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1. 发明授权

US06286230B1 Method of controlling gas flow in a substrate processing system 失效
标题翻译：控制衬底处理系统中气体流动的方法
公开(公告)号：US06286230B1
公开(公告)日：2001-09-11
申请号：US09391012
申请日：1999-09-07
申请人： John M. White , Wendell T. Blonigan , Michael W. Richter
发明人： John M. White , Wendell T. Blonigan , Michael W. Richter
IPC分类号： F26B504
CPC分类号： H01L21/67173 , H01L21/67017 , Y10S414/139
摘要： A method of transferring and processing a substrate in an evacuable chamber which is located adjacent a process chamber and back-to-back process chambers, and other combinations of evacuable chambers and process chambers. The method includes the use of various isolation valves disposed between adjacent chambers, as well as gas flow valves and vacuum valves. By controlling the positions of the valves, the flow of gas to and from the different chambers can be controlled.
摘要翻译：一种在位于邻近处理室和背靠背处理室的可抽空室中以及可抽空室和处理室的其它组合之间传送和处理衬底的方法。该方法包括使用设置在相邻室之间的各种隔离阀以及气体流量阀和真空阀。通过控制阀的位置，可以控制进出不同室的气体流量。

2. 发明授权

US6086362A Multi-function chamber for a substrate processing system 失效
公开(公告)号：US6086362A
公开(公告)日：2000-07-11
申请号：US82375
申请日：1998-05-20
申请人： John M. White , Wendell T. Blonigan , Michael W. Richter
发明人： John M. White , Wendell T. Blonigan , Michael W. Richter
IPC分类号： H01L21/302 , H01L21/00 , H01L21/02 , H01L21/205 , H01L21/3065 , H01L21/677 , F27D3/06
CPC分类号： H01L21/67748 , H01L21/67098 , H01L21/67109 , H01L21/67173 , H01L21/67201 , H01L21/67236 , H01L21/67248
摘要： A load lock chamber includes a chamber body having an aperture to allow a substrate to be transferred into or out of the chamber. The load lock chamber is configurable in several configurations, including a base configuration for providing a transition between two different pressures, a heating configuration for heating the substrate and providing a transition between two different pressures, and a cooling configuration for cooling the substrate and providing a transition between two different pressures. Various features of the chamber configurations help increase the throughput of the system by enabling rapid heating and cooling of substrates and simultaneous evacuation and venting of the chamber, and help compensate for thermal losses near the substrate edges, thereby providing a more uniform temperature across the substrate.

3. 发明授权

US06435868B2 Multi-function chamber for a substrate processing system 失效
标题翻译：用于基板处理系统的多功能室
公开(公告)号：US06435868B2
公开(公告)日：2002-08-20
申请号：US09732159
申请日：2000-12-07
申请人： John M. White , Wendell T. Blonigan , Michael W. Richter
发明人： John M. White , Wendell T. Blonigan , Michael W. Richter
IPC分类号： F27D306
CPC分类号： H01L21/67748 , H01L21/67098 , H01L21/67109 , H01L21/67173 , H01L21/67201 , H01L21/67236 , H01L21/67248
摘要： A load lock chamber includes a chamber body having an aperture to allow a substrate to be transferred into or out of the chamber. The load lock chamber is configurable in several configurations, including a base configuration for providing a transition between two different pressures, a heating configuration for heating the substrate and providing a transition between two different pressures, and a cooling configuration for cooling the substrate and providing a transition between two different pressures. Various features of the chamber configurations help increase the throughput of the system by enabling rapid heating and cooling of substrates and simultaneous evacuation and venting of the chamber, and help compensate for thermal losses near the substrate edges, thereby providing a more uniform temperature across the substrate.
摘要翻译：负载锁定室包括具有孔的腔体，以允许衬底被转移到腔室中或从腔室中移出。负载锁定室可配置为多种配置，包括用于提供两种不同压力之间的转换的基本配置，用于加热衬底并提供两种不同压力之间的转换的加热配置，以及用于冷却衬底的冷却配置，两种不同压力之间的转变。腔室结构的各种特征有助于通过使衬底的快速加热和冷却以及腔室的同时排空和排气来增加系统的生产能力，并且有助于补偿衬底边缘附近的热损失，由此在衬底上提供更均匀的温度。

