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1. 发明授权

US09551066B2 High-power pulsed magnetron sputtering process as well as a high-power electrical energy source 有权
标题翻译：大功率脉冲磁控溅射工艺以及大功率电能源
公开(公告)号：US09551066B2
公开(公告)日：2017-01-24
申请号：US12510543
申请日：2009-07-28
申请人： Jones Alami , Georg Erkens , Jürgen Müller , Jörg Vetter
发明人： Jones Alami , Georg Erkens , Jürgen Müller , Jörg Vetter
IPC分类号： C23C14/34 , C23C14/35 , C23C14/06 , H01J37/34 , H01J37/02
CPC分类号： C23C14/3485 , C23C14/06 , C23C14/35 , H01J37/026 , H01J37/3408 , H01J37/3444 , H01J37/3467
摘要： A high-power pulsed magnetron sputtering process, wherein within a process chamber by means of an electrical energy source a sequence of complex discharge pulses is produced by applying an electrical voltage between an anode and a cathode in order to ionize a sputtering gas. The complex discharge pulse is applied for a complex pulse time. The cathode has a target comprising a material to be sputtered for the coating of a substrate, and the complex discharge pulse includes an electrical high-power sputtering pulse having a negative polarity with respect to the anode and being applied for a first pulse-time, the high-power sputtering pulse being followed by an electrical low-power charge cleaning pulse having a positive polarity with respect to the anode and being applied for a second pulse-time. The ratio τ1/τ2 of the first pulse-time (τ1) in proportion to the second pulse-time (τ2) is 0.5 at the most.
摘要翻译：一种高功率脉冲磁控溅射工艺，其中通过电能源在处理室内，通过在阳极和阴极之间施加电压来产生一系列复杂的放电脉冲，以便电离溅射气体。复合放电脉冲施加于复数脉冲时间。阴极具有包括用于涂覆基板的溅射材料的靶，并且复合放电脉冲包括相对于阳极具有负极性并被施加第一脉冲时间的电高功率溅射脉冲，高功率溅射脉冲之后是相对于阳极具有正极性并被施加第二脉冲时间的电低功率电荷清除脉冲。与第二脉冲时间（τ2）成比例的第一脉冲时间（τ1）的比率τ1/τ2最多为0.5。

2. 发明申请

US20100236919A1 High-Power Pulsed Magnetron Sputtering Process As Well As A High-Power Electrical Energy Source 有权
标题翻译：大功率脉冲磁控溅射工艺以及大功率电能源
公开(公告)号：US20100236919A1
公开(公告)日：2010-09-23
申请号：US12510543
申请日：2009-07-28
申请人： Jones Alami , Georg Erkens , Jürgen Müller , Jörg Vetter
发明人： Jones Alami , Georg Erkens , Jürgen Müller , Jörg Vetter
IPC分类号： C23C14/35
CPC分类号： C23C14/3485 , C23C14/06 , C23C14/35 , H01J37/026 , H01J37/3408 , H01J37/3444 , H01J37/3467
摘要： The invention relates to a high-power pulsed magnetron sputtering process (1), wherein within a process chamber (2) by means of an electrical energy source (3) a sequence of complex discharge pulses (4) is produced by applying an electrical voltage (V) between an anode (5) and a cathode (6) in order to ionize a sputtering gas (7). Said complex discharge pulse (4) is applied for a complex pulse time (τ). The cathode (6) has a target (8) comprising a material to be sputtered for the coating of a substrate (9), and said complex discharge pulse (4) includes an electrical high-power sputtering pulse (10) having a negative polarity with respect to the anode (5) and being applied for a first pulse-time (τ1), the high-power sputtering pulse (10) being followed by an electrical low-power charge cleaning pulse (11) having a positive polarity with respect to the anode (5) and being applied for a second pulse-time (τ2). According to the present invention, a ratio τ1/τ2 of the first pulse-time (τ1) in proportion to the second pulse-time (τ2) is 0.5 at the most. The invention relates furthermore to a high-power electrical energy source (3) for producing a complex discharge pulse (4) for carrying out a process in accordance with the present invention
摘要翻译：本发明涉及一种大功率脉冲磁控溅射工艺（1），其中通过电能源（3）在处理室（2）内，通过施加电压来产生一系列复合放电脉冲（4）（V）在阳极（5）和阴极（6）之间，以便电离溅射气体（7）。所述复合放电脉冲（4）用于复数脉冲时间（τ）。阴极（6）具有包含用于涂覆基板（9）的要被溅射的材料的靶（8），并且所述复合放电脉冲（4）包括具有负极性的电高功率溅射脉冲（10）相对于阳极（5）并施加第一脉冲时间（τ1），大功率溅射脉冲（10）之后是具有正极性的电力低功率电荷清除脉冲（11），相对于到阳极（5）并施加第二脉冲时间（τ2）。根据本发明，与第二脉冲时间（τ2）成比例的第一脉冲时间（τ1）的比率τ1/τ2最多为0.5。本发明还涉及用于产生用于执行根据本发明的方法的复合放电脉冲（4）的高功率电能源（3）

