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1. 发明授权

US08324622B2 Method of repairing probe pads 有权
标题翻译：修复探针垫的方法
公开(公告)号：US08324622B2
公开(公告)日：2012-12-04
申请号：US12651332
申请日：2009-12-31
申请人： John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
发明人： John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
IPC分类号： H01L23/58 , H01L29/10
CPC分类号： H01L22/20 , H01L22/14 , H01L24/05 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.
摘要翻译：一种方法，其包括在衬底上形成第一电平的有源电路，形成电连接到所述第一电平有源电路的第一探针焊盘，其中所述第一探针焊盘具有第一表面，所述第一探针焊盘与所述第一探针焊盘接触，所述第一探针焊盘的位于所述第一表面上方的部分，以及在所述第一探针焊盘上执行化学机械抛光，以在所述第一表面上方平坦化所述第一探针焊盘的所述部分。该方法还包括形成覆盖在第一探针焊盘上的第二电平有源电路，形成电连接到第二电平有源电路的第二探针焊盘，使第二探针焊盘与移位探针焊盘的一部分的探针尖接触，以及化学机械地抛光第二探针垫以除去所移动的部分。

2. 发明申请

US20130063173A1 METHOD OF REPAIRING PROBE PADS 有权
标题翻译：修复探针垫的方法
公开(公告)号：US20130063173A1
公开(公告)日：2013-03-14
申请号：US13615368
申请日：2012-09-13
申请人： John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
发明人： John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
IPC分类号： G01R1/04
CPC分类号： H01L22/20 , H01L22/14 , H01L24/05 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.
摘要翻译：一种方法，其包括在衬底上形成第一电平的有源电路，形成电连接到所述第一电平有源电路的第一探针焊盘，其中所述第一探针焊盘具有第一表面，所述第一探针焊盘与所述第一探针焊盘接触，所述第一探针焊盘的位于所述第一表面上方的部分，以及在所述第一探针焊盘上执行化学机械抛光，以在所述第一表面上方平坦化所述第一探针焊盘的所述部分。该方法还包括形成覆盖在第一探针焊盘上的第二电平有源电路，形成电连接到第二电平有源电路的第二探针焊盘，使第二探针焊盘与移位探针焊盘的一部分的探针尖接触，以及化学机械地抛光第二探针垫以除去所移动的部分。

3. 发明申请

US20110156032A1 METHOD OF REPAIRING PROBE PADS 有权
标题翻译：修复探针垫的方法
公开(公告)号：US20110156032A1
公开(公告)日：2011-06-30
申请号：US12651332
申请日：2009-12-31
申请人： John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
发明人： John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
IPC分类号： H01L23/485 , H01L21/768
CPC分类号： H01L22/20 , H01L22/14 , H01L24/05 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.
摘要翻译：一种方法，其包括在衬底上形成第一电平的有源电路，形成电连接到所述第一电平有源电路的第一探针焊盘，其中所述第一探针焊盘具有第一表面，所述第一探针焊盘与所述第一探针焊盘接触，所述第一探针焊盘的位于所述第一表面上方的部分，以及在所述第一探针焊盘上执行化学机械抛光，以在所述第一表面上方平坦化所述第一探针焊盘的所述部分。该方法还包括形成覆盖在第一探针焊盘上的第二电平有源电路，形成电连接到第二电平有源电路的第二探针焊盘，使第二探针焊盘与移位探针焊盘的一部分的探针尖接触，以及化学机械地抛光第二探针垫以除去所移动的部分。