4. 发明授权

US06193507B1 Multi-function chamber for a substrate processing system 有权
标题翻译：用于基板处理系统的多功能室
公开(公告)号：US06193507B1
公开(公告)日：2001-02-27
申请号：US09502117
申请日：2000-02-10
申请人： John M. White , Wendell T. Blonigan , Michael W. Richter
发明人： John M. White , Wendell T. Blonigan , Michael W. Richter
IPC分类号： F27D306
CPC分类号： H01L21/67748 , H01L21/67098 , H01L21/67109 , H01L21/67173 , H01L21/67201 , H01L21/67236 , H01L21/67248
摘要： A load lock chamber includes a chamber body having an aperture to allow a substrate to be transferred into or out of the chamber. The load lock chamber is configurable in several configurations, including a base configuration for providing a transition between two different pressures, a heating configuration for heating the substrate and providing a transition between two different pressures, and a cooling configuration for cooling the substrate and providing a transition between two different pressures. Various features of the chamber configurations help increase the throughput of the system by enabling rapid heating and cooling of substrates and simultaneous evacuation and venting of the chamber, and help compensate for thermal losses near the substrate edges, thereby providing a more uniform temperature across the substrate.
摘要翻译：负载锁定室包括具有孔的腔体，以允许衬底被转移到腔室中或从腔室中移出。负载锁定室可配置为多种配置，包括用于提供两种不同压力之间的转换的基本配置，用于加热衬底并提供两种不同压力之间的转换的加热配置，以及用于冷却衬底的冷却配置，两种不同压力之间的转变。腔室结构的各种特征有助于通过使衬底的快速加热和冷却以及腔室的同时排空和排气来增加系统的生产能力，并且有助于补偿衬底边缘附近的热损失，由此在衬底上提供更均匀的温度。

5. 发明授权

US6016611A Gas flow control in a substrate processing system 失效
标题翻译：衬底处理系统中的气体流量控制
公开(公告)号：US6016611A
公开(公告)日：2000-01-25
申请号：US115110
申请日：1998-07-13
申请人： John M. White , Wendell T. Blonigan , Michael W. Richter
发明人： John M. White , Wendell T. Blonigan , Michael W. Richter
IPC分类号： C23C16/455 , H01L21/00 , H01L21/205 , H01L21/302 , H01L21/3065 , F26B13/30
CPC分类号： H01L21/67173 , H01L21/67017 , Y10S414/139
摘要： A substrate processing system can include an evacuable chamber adjacent a process chamber and back-to-back process chambers, or other combinations of evacuable chambers and process chambers. The processing system includes various isolation valves disposed between adjacent chambers, as well as gas flow valves and vacuum valves. A controller controls the respective positions of the various gas flow valves and vacuum valves depending, in part, on whether the various isolation valves are in their open or sealed positions. By controlling the positions of the valves, the flow of gas to and from the different chambers can be controlled, for example, to help maximize throughput, increase efficiency, and reduce the likelihood of cross-contamination between chambers.
摘要翻译：衬底处理系统可以包括邻近处理室和背对背处理室的可抽空室，或者可抽空室和处理室的其它组合。处理系统包括设置在相邻室之间的各种隔离阀以及气体流量阀和真空阀。控制器控制各种气体流量阀和真空阀的各个位置，部分地取决于各种隔离阀是处于其打开或密封位置。通过控制阀的位置，可以控制来往不同室的气体流，例如，以帮助最大限度地提高生产量，提高效率，并减少室之间交叉污染的可能性。