3. 发明授权

US10083822B2 Physical vapour deposition coating device as well as a physical vapour deposition method 有权
公开(公告)号：US10083822B2
公开(公告)日：2018-09-25
申请号：US12543721
申请日：2009-08-19
申请人： Jones Alami , Georg Erkens , Tariq Rasa , Jörg Vetter
发明人： Jones Alami , Georg Erkens , Tariq Rasa , Jörg Vetter
IPC分类号： C23C14/00 , H01J37/34 , H01J37/32
CPC分类号： H01J37/34 , H01J37/32055 , H01J37/3438 , H01J37/3467
摘要： The invention relates to a physical vapor deposition coating device (1), comprising a process chamber (2) with an anode (3) and a consumable cathode (4) to be consumed by an electrical discharge for coating a substrate located within the process chamber (2). The coating device (1) further includes a first electrical energy source (5) being connected with its negative pole to said consumable cathode (4), and a second electrical energy source (6) being connected with its positive pole to said anode (3). According to the invention, a third electrical energy source (7) is provided being connected with its negative pole to a source cathode (8) which is different from the consumable cathode (4). In addition, the invention relates to a physical vapor deposition method for coating a substrate.

4. 发明申请

US20100044214A1 PHYSICAL VAPOUR DEPOSITION COATING DEVICE AS WELL AS A PHYSICAL VAPOUR DEPOSITION METHOD 审中-公开
标题翻译：物理蒸气沉积涂料装置作为物理蒸气沉积方法
公开(公告)号：US20100044214A1
公开(公告)日：2010-02-25
申请号：US12543721
申请日：2009-08-19
申请人： Jones Alami , Georg Erkens , Tariq Rasa , Jörg Vetter
发明人： Jones Alami , Georg Erkens , Tariq Rasa , Jörg Vetter
IPC分类号： C23C14/24 , C23C14/34 , C23C14/35 , C23C14/14
CPC分类号： H01J37/34 , H01J37/32055 , H01J37/3438 , H01J37/3467
摘要： The invention relates to a physical vapour deposition coating device (1), comprising a process chamber (2) with an anode (3) and a consumable cathode (4) to be consumed by an electrical discharge for coating a substrate located within the process chamber (2). The coating device (1) further includes a first electrical energy source (5) being connected with its negative pole to said consumable cathode (4), and a second electrical energy source (6) being connected with its positive pole to said anode (3). According to the invention, a third electrical energy source (7) is provided being connected with its negative pole to a source cathode (8) which is different from the consumable cathode (4). In addition, the invention relates to a physical vapour deposition method for coating a substrate.
摘要翻译：本发明涉及一种物理气相沉积涂覆装置（1），其包括具有阳极（3）和消耗性阴极（4）的处理室（2），用于通过用于涂覆位于处理室内的基板的放电（2）。涂覆装置（1）还包括与其负极连接到所述可消耗阴极（4）的第一电能源（5）和与其正极连接到所述阳极（3）的第二电能源（6））。根据本发明，提供第三电能源（7），其与其负极连接到不同于可消耗阴极（4）的源极阴极（8）。此外，本发明涉及一种用于涂覆基板的物理气相沉积方法。

