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1. 发明申请

US20110115036A1 DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME 审中-公开
标题翻译：装置包装及其制造方法
公开(公告)号：US20110115036A1
公开(公告)日：2011-05-19
申请号：US12768551
申请日：2010-04-27
申请人： Jong Tae MOON , Jong-Hyun Lee , Dong Suk Jun , Hyun-cheol Bae , Sunghae Jung , Moo Jung Chu
发明人： Jong Tae MOON , Jong-Hyun Lee , Dong Suk Jun , Hyun-cheol Bae , Sunghae Jung , Moo Jung Chu
IPC分类号： H01L29/84 , H01L21/60 , H01L23/488
CPC分类号： H01L21/6835 , B81B2207/093 , B81B2207/097 , B81C1/00269 , B81C2203/0109 , B81C2203/0127 , B81C2203/019 , B81C2203/032 , B81C2203/035 , H01L23/04 , H01L23/10 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/01014 , H01L2924/01028 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1461 , H01L2924/16235 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a method for fabricating a device package. The method includes: preparing a substrate where respectively corresponding device structures and input and output pads are disposed on an active surface; preparing a carrier substrate where a metal lid corresponding to the device structure is disposed on one surface; and contacting the active surface of the substrate with the metal lid of the carrier substrate to cover and seal the device structure corresponding to the metal lid.
摘要翻译：提供了一种用于制造器件封装的方法。该方法包括：准备衬底，其中分别对应的器件结构和输入和输出焊盘设置在有源表面上; 准备载体基板，其中与所述装置结构相对应的金属盖设置在一个表面上; 并使基板的活性表面与载体基板的金属盖接触，以覆盖并密封与金属盖对应的装置结构。

2. 发明授权

US08044757B2 Electronic device including LTCC inductor 失效
标题翻译：电子器件包括LTCC电感
公开(公告)号：US08044757B2
公开(公告)日：2011-10-25
申请号：US12648117
申请日：2009-12-28
申请人： Hyun-Cheol Bae , Kwang-Seong Choi , Yong Sung Eom , Jong Tae Moon , Moo Jung Chu , Jong-Hyun Lee
发明人： Hyun-Cheol Bae , Kwang-Seong Choi , Yong Sung Eom , Jong Tae Moon , Moo Jung Chu , Jong-Hyun Lee
IPC分类号： H01F5/00 , H01F27/29 , H01F27/28 , H01L23/34 , H01L23/48
CPC分类号： H01F17/0013 , H01F2017/002 , H01L2224/48091 , H01L2224/73257 , H01L2924/19107 , H01L2924/00014
摘要： Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet.
摘要翻译：提供一种电子设备，其包括LTCC电感器，其包括设置在基板上的第一片，并且包括第一导电图案，设置在第一片上并包括第二导电图案的第二片，以及将第一导电图案电连接到第二导电图案和设置在第一片的下表面上的间隔件，以在基片和第一片之间提供气隙，其中第一导电图案从第一片的下表面露出。

3. 发明申请

US20110018670A1 ELECTRONIC DEVICE INCLUDING LTCC INDUCTOR 失效
标题翻译：包括LTCC电感器的电子器件
公开(公告)号：US20110018670A1
公开(公告)日：2011-01-27
申请号：US12648117
申请日：2009-12-28
申请人： Hyun-Cheol BAE , Kwang-Seong Choi , Yong Sung Eom , Jong Tae Moon , Moo Jung Chu , Jong-Hyun Lee
发明人： Hyun-Cheol BAE , Kwang-Seong Choi , Yong Sung Eom , Jong Tae Moon , Moo Jung Chu , Jong-Hyun Lee
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F2017/002 , H01L2224/48091 , H01L2224/73257 , H01L2924/19107 , H01L2924/00014
摘要： Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet.
摘要翻译：提供一种电子设备，其包括LTCC电感器，其包括设置在基板上的第一片，并且包括第一导电图案，设置在第一片上并包括第二导电图案的第二片，以及将第一导电图案电连接到第二导电图案和设置在第一片的下表面上的间隔件，以在基片和第一片之间提供气隙，其中第一导电图案从第一片的下表面露出。

