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    • 3. 发明授权
    • Automated analysis of a model based diagnostic system
    • 基于模型的诊断系统的自动分析
    • US5922079A
    • 1999-07-13
    • US951287
    • 1997-10-16
    • George L. BoothJohn M. HeumannDouglas R. Manley
    • George L. BoothJohn M. HeumannDouglas R. Manley
    • G01R31/00G01R31/3183G06F11/22G06F11/263G06F17/50G06F11/26
    • G01R31/31835G06F11/263
    • An automated analysis system that identifies detectability problems, diagnosability problems, and possible ways to change rank order of diagnoses in a diagnostic system and makes the problems and possible improvements visible to test programmers to aid in test improvement. Components that have no coverage and components that have inadequate coverage (according to a heuristic criteria) are identified as potential detectability problems. Components that are exercised by identical operations in all tests are identified as diagnosability problems. If an incorrect diagnosis is made, the automated analysis system identifies failing tests that have no coverage of any component in the true failure cause. In addition, if an incorrect diagnosis is made, the automated analysis system identifies ways of changing the rank order of diagnoses, including coverages that can be reduced and identification of operation violations that can be eliminated or deliberately added. If no historical data are available, a "diagnosability index" may be computed by randomly sampling from the set of possible failure syndromes and observing the frequencies with which ties occur among the weights of the top-ranked candidate diagnoses. After historical data becomes available, a diagnosability index may be computed from the frequency with which two candidate diagnoses are assigned identical weights by the model-based diagnostic system over a set of representative failures.
    • 一个自动分析系统,用于识别可检测性问题,可诊断性问题以及改变诊断系统诊断秩序的可能方法,并使测试程序员的问题和可能的改进可见,以帮助测试改进。 没有覆盖范围的组件和覆盖不足的组件(根据启发式标准)被识别为潜在的可检测性问题。 在所有测试中通过相同操作执行的组件被识别为诊断性问题。 如果进行了不正确的诊断,则自动化分析系统会识别在真实故障原因中没有覆盖任何组件的故障测试。 此外,如果做出错误的诊断,自动化分析系统将确定改变诊断等级次序的方法,包括可以减少的覆盖率以及可以消除或故意添加的操作违规的识别。 如果没有历史数据可用,则可以通过从可能的故障综合征组中随机抽样并观察在排名最高的候选诊断的权重之间发生关系的频率来计算“诊断指数”。 在历史数据变得可用之后,可以通过基于模型的诊断系统在一组代表性故障中从两个候选诊断分配相同权重的频率来计算诊断指数。
    • 5. 发明授权
    • Radiographic imaging systems and methods for designing same
    • 射线成像系统及其设计方法
    • US07200534B2
    • 2007-04-03
    • US11074122
    • 2005-03-07
    • John M. HeumannGerald L. Meyer
    • John M. HeumannGerald L. Meyer
    • G06G7/48
    • A61B6/025
    • In one embodiment, a method for designing a radiographic imaging system includes 1) receiving a number of design constraints for the system, and then 2) in response to the constraints, generating a plurality of radiographic imaging system designs, each having a different number of radiographic sources, and each requiring a different number of nominal scan passes to image a specimen region of interest. Designs having a greater number of radiographic sources have sets of translated radiographic detection areas sharing at least some coincident, nominal scan passes as compared to radiographic imaging system designs having fewer radiographic sources. Each set of translated radiographic detection areas is associated with a radiographic source that is replicated and translated with respect to a radiographic source that forms part of a radiographic imaging system design having fewer radiographic sources. Related systems and apparatus are also disclosed.
    • 在一个实施例中,一种用于设计射线照相成像系统的方法包括:1)为系统接收多个设计约束,然后响应于约束,产生多个放射照相成像系统设计,每个具有不同数量的 射线照相源,并且每个都需要不同数量的标称扫描通过以对感兴趣的标本区域成像。 与具有较少射线照相源的射线照相成像系统设计相比,具有更多数量的放射线照相源的设计具有共享至少一些重合的标称扫描通过的一组翻转的放射线照相检测区域。 每组翻译的放射照相检测区域与放射照相源相关联,该放射照相源相对于形成具有较少放射照相源的射线照相成像系统设计的一部分的放射照相源被复制和平移。 还公开了相关系统和装置。
    • 6. 发明授权
    • System and method for detecting shorts, opens and connected pins on a
printed circuit board using automatic equipment
    • 使用自动设备检测印刷电路板上的短路,开路和连接引脚的系统和方法
    • US5977775A
    • 1999-11-02
    • US559905
    • 1995-11-17
    • Kevin G. ChandlerBarry A. AlcornBryan D. BoswellJohn M. HeumannEd O. Schlotzhauer
    • Kevin G. ChandlerBarry A. AlcornBryan D. BoswellJohn M. HeumannEd O. Schlotzhauer
    • G01R31/02G01R31/28G01R31/3183G01R31/319G01R27/26
    • G01R31/318342G01R31/2812G01R31/31915G01R31/3191
    • An automatic circuit board tester for testing for shorts, opens, and interconnected pins or nodes on a circuit board. The tester first classifies the nodes as being in one of three categories based upon the design of the board and the intended interconnection of the nodes. The categories of nodes are: (1) connected to ground; (2) interconnected to all other nodes in the test group; or (3) isolated from all other nodes. The circuit board tester has a testhead containing a plurality of test channels, each configured to be coupled to a node on the circuit board. The testhead utilizes a digital signal from a digital driver to drive the node, at a predetermined voltage and a digital receiver to read the node voltage to determine if it is coupled to ground. Each test channel also includes a switch to connect the digital driver and receiver to the test node as well as a ground switch to selectively couple the node to ground. Various combinations of switch positions and testing sequences enables the circuit board tester to test all node connections and to ensure that the physical embodiment of the circuit board accurately reflects the circuit board design.