5. 发明申请

US20100051445A1 Coating Apparatus For The Coating Of A Substrate, As Well As A Method For The Coating Of A Substrate 审中-公开
标题翻译：用于涂覆基材的涂布装置以及用于涂覆基材的方法
公开(公告)号：US20100051445A1
公开(公告)日：2010-03-04
申请号：US12550600
申请日：2009-08-31
申请人： Jörg Vetter , Georg Erkens
发明人： Jörg Vetter , Georg Erkens
IPC分类号： C23C14/35
CPC分类号： C23C14/35 , C23C14/325 , H01J37/32055 , H01J37/3266 , H01J37/34 , H01J37/3405 , H01J37/3423
摘要： The present invention relates to a vaporization apparatus (1) for the vaporization of a target material (200, 201, 202). The vaporization apparatus (1) includes a process chamber (3) for the setting up and maintenance of a gas atmosphere and having an inlet (4) and an outlet (5) for a process gas, as well as an anode (6, 61) and a cylindrical vaporization cathode (2, 21, 22) formed as a target (2, 21, 22), the cylindrical vaporization cathode (2, 21, 22) including the target material (200, 201, 202). Furthermore, an electrical source of energy (7, 71, 72) is provided for the generation of an electric potential between the anode (6, 61) and the cathode (2, 21, 22) so that the target material (200, 201, 202) of the cylindrical cathode (2, 21, 22) can be transferred into a vapor phase by means of the electrical source of energy (7, 71, 72), with a magnetic field source (8, 81, 82) generating a magnetic field being provided. In accordance with the invention a cylindrical vaporization cathode (2, 21) and a cylindrical arc cathode (2, 22) are simultaneously provided in the process chamber (3). Furthermore, the invention relates to a coating method for the coating of a substrate (S).
摘要翻译：本发明涉及一种用于目标材料（200,201,202）蒸发的蒸发装置（1）。蒸发装置（1）包括用于建立和维护气体气氛的处理室（3），并具有用于处理气体的入口（4）和出口（5）以及阳极（6,61 ）和形成为靶（2,21,22）的圆筒形汽化阴极（2,21,22），所述圆筒形汽化阴极（2,21,22）包括所述靶材料（200,201,202）。此外，提供能量源（7,71,72）用于在阳极（6,61）和阴极（2,21,22）之间产生电位，使得靶材料（200,201 圆柱形阴极（2,21,22）可以通过能量源（7,71,72）转移到气相中，其中磁场源（8,81,82）产生提供磁场。根据本发明，在处理室（3）中同时设置圆柱形汽化阴极（2,21）和圆柱形电弧阴极（2,22）。此外，本发明涉及一种用于涂布基材（S）的涂布方法。

6. 发明授权

US08470456B2 Layer system for the formation of a surface layer on a surface of a substrate and also vaporization source for the manufacture of a layer system 有权
标题翻译：用于在基板的表面上形成表面层的层系统以及用于制造层系统的蒸发源
公开(公告)号：US08470456B2
公开(公告)日：2013-06-25
申请号：US12145105
申请日：2008-06-24
申请人： Jörg Vetter , Georg Erkens
发明人： Jörg Vetter , Georg Erkens
IPC分类号： B32B9/00
CPC分类号： B32B9/00 , C23C14/06 , C23C14/0641
摘要： The invention relates to a layer system for the formation of a surface layer on a surface of a substrate, in particular on the surface of a tool, wherein the layer system includes at least one first hard layer of the composition (MoSipAYq)γ(NrCsOt)δ with (o+p+q)=γ, (r+s+t)=δ, and (γ+δ)=100, wherein 40≦γ≦60 and wherein M is at least one metal of the group of the chemical elements consisting of Al and the elements of the secondary groups IVb, Vb, VIb of the periodic system of elements. In accordance with the invention the component AY is at least one element of the group of the chemical elements consisting of Mn, Fe, Co, Ni, Cu and the elements of the secondary group IIIB and the elements of the main group IA, IIA and IIIA and the elements of the group of the lanthanoids of the periodic system of chemical elements, with AY preferably additionally containing boron.
摘要翻译：本发明涉及一种用于在基材表面，特别是在工具表面上形成表面层的层系统，其中该层系统包括至少一种第一硬质层组合物（MoSipayq）γ（NrCsOt ）δ（+ p + q）=γ，（r + s + t）=δ和（γ+δ）= 100，其中40≤γ≤60，其中M是至少一种金属由Al组成的化学元素和元素周期性系统的次级基团IVb，Vb，VIb的元素。根据本发明，组分AY是由Mn，Fe，Co，Ni，Cu组成的一组化学元素中的至少一种元素，并且次要IIIB族元素和主要组分IA，IIA和 IIIA和化学元素周期性系统的镧系元素的元素，优选另外含有硼。

