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1. 发明申请

US20070266555A1 Apparatus for making circuitized substrates in a continuous manner 失效
标题翻译：用于以连续方式制造电路化基板的装置
公开(公告)号：US20070266555A1
公开(公告)日：2007-11-22
申请号：US11882625
申请日：2007-08-03
申请人： John Lauffer , Voya Markovich , James Orband , William Wilson
发明人： John Lauffer , Voya Markovich , James Orband , William Wilson
IPC分类号： H05K3/42 , B23P19/00 , H01K3/10
CPC分类号： H05K3/44 , H05K3/064 , H05K3/4069 , H05K3/427 , H05K3/445 , H05K3/462 , H05K3/4641 , H05K2201/0355 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0143 , H05K2203/068 , H05K2203/1545 , H05K2203/1572 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/53161 , Y10T29/5317 , Y10T29/53204
摘要： Apparatus for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby work stations in which various processes such as hole formation, circuitization and, finally, segmentation occur. The resulting substrates can then be individually bonded to other, like substrates to form a larger multi-layered substrate with a plurality of conductive thru-holes, conductive and dielectric layers as part thereof.
摘要翻译：用于使用连续辊格式制造电路化衬底的装置，其中导体和电介质层被馈送到设备中，结合并传递到其他附近的工作站，其中发生诸如孔形成，电路化和最终分段的各种过程。所得到的衬底然后可以单独地结合到其它类似衬底，以形成具有多个导电通孔，较大导电孔和介电层作为其一部分的较大的多层衬底。

2. 发明申请

US20060240641A1 Apparatus and method for making circuitized substrates in a continuous manner 有权
标题翻译：以连续方式制造电路化基板的装置和方法
公开(公告)号：US20060240641A1
公开(公告)日：2006-10-26
申请号：US11110919
申请日：2005-04-21
申请人： John Lauffer , Voya Markovich , James Orband , William Wilson
发明人： John Lauffer , Voya Markovich , James Orband , William Wilson
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H05K3/44 , H05K3/064 , H05K3/4069 , H05K3/427 , H05K3/445 , H05K3/462 , H05K3/4641 , H05K2201/0355 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0143 , H05K2203/068 , H05K2203/1545 , H05K2203/1572 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/53161 , Y10T29/5317 , Y10T29/53204
摘要： Apparatus and method for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby work stations in which various processes such as hole formation, circuitization and, finally, segmentation occur. The resulting substrates can then be individually bonded to other, like substrates to form a larger multi-layered substrate with a plurality of conductive thru-holes, conductive and dielectric layers as part thereof.
摘要翻译：使用连续辊格式制造电路化基片的装置和方法，其中导体和电介质层被馈送到装置中，结合并传递到其他附近的工作站，其中各种工艺如孔形成，电路化和最终分割发生。所得到的衬底然后可以单独地结合到其它类似衬底，以形成具有多个导电通孔，较大导电孔和介电层作为其一部分的较大的多层衬底。

3. 发明申请

US20070166944A1 Method of making circuitized substrate 有权
标题翻译：制造电路化基板的方法
公开(公告)号：US20070166944A1
公开(公告)日：2007-07-19
申请号：US11324432
申请日：2006-01-04
申请人： Robert Japp , John Lauffer , Voya Markovich , William Wilson
发明人： Robert Japp , John Lauffer , Voya Markovich , William Wilson
IPC分类号： H01L21/20
CPC分类号： H05K3/4641 , H05K3/429 , H05K2203/068
摘要： A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least one of these sub-composites is heated during bonding (e.g., lamination) to the other sufficiently to cause the dielectric material to flow into and substantially fill openings in a conductive layer for the bonded structure. Conductive thru-holes are formed within the bonded structure to couple selected ones of the structure's conductive layers. Formation of an electrical assembly is possible by positioning one or more electrical components (e.g., semiconductor chips or chip carriers) on the final structure and electrically coupling these to the structure's external circuitry.
摘要翻译：一种制造电路化基板的方法和使用其的电气组件，其中基板由至少两个亚复合材料构成，其中这些亚复合材料中的至少一个的介电材料在粘合（例如，层压）期间被加热到另一个足以使电介质材料流入并基本上填充用于接合结构的导电层中的开口。导电通孔形成在接合结构内，以耦合所选择的结构导电层。通过将一个或多个电气部件（例如，半导体芯片或芯片载体）定位在最终结构上并将其电耦合到结构的外部电路，可以形成电组件。

