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    • 1. 发明授权
    • Integrated circuit design method and system
    • 集成电路设计方法与系统
    • US08656325B2
    • 2014-02-18
    • US13348850
    • 2012-01-12
    • John E. BarwinAmol A. JoshiBaozhen LiMichael R. Ouellette
    • John E. BarwinAmol A. JoshiBaozhen LiMichael R. Ouellette
    • G06F17/50
    • G06F17/5068G06F2217/76G06F2217/78
    • Disclosed is an integrated circuit design method that determines maximum direct currents for metal components and uses them as design constraints in the design flow in order to avoid/minimize electromigration failures. Short and long metal components are treated differently for purposes of establishing the design constraints. For a short metal component, the maximum direct current as a function of a given temperature for a given expected lifetime of the integrated circuit is determined, another maximum direct current is determined based on the Blech length, and the higher of these two is selected and used as the design constraint for that short metal component. For a long metal component, only the maximum direct current as a function of the given temperature for the given expected lifetime is determined and used as the design constraint. Also disclosed herein are associated system and program storage device embodiments for designing an integrated circuit.
    • 公开了集成电路设计方法,其确定金属部件的最大直流电流,并将其用作设计流程中的设计约束,以避免/最小化电迁移故障。 为了建立设计约束的目的,对短和长金属部件进行不同的处理。 对于短金属部件,确定针对集成电路的给定预期寿命的给定温度的函数的最大直流电,基于Blech长度确定另一最大直流电流,并且选择这两个中的较高者, 用作该短金属部件的设计约束。 对于长金属部件,仅确定作为给定预期寿命的给定温度的函数的最大直流电流作为设计约束。 本文还公开了用于设计集成电路的相关联的系统和程序存储设备实施例。
    • 2. 发明申请
    • INTEGRATED CIRCUIT DESIGN METHOD AND SYSTEM
    • 集成电路设计方法与系统
    • US20130185684A1
    • 2013-07-18
    • US13348850
    • 2012-01-12
    • John E. BarwinAmol A. JoshiBaozhen LiMichael R. Ouellette
    • John E. BarwinAmol A. JoshiBaozhen LiMichael R. Ouellette
    • G06F17/50
    • G06F17/5068G06F2217/76G06F2217/78
    • Disclosed is an integrated circuit design method that determines maximum direct currents for metal components and uses them as design constraints in the design flow in order to avoid/minimize electromigration failures. Short and long metal components are treated differently for purposes of establishing the design constraints. For a short metal component, the maximum direct current as a function of a given temperature for a given expected lifetime of the integrated circuit is determined, another maximum direct current is determined based on the Blech length, and the higher of these two is selected and used as the design constraint for that short metal component. For a long metal component, only the maximum direct current as a function of the given temperature for the given expected lifetime is determined and used as the design constraint. Also disclosed herein are associated system and program storage device embodiments for designing an integrated circuit.
    • 公开了集成电路设计方法,其确定金属部件的最大直流电流,并将其用作设计流程中的设计约束,以避免/最小化电迁移故障。 为了建立设计约束的目的,对短和长金属部件进行不同的处理。 对于短金属部件,确定针对集成电路的给定预期寿命的给定温度的函数的最大直流电,基于Blech长度确定另一最大直流电流,并且选择这两个中的较高者, 用作该短金属部件的设计约束。 对于长金属部件,仅确定作为给定预期寿命的给定温度的函数的最大直流电流作为设计约束。 本文还公开了用于设计集成电路的相关联的系统和程序存储设备实施例。
    • 3. 发明申请
    • INTEGRATED CIRCUIT DESIGN SIMULATION MATRIX INTERPOLATION
    • 集成电路设计仿真矩阵插值
    • US20130085726A1
    • 2013-04-04
    • US13251517
    • 2011-10-03
    • Peter A. HabitzAmol A. Joshi
    • Peter A. HabitzAmol A. Joshi
    • G06F17/50
    • G06F17/5036
    • Methods and systems perform a simulation on an integrated circuit design by applying a first value to a first variable and a second value to a second variable of the simulation to produce a first matrix corner simulation value. The methods and systems repeat the simulation using different values for the first and said second variables to produce a second matrix corner simulation value, a third matrix corner simulation value, and a fourth matrix corner simulation value. The methods and systems create a matrix, and the matrix has the first matrix corner simulation value, the second matrix corner simulation value, the third matrix corner simulation value, and the fourth matrix corner simulation value. The methods and systems interpolate all remaining values within the matrix based upon existing simulation values within the matrix.
    • 方法和系统通过将第一值应用于第一变量和第二值到模拟的第二变量来对集成电路设计进行仿真以产生第一矩阵角模拟值。 方法和系统使用不同的值对第一和第二变量重复模拟,以产生第二矩阵角模拟值,第三矩阵角模拟值和第四矩阵角模拟值。 方法和系统创建矩阵,矩阵具有第一矩阵角模拟值,第二矩阵角模拟值,第三矩阵角模拟值和第四矩阵角模拟值。 方法和系统基于矩阵内的现有模拟值来内插矩阵内的所有剩余值。
    • 5. 发明授权
    • Integrated circuit design simulation matrix interpolation
    • 集成电路设计仿真矩阵插值
    • US08855993B2
    • 2014-10-07
    • US13251517
    • 2011-10-03
    • Peter A. HabitzAmol A. Joshi
    • Peter A. HabitzAmol A. Joshi
    • G06F17/50
    • G06F17/5036
    • Methods and systems perform a simulation on an integrated circuit design by applying a first value to a first variable and a second value to a second variable of the simulation to produce a first matrix corner simulation value. The methods and systems repeat the simulation using different values for the first and said second variables to produce a second matrix corner simulation value, a third matrix corner simulation value, and a fourth matrix corner simulation value. The methods and systems create a matrix, and the matrix has the first matrix corner simulation value, the second matrix corner simulation value, the third matrix corner simulation value, and the fourth matrix corner simulation value. The methods and systems interpolate all remaining values within the matrix based upon existing simulation values within the matrix.
    • 方法和系统通过将第一值应用于第一变量和第二值到模拟的第二变量来对集成电路设计进行仿真以产生第一矩阵角模拟值。 方法和系统使用不同的值对第一和第二变量重复模拟,以产生第二矩阵角模拟值,第三矩阵角模拟值和第四矩阵角模拟值。 方法和系统创建矩阵,矩阵具有第一矩阵角模拟值,第二矩阵角模拟值,第三矩阵角模拟值和第四矩阵角模拟值。 方法和系统基于矩阵内的现有模拟值来内插矩阵内的所有剩余值。