4. 发明授权

US08030200B2 Method for fabricating a semiconductor package 有权
标题翻译：半导体封装的制造方法
公开(公告)号：US08030200B2
公开(公告)日：2011-10-04
申请号：US12565171
申请日：2009-09-23
申请人： Yong Sung Eom , Kwang-Seong Choi , Hyun-Cheol Bae , Jong-Hyun Lee , Jong Tae Moon
发明人： Yong Sung Eom , Kwang-Seong Choi , Hyun-Cheol Bae , Jong-Hyun Lee , Jong Tae Moon
IPC分类号： H01L21/44
CPC分类号： H01L24/81 , H01L21/486 , H01L21/563 , H01L23/29 , H01L23/293 , H01L23/49816 , H01L23/49827 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/1134 , H01L2224/1152 , H01L2224/73104 , H01L2224/73203 , H01L2224/81192 , H01L2224/818 , H01L2224/81801 , H01L2224/83194 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fabricating a semiconductor package, includes the steps of forming a first terminal at a first substrate; mixing a polymer resin and solder particles to provide a mixture; covering at least one of an upper surface and side surfaces of the first terminal with the mixture; and heating the first substrate at a temperature higher than a melting point of the solder particles of the mixture to form a solder layer that covers the at least one of an upper surface and a side surface of the first terminal. The solder particles flow or diffuse toward the terminal in the heated polymer resin to adhere to at least some of the exposed surfaces of the terminal thereby forming the solder layer. The solder layer improves the adhesive strength between the terminals of the semiconductor chip and the substrate in the subsequent flip chip bonding process.
摘要翻译：一种半导体封装的制造方法，包括在第一基板上形成第一端子的工序; 混合聚合物树脂和焊料颗粒以提供混合物; 用所述混合物覆盖所述第一端子的上表面和侧表面中的至少一个; 以及在高于混合物的焊料颗粒的熔点的温度下加热第一衬底，以形成覆盖第一端子的上表面和侧表面中的至少一个的焊料层。焊料颗粒朝向加热的聚合物树脂中的端子流动或扩散以粘附到端子的至少一些暴露表面，从而形成焊料层。焊料层在随后的倒装芯片接合工艺中提高了半导体芯片的端子与衬底之间的粘合强度。

5. 发明申请

US20100320596A1 METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME 有权
标题翻译：用于制造半导体封装的方法和使用该半导体封装的半导体封装
公开(公告)号：US20100320596A1
公开(公告)日：2010-12-23
申请号：US12565171
申请日：2009-09-23
申请人： Yong Sung Eom , Kwang-Seong Choi , Hyun-Cheol Bae , Jong-Hyun Lee , Jong Tae Moon
发明人： Yong Sung Eom , Kwang-Seong Choi , Hyun-Cheol Bae , Jong-Hyun Lee , Jong Tae Moon
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L24/81 , H01L21/486 , H01L21/563 , H01L23/29 , H01L23/293 , H01L23/49816 , H01L23/49827 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/1134 , H01L2224/1152 , H01L2224/73104 , H01L2224/73203 , H01L2224/81192 , H01L2224/818 , H01L2224/81801 , H01L2224/83194 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Provided is a method for fabricating semiconductor package and a semiconductor package fabricated using the same. The method for fabricating semiconductor package dopes a mixture including the polymer material and the solder particle on the substrate in which the terminal is formed and applies heat, and thus the solder particle flows (or diffuses) toward the terminal in the heated polymer resin to adhere to the exposed surface of the terminal, i.e., the side surface and upper surface of the terminal, thereby forming the solder layer. The solder layer improves the adhesive strength between the terminal of the semiconductor chip and the terminal of the substrate in the subsequent flip chip bonding process.
摘要翻译：提供一种制造半导体封装的方法和使用其制造的半导体封装。制造半导体封装的方法在形成端子的基板上涂覆包括聚合物材料和焊料颗粒的混合物，并施加热量，从而焊料颗粒向加热的聚合物树脂中的端子流动（或扩散）以粘附到端子的暴露表面，即端子的侧表面和上表面，从而形成焊料层。焊料层在随后的倒装芯片接合工艺中提高了半导体芯片的端子和衬底的端子之间的粘合强度。