4. 发明申请

US20060005383A1 Method of forming printed circuit card 失效
标题翻译：形成印刷电路卡的方法
公开(公告)号：US20060005383A1
公开(公告)日：2006-01-12
申请号：US11224191
申请日：2005-09-12
申请人： Kenneth Fallon , Miguel Jimarez , Ross Keesler , John Lauffer , Roy Magnuson , Voya Markovich , Irv Memis , Jim Paoletti , Marybeth Perrino , John Welsh , William Wilson
发明人： Kenneth Fallon , Miguel Jimarez , Ross Keesler , John Lauffer , Roy Magnuson , Voya Markovich , Irv Memis , Jim Paoletti , Marybeth Perrino , John Welsh , William Wilson
IPC分类号： H01R43/00
CPC分类号： H05K3/445 , H01L23/49827 , H01L23/49833 , H01L23/50 , H01L2924/0002 , H05K1/056 , H05K1/113 , H05K3/0023 , H05K3/0052 , H05K3/0094 , H05K3/06 , H05K3/108 , H05K3/426 , H05K3/429 , H05K3/44 , H05K3/4623 , H05K3/4641 , H05K2201/0919 , H05K2201/09536 , H05K2201/09554 , H05K2201/096 , H05K2201/10734 , H05K2203/0323 , H05K2203/0574 , H05K2203/0733 , H05K2203/1394 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00
摘要： A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials connected to the vias and plated through holes. A border may be around the card including a metal layer terminating in from the edge of one of the dielectric layers. Copper foil with clearance holes is provided. First and second layers of photoimageable curable dielectric material are on opposite sides of the copper. Patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. Through holes are developed where holes were patterned in both dielectric layers. The surfaces of the photoimageable material, vias and through holes are metallized by copper plating, preferably using photoresist.
摘要翻译：提供了一种在两个可光成像的电介质层之间形成具有金属功率平面层的印刷电路卡的方法。光刻图形的金属填充通孔和电镀通孔位于光图案化材料中，信号电路位于连接到通孔和电镀通孔的每个介电材料的表面上。边框可以在卡周围，包括从电介质层之一的边缘终止的金属层。提供带有间隙孔的铜箔。第一层和第二层可光成像的可固化电介质材料位于铜的相对两侧。在可光成像材料的第一层和第二层上形成图案以通过通孔显露金属层。开发了通孔，在两个电介质层中对其进行图案化。可光成像材料，通孔和通孔的表面通过镀铜进行金属化，优选使用光致抗蚀剂。

5. 发明授权

US08541687B2 Coreless layer buildup structure 有权
标题翻译：无芯层堆积结构
公开(公告)号：US08541687B2
公开(公告)日：2013-09-24
申请号：US12764993
申请日：2010-04-22
申请人： Voya Markovich , Timothy Antesberger , Frank D. Egitto , William Wilson , Rabindra N. Das
发明人： Voya Markovich , Timothy Antesberger , Frank D. Egitto , William Wilson , Rabindra N. Das
IPC分类号： H05K1/03 , H05K1/02 , H05K1/09
CPC分类号： H05K3/462 , H05K1/167 , H05K3/4069 , H05K3/4623 , H05K3/4632 , H05K2203/0191 , H05K2203/061 , H05K2203/063
摘要： A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin.
摘要翻译：一种用于PCB或PWB板的衬底，其具有无芯堆积层和至少一个金属和至少一个介电层。无芯堆积电介质层可由至少部分固化的热固性树脂和热塑性树脂组成。

6. 发明申请

US20050042383A1 Colloidal seed formation for printed circuit board metallization 审中-公开
标题翻译：用于印刷电路板金属化的胶体种子形成
公开(公告)号：US20050042383A1
公开(公告)日：2005-02-24
申请号：US10939735
申请日：2004-09-13
申请人： Raymond Galasco , Roy Magnuson , Voya Markovich , Thomas Miller , Anita Sargent , William Wilson
发明人： Raymond Galasco , Roy Magnuson , Voya Markovich , Thomas Miller , Anita Sargent , William Wilson
IPC分类号： C23C18/28 , H05K3/18 , B05D1/18
CPC分类号： C23C18/28 , H05K3/181
摘要： A colloidal metal seed formulation useful for catalytically activating a surface of a non-conductive dielectric substrate in an electroless plating process is provided. The colloidal metal seed formulation includes stannous chloride, palladium chloride, HCl and a surfactant selected from a diphenyloxide disulfonic acid or alkali or alkaline earth metal salt thereof, C30H50O10, an alcohol alkoxylate and mixtures thereof. A method of electroless plating of a conductive metal onto a non-conductive dielectric substrate using the colloidal metal seed formulation is also provided.
摘要翻译：提供了一种用于在非电镀过程中催化活化非导电电介质基片的表面的胶态金属种子制剂。胶体金属种子制剂包括氯化亚锡，氯化钯，HCl和选自二苯氧基二磺酸或其碱金属或碱土金属盐，C30H50O10，醇烷氧基化物及其混合物的表面活性剂。还提供了使用胶体金属种子制剂将导电金属化学镀在非导电电介质基底上的方法。

7. 发明授权

US09351408B2 Coreless layer buildup structure with LGA and joining layer 有权
标题翻译：具有LGA和接合层的无芯层堆积结构
公开(公告)号：US09351408B2
公开(公告)日：2016-05-24
申请号：US12764997
申请日：2010-04-22
申请人： Voya Markovich , Timothy Antesberger , Frank D. Egitto , William Wilson , Rabindra N. Das
发明人： Voya Markovich , Timothy Antesberger , Frank D. Egitto , William Wilson , Rabindra N. Das
IPC分类号： H05K1/09 , H05K1/03 , H05K3/40
CPC分类号： H05K3/4069 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K2203/063
摘要： A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.
摘要翻译：一种用于PCB或PWB板的衬底，其具有无芯堆积层和至少一个金属和至少一个介电层。无芯堆积电介质层可由至少部分固化的热固性树脂和热塑性树脂组成。衬底还可以包含焊盘阵列（LGA）封装。

