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    • 1. 发明授权
    • High temperature and chemical resistant process for wafer thinning and backside processing
    • 晶圆薄化和背面加工的高温耐化学工艺
    • US07232770B2
    • 2007-06-19
    • US10908230
    • 2005-05-03
    • John C. MooreAlexander C Smith
    • John C. MooreAlexander C Smith
    • H01L21/31
    • H01L21/3065H01L21/2007
    • A process which uses a silicone resin to form a wafer-to-carrier bonded package that enables wafer thinning and backside processing while the cured resin exhibits high chemical and thermal resistance. The process is versatile in that the constructed wafer package allows for a wide range of chemical exposures to include dilute acid and base etchants, resist and residue strippers, electroplating chemistries, and also providing use in a range of deposition and etch processes that may exceed 300° C. The process utilizes a mixture of silicone monomers that when applied to semiconductor wafers by a spin-coat application, the result is a planarization of the front side device area, and when a subsequent thin coat is applied will facilitate bonding of the wafer-to-carrier package when heat and pressure are applied. The cured silicone bonded wafer-to-carrier package allows for wafer thinning consistent to industry objectives. Backside processing may include thermal oxide deposition, installed vias, and subsequent metallization in plating baths. Upon completion of a thinned and processed wafer, detachment occurs as described in prior art. Specialty chemical systems which completely dissolves the cured silicone and allows the wafer substrate to be easily rinsed and dried and become available for subsequent processing or final dicing and packaging.
    • 使用有机硅树脂形成晶片与载体结合的封装的方法,其能够在固化树脂表现出高的耐化学性和耐热性的同时进行晶片变薄和背面加工。 该方法是多功能的,因为构建的晶片封装允许广泛的化学暴露,包括稀酸和碱蚀刻剂,抗蚀剂和残留剥离剂,电镀化学品,并且还可以在可能超过300的沉积和蚀刻工艺的范围内使用 该方法利用硅氧烷单体的混合物,当通过旋涂施加到半导体晶片上时,其结果是前侧装置区域的平坦化,并且当施加后续薄涂层时将有助于晶片的结合 在施加热和压力时对载体封装。 固化的硅氧烷键合晶片与载体封装允许与工业目标一致的晶片变薄。 背面处理可以包括热氧化物沉积,安装的通孔以及随后在电镀槽中的金属化。 在完成薄化和加工的晶片时,如现有技术中所述发生剥离。 完全溶解固化的硅氧烷的特殊化学系统,并允许晶片基材容易地漂洗和干燥,并可用于后续加工或最终切割和包装。
    • 2. 发明授权
    • Adhesive support method for wafer coating, thinning and backside processing
    • 用于晶片涂布,变薄和背面加工的粘合剂支持方法
    • US07098152B2
    • 2006-08-29
    • US10899910
    • 2004-07-27
    • John C. Moore
    • John C. Moore
    • H01L21/30
    • C09J193/04
    • A liquid form adhesive system is provided for spin-coating on wafers and mounting to rigid carrier substrates to support thinning and backside processing. The liquid adhesive comprises about 30–35% of a rosin, between 5–10% of a thermoplastic urethane, a nonionic surfactant present between 1–3%, and a trace of an ultraviolet fluorescing dye. The entire system is dissolved in 50–65%, by weight, of a dual solvent mixture composed of dimethylacetamide and propylene glycol monomethyl ether. When the mixture is made to a specific viscosity, filtered, applied by a spin-coating method to the wafer frontside surface, and cured, the result is a uniform and smooth surface of defined thickness. When the coated wafer is mounted to a rigid substrate, it may be mechanically thinned to thicknesses down to and beyond 25 um, depending upon the wafer composition, diameter, and process. Once thinned, the adhesive is safe for backside processing and is dissolved away at completion to provide a thinned wafer that is clean and ready for final dicing or chipping operations.