6. 发明授权

US06822214B2 Optical signal receiving apparatus and method using the same 有权
标题翻译：光信号接收装置及其使用方法
公开(公告)号：US06822214B2
公开(公告)日：2004-11-23
申请号：US10283946
申请日：2002-10-30
申请人： Jin-Soo Han , Moo-Jung Chu , Jong-Hyun Lee
发明人： Jin-Soo Han , Moo-Jung Chu , Jong-Hyun Lee
IPC分类号： H01J4014
CPC分类号： H04B10/697
摘要： Provided are an optical signal receiving apparatus whose optimum receiving performance is maintained regardless of a change in the power of an optical signal, and a method using the same. The apparatus includes an optical coupler for dividing an input optical signal at a predetermined ratio to produce first and second divided signals, a photoelectric converter for converting the first divided signal into an electric signal, an amplifier for amplifying the electric signal within a predetermined range centering on a reference voltage, a reference voltage controlling unit for detecting the power of the second divided signal, predicting the power of the first divided signal, and controlling the amplitude of the reference voltage in accordance with the predicted power, and a clock & data recovery unit for recovering a clock signal and data from a signal output from the amplifier. Even if the power of an optical signal changes, the reference voltage of a limiting amplifier, which is best suitable for optimum performance with respect to the power of an input optical signal, can be detected and adjusted using the method and apparatus, thereby maintaining the optimum receiving performance of the optical signal receiving apparatus.
摘要翻译：提供了一种光信号接收装置及其使用方法的光接收装置，其优良的接收性能被保持，而与光信号的功率的变化无关。该装置包括用于以预定比例分割输入光信号以产生第一和第二分频信号的光耦合器，用于将第一划分信号转换为电信号的光电转换器，用于在预定范围内放大电信号的放大器对中在参考电压上，参考电压控制单元，用于检测第二分频信号的功率，预测第一分频信号的功率，并根据预测功率控制参考电压的振幅;以及时钟和数据恢复用于从放大器输出的信号中恢复时钟信号和数据的单元。即使光信号的功率发生变化，也可以使用该方法和装置来检测和调整限制放大器的参考电压，该极限放大器最适合于对于输入光信号的功率的最佳性能，从而保持光信号接收装置的最佳接收性能。

7. 发明申请

US20050046868A1 System for monitoring optical output/wavelength 失效
标题翻译：监控光输出/波长的系统
公开(公告)号：US20050046868A1
公开(公告)日：2005-03-03
申请号：US10802095
申请日：2004-03-15
申请人： Jong-Deog Kim , Byung-Seok Choi , Jong-Hyun Lee , Hogyeong Yun , Kwang-Seong Choi , Jong-Tae Moon
发明人： Jong-Deog Kim , Byung-Seok Choi , Jong-Hyun Lee , Hogyeong Yun , Kwang-Seong Choi , Jong-Tae Moon
IPC分类号： H04B10/08 , G01B9/02 , G02B6/34 , H01S5/024 , H01S5/0683
CPC分类号： H01S5/0612 , H01S5/0683 , H01S5/0687
摘要： A system for monitoring an optical output/wavelength is employed to be used for a WDM system having a narrow channel space by structuring an etalon and photodiode as an integrated structure. The system includes: a laser source control unit for controlling the laser source; an optical/wavelength monitoring unit for monitoring an optical output/wavelength of the controlled laser source; a TEC control unit for controlling a TEC in order to constantly maintain the laser source of the optical output/wavelength monitoring unit to have a predetermined temperature; a temperature control unit for controlling a heater and a thermistor to set an etalon to a predetermined temperature, wherein the heater is attached on the optical output/wavelength monitoring unit and the thermistor is attached on the heater; a comparison unit for comparing the optical output signal and the wavelength signal, each of which is monitored by the optical output/wavelength monitoring unit; and a processing unit for comparing values of the compared signals with a preset value to control an input current or a temperature of the laser source.
摘要翻译：用于监测光输出/波长的系统被用于通过构造标准具和光电二极管作为一体结构而具有窄通道空间的WDM系统。该系统包括：用于控制激光源的激光源控制单元; 用于监测受控激光源的光输出/波长的光/波长监测单元; 用于控制TEC的TEC控制单元，以便将光输出/波长监视单元的激光源恒定地保持为预定温度; 温度控制单元，用于控制加热器和热敏电阻以将标准具设定到预定温度，其中加热器安装在光输出/波长监测单元上，热敏电阻附着在加热器上; 比较单元，用于比较光输出信号和波长信号，每个波长信号由光输出/波长监测单元监视; 以及处理单元，用于将比较的信号的值与预设值进行比较，以控制激光源的输入电流或温度。