8. 发明授权

US08536459B2 Coreless layer buildup structure with LGA 有权
标题翻译：具有LGA的无芯层堆积结构
公开(公告)号：US08536459B2
公开(公告)日：2013-09-17
申请号：US12764994
申请日：2010-04-22
申请人： Voya Markovich , Timothy Antesberger , Frank D. Egitto , William Wilson , Rabindra N. Das
发明人： Voya Markovich , Timothy Antesberger , Frank D. Egitto , William Wilson , Rabindra N. Das
IPC分类号： H05K1/03 , H05K1/02 , H05K1/09
CPC分类号： H05K3/4623 , H05K1/092 , H05K3/4053 , H05K3/4614 , H05K3/4691 , H05K2203/061
摘要： A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.
摘要翻译：一种用于PCB或PWB板的衬底，其具有无芯堆积层和至少一个金属和至少一个介电层。无芯堆积电介质层可由至少部分固化的热固性树脂和热塑性树脂组成。衬底还可以包含焊盘阵列（LGA）封装。

9. 发明申请

US20100264617A1 ISOLATED SPRING CLAMP GROUP 有权
标题翻译：隔离弹簧夹
公开(公告)号：US20100264617A1
公开(公告)日：2010-10-21
申请号：US12824462
申请日：2010-06-28
申请人： Ashley Thomas Dudding , William Wilson , Brent Collyer , Jerorne Lim Cortez , Patrick Williams
发明人： Ashley Thomas Dudding , William Wilson , Brent Collyer , Jerorne Lim Cortez , Patrick Williams
IPC分类号： B60G11/00 , B60G11/04
CPC分类号： B60G11/113 , B60G2202/112 , B60G2204/4306 , B60G2206/428 , Y10T428/24
摘要： A clamp assembly of a vehicle leaf spring suspension is disclosed. The clamp assembly has an axle bracket secured to a vehicle axle and a top cap secured to the axle bracket by mechanical fasteners to define an axle seat. The axle bracket and top cap may include interlocking keys and keyways to cooperate with the mechanical fasteners in transmitting the load from the vehicle axle. A spring seat of the leaf spring is received within the axle seat and is tapered. The tapered spring seat, when combined with a deformable liner in the axle seat, effectively eliminates the inactive portion of the leaf spring to increase the effective length of the spring and minimize the spring rate.
摘要翻译：公开了一种车辆弹簧悬架的夹紧组件。夹具组件具有固定到车辆车轴的车轴支架和通过机械紧固件固定到车轴支架以限定轴座的顶盖。轴支架和顶盖可以包括互锁键和键槽，以与机械紧固件配合以从车辆轴传输负载。板簧的弹簧座被容纳在轴座内并且是锥形的。当与轴座中的可变形衬套组合时，锥形弹簧座有效地消除了板簧的非活动部分，以增加弹簧的有效长度并使弹簧刚度最小化。

10. 发明申请

US20100038877A1 Vehicle Suspensions Having Leaf Springs And Alternative Clamp Groups 有权
标题翻译：具有叶子弹簧和替代夹具组的车辆悬架
公开(公告)号：US20100038877A1
公开(公告)日：2010-02-18
申请号：US11919534
申请日：2006-04-26
申请人： Jerome Lim Cortez , Jason Steby Thomas , Ashley Thomas Dudding , William Wilson , Gregory Lewis McClain , Brent Collyer
发明人： Jerome Lim Cortez , Jason Steby Thomas , Ashley Thomas Dudding , William Wilson , Gregory Lewis McClain , Brent Collyer
IPC分类号： B60G11/00
CPC分类号： B60G11/113 , B60G11/12 , B60G11/465 , B60G2200/31 , B60G2202/112 , B60G2204/121 , B60G2204/148 , B60G2204/4306 , B60G2206/30 , B60G2206/8201
摘要： A vehicle leaf spring suspension having a low spring rate is disclosed. The suspension has an axle seat secured to a vehicle axle. The leaf spring is clamped at its spring seat area to the axle seat at the clamp group mounting surface of the axle seat and with certain of the disclosed axle seats, can be clamped such that the spring seat area is asymmetrically positioned with respect to the vehicle axle centerline. Also, an active clamp group arrangement can be used to utilize the entire physical length of the leaf spring.
摘要翻译：公开了一种具有低弹簧刚度的车辆弹簧悬架。悬架具有固定到车轴的轴座。板簧在其弹簧座区域处被夹紧在轴座的夹具组安装表面处的轴座处，并且可以夹紧某些公开的轴座，使得弹簧座区域相对于车辆不对称地定位轴心线。此外，可以使用有源钳组布置来利用板簧的整个物理长度。

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