6. 发明授权

US06834777B2 Closed loop control over delivery of liquid material to semiconductor processing tool 失效
标题翻译：将液体材料输送到半导体加工工具的闭环控制
公开(公告)号：US06834777B2
公开(公告)日：2004-12-28
申请号：US10409368
申请日：2003-04-07
申请人： Thomas H. Osterheld , Benjamin A. Bonner , Michael W. Richter
发明人： Thomas H. Osterheld , Benjamin A. Bonner , Michael W. Richter
IPC分类号： B67D5008
CPC分类号： H01L21/67253
摘要： Liquid material is precisely dispensed to a semiconductor processing tool utilizing closed loop control. In one embodiment, CMP slurry material of known density is supplied from a reservoir/mixing vessel to a dispense module. The dispense module also receives a flow of an inert gas through a gas supply valve. Positive pressure arising within the dispense module due to the inert gas flow causes an outflow of slurry from the dispense module to the CMP platen. The rate of flow of the slurry to the CMP platen over time is determined by monitoring the change (decline) in weight of the filled dispense module. In a similar manner, variation in the rate of flow of slurry over time may be detected by monitoring variation in changes in weight of the filled dispense module over time. A regulator structure in electronic communication with the dispense module and with the gas supply valve receives first signals at different time points indicating the weight change of the dispense module. In response, the regulator structure communicates a second signal to the gas supply valve, reflecting an appropriate change in the rate of flow of CMP slurry material to the platen. This second signal causes the gas supply valve to vary the flow of inert gas to the dispense module in order to control changes in the flow rate of the slurry.
摘要翻译：利用闭环控制将液体材料精确地分配到半导体加工工具中。在一个实施例中，已知密度的CMP浆料材料从储存器/混合容器供应到分配模块。分配模块还通过气体供给阀接收惰性气体流。在分配模块中由于惰性气体流动引起的正压力导致浆料从分配模块流出到CMP压板。通过监测填充的分配模块的重量变化（下降）来确定浆料在一段时间内流向CMP压板的速率。以类似的方式，可以通过监测填充的分配模块的重量变化随时间的变化来检测浆料随着时间的流动速率的变化。与分配模块和供气阀电子通信的调节器结构在不同的时间点接收指示分配模块的重量变化的第一信号。作为响应，调节器结构将第二信号传递到气体供应阀，反映了CMP浆料材料流向压板的适当变化。该第二信号使气体供应阀改变与分配模块的惰性气体的流量，以便控制浆料流速的变化。

7. 发明授权

US06561381B1 Closed loop control over delivery of liquid material to semiconductor processing tool 失效
标题翻译：将液体材料输送到半导体加工工具的闭环控制
公开(公告)号：US06561381B1
公开(公告)日：2003-05-13
申请号：US09717720
申请日：2000-11-20
申请人： Thomas H. Osterheld , Benjamin A. Bonner , Michael W. Richter
发明人： Thomas H. Osterheld , Benjamin A. Bonner , Michael W. Richter
IPC分类号： B67B700
CPC分类号： H01L21/67253
摘要： Liquid material is precisely dispensed to a semiconductor processing tool utilizing closed loop control. In one embodiment, CMP slurry material of known density is supplied from a reservoir/mixing vessel to a dispense module. The dispense module also receives a flow of an inert gas through a gas supply valve. Positive pressure arising within the dispense module due to the inert gas flow causes an outflow of slurry from the dispense module to the CMP platen. The rate of flow of the slurry to the CMP platen over time is determined by monitoring the change (decline) in weight of the filled dispense module. In a similar manner, variation in the rate of flow of slurry over time may be detected by monitoring variation in changes in weight of the filled dispense module over time. A regulator structure in electronic communication with the dispense module and with the gas supply valve receives first signals at different time points indicating the weight change of the dispense module. In response, the regulator structure communicates a second signal to the gas supply valve, reflecting an appropriate change in the rate of flow of CMP slurry material to the platen. This second signal causes the gas supply valve to vary the flow of inert gas to the dispense module in order to control changes in the flow rate of the slurry.
摘要翻译：利用闭环控制将液体材料精确地分配到半导体加工工具中。在一个实施例中，已知密度的CMP浆料材料从储存器/混合容器供应到分配模块。分配模块还通过气体供给阀接收惰性气体流。在分配模块中由于惰性气体流动引起的正压力导致浆料从分配模块流出到CMP压板。通过监测填充的分配模块的重量变化（下降）来确定浆料在一段时间内流向CMP压板的速率。以类似的方式，可以通过监测填充的分配模块的重量变化随时间的变化来检测浆料随着时间的流动速率的变化。与分配模块和供气阀电子通信的调节器结构在不同的时间点接收指示分配模块的重量变化的第一信号。作为响应，调节器结构将第二信号传递到气体供应阀，反映了CMP浆料材料流向压板的适当变化。该第二信号使气体供应阀改变与分配模块的惰性气体的流量，以便控制浆料流速的变化。

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