7. 发明授权

US09028960B2 PVD coating for metal machining 有权
标题翻译： PVD涂层用于金属加工
公开(公告)号：US09028960B2
公开(公告)日：2015-05-12
申请号：US13636749
申请日：2011-04-21
申请人： Jacob Sjölén , Jon Andersson , Jörg Vetter , Jürgen Müller
发明人： Jacob Sjölén , Jon Andersson , Jörg Vetter , Jürgen Müller
IPC分类号： C23C14/06 , C09D1/00 , C23C14/54 , C23C28/04 , C23C28/00 , C23C30/00
CPC分类号： C09D1/00 , C23C14/0641 , C23C14/54 , C23C28/044 , C23C28/44 , C23C30/005 , Y10T428/24355 , Y10T428/24942 , Y10T428/24975 , Y10T428/252 , Y10T428/265
摘要： A wear resistant coating suitable to be deposited on cutting tool inserts for chip forming metal machining, includes at least two layers with different grain size, but with essentially the same composition. The coating is deposited by Physical Vapor Deposition (PVD).
摘要翻译：适用于沉积在用于芯片成形金属加工的切削刀片插入件上的耐磨涂层包括至少两层具有不同晶粒尺寸但具有基本相同的组成。涂层通过物理气相沉积（PVD）沉积。

8. 发明申请

US20130071617A1 PVD COATING FOR METAL MACHINING 有权
标题翻译： PVD涂层用于金属加工
公开(公告)号：US20130071617A1
公开(公告)日：2013-03-21
申请号：US13636749
申请日：2011-04-21
申请人： Jacob Sjölén , Jon Andersom , Jörg Vetter , Jürgen Müller
发明人： Jacob Sjölén , Jon Andersom , Jörg Vetter , Jürgen Müller
IPC分类号： C09D1/00
CPC分类号： C09D1/00 , C23C14/0641 , C23C14/54 , C23C28/044 , C23C28/44 , C23C30/005 , Y10T428/24355 , Y10T428/24942 , Y10T428/24975 , Y10T428/252 , Y10T428/265
摘要： A wear resistant coating suitable to be deposited on cutting tool inserts for chip forming metal machining, includes at least two layers with different grain size, but with essentially the same composition. The coating is deposited by Physical Vapour Deposition (PVD).
摘要翻译：适用于沉积在用于芯片成形金属加工的切削刀片插入件上的耐磨涂层包括至少两层具有不同晶粒尺寸但具有基本相同的组成。涂层通过物理气相沉积（PVD）沉积。

9. 发明授权

US09856556B2 PVD coating for metal machining 有权
公开(公告)号：US09856556B2
公开(公告)日：2018-01-02
申请号：US13643022
申请日：2011-03-30
申请人： Jacob Sjölén , Jon Andersson , Jörg Vetter , Jürgen Müller
发明人： Jacob Sjölén , Jon Andersson , Jörg Vetter , Jürgen Müller
IPC分类号： C23C14/32 , C23C14/06 , C23C30/00
CPC分类号： C23C14/325 , C23C14/0641 , C23C30/005
摘要： The present invention relates to a wear resistant coating suitable to be deposited on cutting tool inserts for chip forming metal machining. The coating comprises at least two layers with different grain size, but with essentially the same composition. The coating is deposited by Physical Vapor Deposition (PVD).

10. 发明申请

US20130171374A1 PVD COATING FOR METAL MACHINING 有权
标题翻译： PVD涂层用于金属加工
公开(公告)号：US20130171374A1
公开(公告)日：2013-07-04
申请号：US13643022
申请日：2011-03-30
申请人： Jacob Sjölén , Jon Andersson , Jörg Vetter , Jürgen Müller
发明人： Jacob Sjölén , Jon Andersson , Jörg Vetter , Jürgen Müller
IPC分类号： C23C14/32
CPC分类号： C23C14/325 , C23C14/0641 , C23C30/005
摘要： The present invention relates to a wear resistant coating suitable to be deposited on cutting tool inserts for chip forming metal machining. The coating comprises at least two layers with different grain size, but with essentially the same composition. The coating is deposited by Physical Vapour Deposition (PVD).
摘要翻译：本发明涉及一种适用于沉积在用于切屑成形金属加工的切削刀片上的耐磨涂层。该涂层包含至少两层具有不同晶粒尺寸但具有基本相同组成的层。涂层通过物理气相沉积（PVD）沉积。

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