8. 发明授权

US07009716B2 System for monitoring optical output/wavelength 失效
标题翻译：监控光输出/波长的系统
公开(公告)号：US07009716B2
公开(公告)日：2006-03-07
申请号：US10802095
申请日：2004-03-15
申请人： Jong-Deog Kim , Byung-Seok Choi , Jong-Hyun Lee , Hogyeong Yun , Kwang-Seong Choi , Jong-Tae Moon
发明人： Jong-Deog Kim , Byung-Seok Choi , Jong-Hyun Lee , Hogyeong Yun , Kwang-Seong Choi , Jong-Tae Moon
IPC分类号： G01B9/02 , H01S3/04
CPC分类号： H01S5/0612 , H01S5/0683 , H01S5/0687
摘要： A system for monitoring an optical output/wavelength is employed to be used for a WDM system having a narrow channel space by structuring an etalon and photodiode as an integrated structure. The system includes: a laser source control unit for controlling the laser source; an optical/wavelength monitoring unit for monitoring an optical output/wavelength of the controlled laser source; a TEC control unit for controlling a TEC in order to constantly maintain the laser source of the optical output/wavelength monitoring unit to have a predetermined temperature; a temperature control unit for controlling a heater and a thermistor to set an etalon to a predetermined temperature, wherein the heater is attached on the optical output/wavelength monitoring unit and the thermistor is attached on the heater; a comparison unit for comparing the optical output signal and the wavelength signal, each of which is monitored by the optical output/wavelength monitoring unit; and a processing unit for comparing values of the compared signals with a preset value to control an input current or a temperature of the laser source.
摘要翻译：用于监测光输出/波长的系统被用于通过构造标准具和光电二极管作为一体结构而具有窄通道空间的WDM系统。该系统包括：用于控制激光源的激光源控制单元; 用于监测受控激光源的光输出/波长的光/波长监测单元; 用于控制TEC的TEC控制单元，以便将光输出/波长监视单元的激光源恒定地保持为预定温度; 温度控制单元，用于控制加热器和热敏电阻以将标准具设定到预定温度，其中加热器安装在光输出/波长监测单元上，热敏电阻附着在加热器上; 比较单元，用于比较光输出信号和波长信号，每个波长信号由光输出/波长监测单元监视; 以及处理单元，用于将比较的信号的值与预设值进行比较，以控制激光源的输入电流或温度。

9. 发明申请

US20060056775A1 Transceiver module and optical bench for passive alignment 有权
标题翻译：收发模块和被动对准的光学台
公开(公告)号：US20060056775A1
公开(公告)日：2006-03-16
申请号：US11226664
申请日：2005-09-13
申请人： Yong-Sung Eom , Jong-Tae Moon , Ho-Gyeong Yun , Byung-Seok Choi , Jong-Hyun Lee
发明人： Yong-Sung Eom , Jong-Tae Moon , Ho-Gyeong Yun , Byung-Seok Choi , Jong-Hyun Lee
IPC分类号： G02B6/36
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4204 , G02B6/423
摘要： The present invention provides a transceiver module having advantages of minimizing the number of optical parts by using an optical collimator to which a lens having the same shape as a diameter of an optical fiber is attached on a light input/output end. An transceiver module according to the present invention includes, laser diode for generating an optical signal to transmit, a first photodiode for controlling the laser diode, a second and third photodiodes for receiving an optical signal of a first and second wave lengths, and an optical collimator formed at a light input/output end. On the optical collimator, a lens having an optical fiber shape is attached in a direction the light proceeds.
摘要翻译：本发明提供了一种收发器模块，其具有通过使用具有与光纤的直径相同形状的透镜附着在光输入/输出端上的光学准直器来最小化光学部件的数量的优点。根据本发明的收发器模块包括：用于产生光信号以发射的激光二极管，用于控制激光二极管的第一光电二极管，用于接收第一和第二波长的光信号的第二和第三光电二极管;以及光在光输入/输出端形成的准直器。在光学准直仪上，沿着光进入的方向安装具有光纤形状的透镜。

10. 发明授权

US07520682B2 Transceiver module and optical bench for passive alignment 有权
标题翻译：收发模块和被动对准的光学台
公开(公告)号：US07520682B2
公开(公告)日：2009-04-21
申请号：US11226664
申请日：2005-09-13
申请人： Yong-Sung Eom , Jong-Tae Moon , Ho-Gyeong Yun , Byung-Seok Choi , Jong-Hyun Lee
发明人： Yong-Sung Eom , Jong-Tae Moon , Ho-Gyeong Yun , Byung-Seok Choi , Jong-Hyun Lee
IPC分类号： G02B6/36 , H04B10/12
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4204 , G02B6/423
摘要： The present invention provides a transceiver module having advantages of minimizing the number of optical parts by using an optical collimator to which a lens having the same shape as a diameter of an optical fiber is attached on a light input/output end. An transceiver module according to the present invention includes, laser diode for generating an optical signal to transmit, a first photodiode for controlling the laser diode, a second and third photodiodes for receiving an optical signal of a first and second wavelengths, and an optical collimator formed at a light input/output end. On the optical collimator, a lens having an optical fiber shape is attached in a direction the light proceeds.
摘要翻译：本发明提供了一种收发器模块，其具有通过使用具有与光纤的直径相同形状的透镜附着在光输入/输出端上的光学准直器来最小化光学部件的数量的优点。根据本发明的收发器模块包括：用于产生光信号以发射的激光二极管，用于控制激光二极管的第一光电二极管，用于接收第一和第二波长的光信号的第二和第三光电二极管，以及光学准直器形成在光输入/输出端。在光学准直仪上，沿着光进入的方向安装具有光纤形状的透镜。

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