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    • 7. 发明申请
    • Wafer Clamping Apparatus and Method for Operating the Same
    • 晶圆夹紧装置及其操作方法
    • US20080142048A1
    • 2008-06-19
    • US12036111
    • 2008-02-22
    • John Parks
    • John Parks
    • B08B3/00
    • H01L21/6875H01L21/67109H01L21/6838Y10S134/902
    • A wafer clamping apparatus is provided to secure a wafer within a chamber during wafer processing. The wafer clamping apparatus creates a pressure differential between a top surface and a bottom surface of the wafer. The pressure differential serves to pull the wafer toward a wafer support structure in contact with the wafer bottom surface, whereby the wafer is secured and maintained in an immobile state. The wafer clamping apparatus also includes options for controlling the pressure differential between the top and bottom surfaces of the wafer. The wafer clamping apparatus is implemented without requiring contact with the wafer top surface and with minimal increase in chamber design complexity.
    • 提供晶片夹紧装置,用于在晶片处理期间将晶片固定在腔室内。 晶片夹紧装置在晶片的顶表面和底表面之间产生压差。 压差用于将晶片拉向与晶片底表面接触的晶片支撑结构,由此晶片被固定并保持在不动的状态。 晶片夹紧装置还包括用于控制晶片的顶表面和底表面之间的压力差的选项。 实现晶片夹紧装置,而不需要与晶片顶表面接触并且以最小的室设计复杂性增加。