    • 一种用于测试电路板上短路,开路和互连引脚或节点的自动电路板测试仪。 测试仪首先根据电路板的设计和节点的预期互连,将节点分类为三类之一。 节点类别有:(1)连接到地面; (2)与测试组中的所有其他节点互连; 或(3)与所有其他节点隔离。 电路板测试器具有包含多个测试通道的测试头,每个测试通道被配置为耦合到电路板上的节点。 测试头利用来自数字驱动器的数字信号来驱动节点,以预定电压和数字接收机读取节点电压,以确定其是否耦合到地。 每个测试通道还包括将数字驱动器和接收器连接到测试节点的开关以及用于选择性地将节点耦合到地的接地开关。 开关位置和测试序列的各种组合使得电路板测试仪能够测试所有节点连接,并确保电路板的物理实施例精确地反映电路板设计。
    • 8. 发明授权
    • System and method for performing auto-focused tomosynthesis
    • 用于进行自动聚焦的断层合成的系统和方法
    • US07424141B2
    • 2008-09-09
    • US10651667
    • 2003-08-29
    • David GinesTracy K. RaglandJohn M. Heumann
    • David GinesTracy K. RaglandJohn M. Heumann
    • G06K9/00
    • G06T11/005A61B6/025G06T2211/436
    • A system and method for performing auto-focusing operations for tomosynthetic reconstruction of images are provided. More specifically, embodiments of the present invention provide a system and method for efficiently computing the gradient of one or more depth layers of an object under inspection, wherein such gradients may be used in performing auto-focusing operations to determine a depth layer that includes an in-focus view of a feature that is of interest. In at least one embodiment, a method is provided that comprises capturing detector image data for an object under inspection, and using the detector image data for computing gradient information for at least one depth layer of the object under inspection without first tomosynthetically reconstructing a full image of the at least one depth layer.
    • 提供了一种用于执行图像重建的自动聚焦操作的系统和方法。 更具体地,本发明的实施例提供了一种用于有效地计算被检查物体的一个或多个深层的梯度的系统和方法,其中这种梯度可用于执行自动聚焦操作以确定深度层,其包括 焦点视图中的一个功能是感兴趣的。 在至少一个实施例中,提供了一种方法,其包括捕获检测对象的检测器图像数据,并且使用检测器图像数据来计算被检查物体的至少一个深度层的梯度信息,而无需首先合成重建完整图像 的至少一个深度层。
    • 9. 发明授权
    • Enhanced thickness calibration and shading correction for automatic X-ray inspection
    • 增强厚度校准和阴影校正,进行自动X光检查
    • US06201850B1
    • 2001-03-13
    • US09237401
    • 1999-01-26
    • John M. Heumann
    • John M. Heumann
    • G01N23083
    • G01B15/025G01N23/04
    • An X-ray inspection system incorporates an improved technique for determining, in an X-ray image of a multilayered assembly, the gray level component of a first material in the presence of a second material. The total gray level of the image is dependent upon the physical characteristics of each material comprising the assembly. The present invention accurately determines the component of the total image gray level due to the first material. In the case of circuit board inspections using X-ray images of solder connections, a calibration procedure facilitates the direct conversion of the gray level component due to the solder connection to the thickness of the solder connection.
    • X射线检查系统包括用于在多层组件的X射线图像中确定在第二材料存在下的第一材料的灰度分量的改进技术。 图像的总灰度取决于包括组件的每种材料的物理特性。 本发明精确地确定由于第一材料而导致的总图像灰度级的分量。 在使用焊接连接的X射线图像的电路板检查的情况下,校准程序便于由于焊料连接而导致的灰度级分量直接转换到焊料连接的厚度。
    • 10. 发明授权
    • System and method for detecting shorts, opens and connected pins on a printed circuit board using automatic test equipment
    • US06191570B1
    • 2001-02-20
    • US09361368
    • 1999-07-26
    • Kevin G. ChandlerBarry A. AlcornBryan D. BoswellJohn M. HeumannEd O. Schlotzhauer
    • Kevin G. ChandlerBarry A. AlcornBryan D. BoswellJohn M. HeumannEd O. Schlotzhauer
    • G01R1512
    • G01R31/318342G01R31/2812G01R31/3191G01R31/31915
    • A method for testing node isolation on a circuit board. The method utilizes an automated test system having a plurality of test channels, wherein each test channel has a digital driver with a first input and a first output, and a digital receiver with a second output and a second input. The second input of the receiver is coupled to the first output of the driver, to a number of switches, and to a test probe. The test probe is configured to couple the driver and receiver to one of a plurality of nodes on a circuit board. The number of switches are configured to selectively couple the first output and second input to ground. During a node isolation test, each node of a test node group is coupled to one of the test channels. But for a selected node of the test node group, each node of the test node group is coupled to ground via the number of switches of the test channels coupled to the nodes. Thereafter, a test signal is applied to the selected node via the digital driver of a first test channel which is coupled to the selected node. It is then determined if the digital receiver of the first test channel indicates that the selected node is coupled to ground, and whether the selected node is isolated from the remaining nodes of the test node group. If the selected node is not isolated from the remaining nodes of the test node group, the nodes of the test node group are released from ground, a test signal is once again applied to the selected node, and a determination is made as to whether the selected node is grounded to thereby determine if the selected node is directly connected to ground. Finally, if the selected node is not directly connected to ground, varying subsets of the remaining nodes are coupled to ground, a test signal is once again applied to the selected node, and a determination is made as to whether the selected node is grounded to thereby determine which nodes of the test node group the selected node is isolated from.