前，FOUP中的晶片通过振动FOUP而水平对准。此后，可以精确地执行映射处理，并且晶片从FOUP稳定地卸载。

3. 发明申请

US20050139240A1 Rinsing and drying apparatus having rotatable nozzles and methods of rinsing and drying semiconductor wafers using the same 审中-公开
标题翻译：具有可旋转喷嘴的冲洗和干燥设备以及使用其的冲洗和干燥半导体晶片的方法
公开(公告)号：US20050139240A1
公开(公告)日：2005-06-30
申请号：US11002624
申请日：2004-12-03
申请人： Woon-Geun Bong , Seung-Kun Lee , Man-Young Lee
发明人： Woon-Geun Bong , Seung-Kun Lee , Man-Young Lee
IPC分类号： H01L21/304 , B08B3/02 , H01L21/00
CPC分类号： H01L21/67051 , B08B3/02 , H01L21/67028
摘要： Rinsing and drying apparatus having rotatable drying source nozzles and methods of rinsing and drying semiconductor wafers are provided. The apparatus includes a bath for storing liquid and rotatable nozzles disposed over the bath. The semiconductor wafers are rinsed using de-ionized water inside the bath. After the rinsing process, de-ionized water is drained. A drying source is then sprayed onto the semiconductor wafers through the rotatable nozzles. The nozzles are oscillated and/or rotated while the drying source is sprayed.
摘要翻译：提供具有可旋转干燥源喷嘴的冲洗和干燥装置以及冲洗和干燥半导体晶片的方法。该装置包括用于存储液体的浴槽和设置在浴槽上方的可旋转喷嘴。半导体晶片使用洗涤槽内的去离子水冲洗。在冲洗过程之后，去离子水被排出。然后通过可旋转喷嘴将干燥源喷射到半导体晶片上。当喷雾干燥源时，喷嘴振荡和/或旋转。

4. 发明申请

US20050000652A1 Apparatus and method for treating edge of substrate 有权
标题翻译：用于处理基材边缘的装置和方法
公开(公告)号：US20050000652A1
公开(公告)日：2005-01-06
申请号：US10884533
申请日：2004-07-02
申请人： Chaqng-Hyeon Nam , Seung-Kim Lee , Man-Young Lee , Yoon-Kyung Kim , Han-Yong Chae , Duk-Min Ahn
发明人： Chaqng-Hyeon Nam , Seung-Kim Lee , Man-Young Lee , Yoon-Kyung Kim , Han-Yong Chae , Duk-Min Ahn
IPC分类号： H01L21/304 , H01L21/00
CPC分类号： H01L21/6708 , H01L21/67046 , Y10S134/902
摘要： An apparatus for treating an edge of a semiconductor substrate includes an etchant supply nozzle for supplying a first etchant to the edge of the semiconductor substrate. The apparatus further includes a shielding cover for preventing an etchant from flowing to a shielding surface of the semiconductor substrate. The shielding cover is movable in an upward and downward direction. The apparatus also includes a device for cleaning the edge of the semiconductor substrate. According to the apparatus, after a wafer edge is etched, foreign substances remaining at the wafer edge is efficiently removed.
摘要翻译：用于处理半导体衬底的边缘的设备包括用于向半导体衬底的边缘提供第一蚀刻剂的蚀刻剂供应喷嘴。该装置还包括用于防止蚀刻剂流向半导体衬底的屏蔽表面的屏蔽盖。屏蔽盖可以向上和向下移动。该装置还包括用于清洁半导体衬底的边缘的装置。根据该装置，在蚀刻晶片边缘之后，有效地去除残留在晶片边缘的异物。

5. 发明授权

US06742281B2 Apparatus for drying semiconductor wafer using vapor dry method 失效
标题翻译：使用蒸汽干燥法干燥半导体晶片的设备
公开(公告)号：US06742281B2
公开(公告)日：2004-06-01
申请号：US10382350
申请日：2003-03-04
申请人： Myung-Hwan Shin , Man-Young Lee , Kyung-Seuk Hwang
发明人： Myung-Hwan Shin , Man-Young Lee , Kyung-Seuk Hwang
IPC分类号： F26B308
CPC分类号： H01L21/67034
摘要： A semiconductor wafer drying apparatus is provided. In one embodiment, this apparatus includes a bath which can contain much deionized water so that semiconductor wafers soak in the deionized water; a chamber providing a space where vapor flows over the bath; a vapor supply line supplying vapor to the internal space of the chamber; an exhaust line discharging vapor contained in the chamber; a deionized water exhaust line discharging deionized water in the bath; a semiconductor wafer holder supporting the semiconductor wafer in the bath; and pitch guides placed at left and right sides of the semiconductor wafer, movable to a first position and a second position in a vertical direction, wherein the pitch guides are separated from the semiconductor wafer at the first position and contact the semiconductor wafer at the second position thus preventing the movement of the semiconductor wafer.
摘要翻译：提供半导体晶片干燥装置。在一个实施例中，该装置包括可以含有大量去离子水的浴，使得半导体晶片浸泡在去离子水中; 一个提供蒸气在浴缸上流动的空间的室; 蒸汽供应管线，供应蒸气到室的内部空间; 排出管，其排出容纳在所述室内的蒸气; 去离子水排出管线在浴中排放去离子水; 半导体晶片保持器，其将所述半导体晶片支撑在所述槽中; 以及设置在半导体晶片的左侧和右侧的俯仰引导件，其可在第一位置处移动到第一位置和第二位置，其中所述俯仰引导件在第一位置处与半导体晶片分离并且在第二位置处接触半导体晶片从而防止半导体晶片的移动。

6. 发明授权

US07166183B2 Apparatus and method for treating edge of substrate 有权
标题翻译：用于处理基材边缘的装置和方法
公开(公告)号：US07166183B2
公开(公告)日：2007-01-23
申请号：US10884533
申请日：2004-07-02
申请人： Chang-Hyeon Nam , Seung-Kim Lee , Man-Young Lee , Yoon-Kyung Kim , Han-Yong Chae , Duk-Min Ahn
发明人： Chang-Hyeon Nam , Seung-Kim Lee , Man-Young Lee , Yoon-Kyung Kim , Han-Yong Chae , Duk-Min Ahn
IPC分类号： H01L21/00 , B08B7/00
CPC分类号： H01L21/6708 , H01L21/67046 , Y10S134/902
摘要： An apparatus for treating an edge of a semiconductor substrate includes an etchant supply nozzle for supplying a first etchant to the edge of the semiconductor substrate. The apparatus further includes a shielding cover for preventing an etchant from flowing to a shielding surface of the semiconductor substrate. The shielding cover is movable in an upward and downward direction. The apparatus also includes a device for cleaning the edge of the semiconductor substrate. According to the apparatus, after a wafer edge is etched, foreign substances remaining at the wafer edge is efficiently removed.
摘要翻译：用于处理半导体衬底的边缘的设备包括用于向半导体衬底的边缘提供第一蚀刻剂的蚀刻剂供应喷嘴。该装置还包括用于防止蚀刻剂流向半导体衬底的屏蔽表面的屏蔽盖。屏蔽盖可以向上和向下移动。该装置还包括用于清洁半导体衬底的边缘的装置。根据该装置，在蚀刻晶片边缘之后，有效地去除残留在晶片边缘的异物。

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