4. 发明授权

US08822994B2 Method of repairing probe pads 有权
标题翻译：修复探针垫的方法
公开(公告)号：US08822994B2
公开(公告)日：2014-09-02
申请号：US13615368
申请日：2012-09-13
申请人： John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
发明人： John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
IPC分类号： H01L23/58 , H01L29/10 , H01L21/66
CPC分类号： H01L22/20 , H01L22/14 , H01L24/05 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.
摘要翻译：一种方法，其包括在衬底上形成第一电平的有源电路，形成电连接到所述第一电平有源电路的第一探针焊盘，其中所述第一探针焊盘具有第一表面，所述第一探针焊盘与所述第一探针焊盘接触，所述第一探针焊盘的位于所述第一表面上方的部分，以及在所述第一探针焊盘上执行化学机械抛光，以在所述第一表面上方平坦化所述第一探针焊盘的所述部分。该方法还包括形成覆盖在第一探针焊盘上的第二电平有源电路，形成电连接到第二电平有源电路的第二探针焊盘，使第二探针焊盘与移位探针焊盘的一部分的探针尖接触，以及化学机械地抛光第二探针垫以除去所移动的部分。

5. 发明申请

US20130072011A1 METHOD OF REPAIRING PROBE PADS 审中-公开
公开(公告)号：US20130072011A1
公开(公告)日：2013-03-21
申请号：US13619616
申请日：2012-09-14
申请人： John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
发明人： John H. Zhang , Laertis Economikos , Robin Van Den Nieuwenhuizen , Wei-Tsu Tseng
IPC分类号： H01L21/768
CPC分类号： H01L22/20 , H01L22/14 , H01L24/05 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.

6. 发明授权

US07790541B2 Method and structure for forming multiple self-aligned gate stacks for logic devices 有权
标题翻译：用于形成用于逻辑器件的多个自对准栅极堆叠的方法和结构
公开(公告)号：US07790541B2
公开(公告)日：2010-09-07
申请号：US11950095
申请日：2007-12-04
申请人： Bruce B. Doris , Mahender Kumar , Werner A. Rausch , Robin Van Den Nieuwenhuizen
发明人： Bruce B. Doris , Mahender Kumar , Werner A. Rausch , Robin Van Den Nieuwenhuizen
IPC分类号： H01L21/8238 , H01L21/336 , H01L21/76
CPC分类号： H01L21/823878 , H01L21/823842
摘要： A method for forming multiple self-aligned gate stacks, the method comprising, forming a first group of gate stack layers on a first portion of a substrate, forming a second group of gate stack layers on a second portion of the substrate adjacent to the first portion of the substrate, etching to form a trench disposed between the first portion and the second portion of the substrate, and filling the trench with an insulating material.
摘要翻译：一种用于形成多个自对准栅极堆叠的方法，所述方法包括：在衬底的第一部分上形成第一组栅极堆叠层，在所述衬底的邻近所述第一部分的第二部分上形成第二组栅极堆叠层蚀刻以形成设置在衬底的第一部分和第二部分之间的沟槽，并用绝缘材料填充沟槽。

7. 发明申请

US20090140347A1 METHOD AND STRUCTURE FOR FORMING MULTIPLE SELF-ALIGNED GATE STACKS FOR LOGIC DEVICES 有权
标题翻译：形成用于逻辑设备的多个自对准栅格堆叠的方法和结构
公开(公告)号：US20090140347A1
公开(公告)日：2009-06-04
申请号：US11950095
申请日：2007-12-04
申请人： Bruce B. Doris , Mahender Kumar , Werner A. Rausch , Robin Van Den Nieuwenhuizen
发明人： Bruce B. Doris , Mahender Kumar , Werner A. Rausch , Robin Van Den Nieuwenhuizen
IPC分类号： H01L27/092 , H01L21/8238
CPC分类号： H01L21/823878 , H01L21/823842
摘要： A method for forming multiple self-aligned gate stacks, the method comprising, forming a first group of gate stack layers on a first portion of a substrate, forming a second group of gate stack layers on a second portion of the substrate adjacent to the first portion of the substrate, etching to form a trench disposed between the first portion and the second portion of the substrate, and filling the trench with an insulating material.
摘要翻译：一种用于形成多个自对准栅极堆叠的方法，所述方法包括：在衬底的第一部分上形成第一组栅极堆叠层，在所述衬底的邻近所述第一部分的第二部分上形成第二组栅极堆叠层蚀刻以形成设置在衬底的第一部分和第二部分之间的沟槽，并用绝缘材料填充沟槽。

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