    • 提供液体形式的粘合剂系统,用于在晶片上旋涂并安装到刚性载体基底上,以支持变薄和背面处理。 液体粘合剂包含约30-35%的松香,5-10%的热塑性氨基甲酸酯,1-3%之间的非离子表面活性剂和痕量的紫外线荧光染料。 整个体系溶解在由二甲基乙酰胺和丙二醇单甲醚组成的双重溶剂混合物的50-65重量%中。 当将混合物制成特定粘度时,通过旋转涂覆法过滤,并将其固化,结果是具有规定厚度的均匀光滑的表面。 当涂覆的晶片安装到刚性基板上时,根据晶圆的组成,直径和工艺,可将其机械薄化至低于或超过25um的厚度。 一旦变薄,粘合剂对于背面处理是安全的,并在完成时溶解,以提供干净的并且准备好进行最终切割或切片操作的薄的晶片。
    • 3. 发明授权
    • Cured polymers dissolving compositions
    • US06818608B2
    • 2004-11-16
    • US10061556
    • 2002-02-01
    • John C. Moore
    • John C. Moore
    • C11D337
    • H01L21/31133C09D9/005C11D3/245C11D3/28C11D3/30C11D11/0047G03F7/425H05K3/288
    • A cured resin dissolving composition comprising an alkyl ammonium fluoride dissolved in a wide variety of solvents and co-solvents with a soluble amine and surfactant. The composition is ionized to release fluoride which penetrates and reacts with the cured resin causing bond cleavage, breakdown, and dissolution of polymeric structure. The solvent system may be composed of hydrophilic solvents such as amides, ketones, alcohols, esters, and ethers, as well as hydrophobic families such as alkanes, alkenes, halogenated hydrocarbons, and aromatic hydrocarbons of varying carbon chain length and molecular weight. The rate of reactivity of polymer breakdown is concentration dependent upon ionized fluoride, stimulated by solution polarity and upon the amine triggered release from the organo-fluoirde. This rate is determined to be optimum in hydrophilic solvent systems with an amine. The product may be used in manufacturing to remove unwanted cured resins and their residues. Using such a hydrophilic solvent system, the formulation can be easily rinsed with water, an alcohol, or another hydrophilic rinse. When used in a hydrophobic system, rinsing is achieved with a surfactanated pre-rinse, alcohol, or another compatible solvent. By choosing between the philic and phobic formulations, selectivity towards silicone polymer may be exercised over the presence of other polymers. The formulations are safe for a wide range of metals allowing broad use in manufacturing for a wide range of applications in various industries. Hydrophilic formulations may also be used to breakdown and remove cured polymers other than silicones which include acrylic, epoxy, and novolak systems. In such cases, exposure times and conditions will vary depending upon the extent of curing. The invention has application in a wide range of industries where removal of cured resin is desired either in processing parts or for re-working. Examples of electronic industry applications include removing silicone conformal coatings, adhesives, potting compounds; applications in aerospace include removing sealant fillets during etching and machining of jet engine parts, dissolving sealant and residue from acrylic surfaces.
    • 7. 发明授权
    • Method and system for detecting the effects of Alzheimer's disease in the human retina
    • 用于检测人类视网膜中阿尔茨海默病的影响的方法和系统
    • US06988995B2
    • 2006-01-24
    • US10260927
    • 2002-09-30
    • Qienyuan ZhouMichael J. SinaiJohn C. MooreWilliam Wong
    • Qienyuan ZhouMichael J. SinaiJohn C. MooreWilliam Wong
    • A61B13/00
    • A61B3/1225A61B3/1005
    • A system for the in vivo detection of the effects of AD in the interior of an eye. A scanning polarimeter, including a residual retardance canceling system and an improved anterior segment retardance compensator, produces an optical analysis signal representing the birefringence of the retinal nerve fiber layer (RNFL) structures of the eye. The birefringence data is more accurate because of compensation for anterior segment birefringence and residual birefringence of optical components, such as, for example, the beam splitters, lenses, scanners and retarders. An electrical analysis signal representing a large (20 by 40 degrees) retardance map is produced and evaluated by an artificial neural network to produce an analysis classification signal representing the contribution of Alzheimer's disease to the birefringence of the retinal layer corresponding to the relationship of the electrical analysis signal to an analysis signal database.
    • 用于体内检测眼睛内部AD的影响的系统。 包括残余延迟消除系统和改进的前段延迟补偿器的扫描偏振计产生表示眼睛的视网膜神经纤维层(RNFL)结构的双折射的光学分析信号。 双折射数据更准确,因为补偿光学部件的前段双折射和残余双折射,例如分束器,透镜,扫描器和延迟器。 表示大(20×40度)延迟图的电分析信号由人工神经网络产生和评估,以产生表示阿尔茨海默病对视网膜层的双折射的贡献的分析分类信号,其对应于电气 分析信号到分析信号数据库。
    • 8. 发明授权
    • Secondary tubing containment system for a metering pump
    • 用于计量泵的二次管道密封系统
    • US06328345B1
    • 2001-12-11
    • US09492597
    • 2000-01-27
    • John C. MooreKevin Moran
    • John C. MooreKevin Moran
    • F16L1112
    • F16L27/12
    • A secondary tubing containment system (10) is provided for a discharge tube (18) of a chemical metering pump (14) in a chemical addition system (12). One end of the discharge tube (18) is engaged in a fitting (20) on the metering pump (14), and the other end of the discharge tube (18) is engaged in a fitting (22). The containment system (10) includes a pair of coupling nuts (30, 32), a connector in the form of a Tee (34), two cylindrical tubes (36, 38), a pair of unions (40, 42), and a drain tube (44). The inside and outside diameters of the tubes (36, 38) are sized to allow the tube (38) to be slid or telescoped into the tube (36) to allow the length of the containment system (10) to be adjusted. The union (40) is configured to sealingly engage the tube (38) along the length of the tube (38) to accommodate the adjustment. This allows the containment system (10) to accommodate different lengths of discharge tube (18), as dictated by the particular chemical addition system (12) to which the containment system (10) is being assembled.
    • 在化学添加系统(12)中为化学计量泵(14)的排放管(18)提供辅助管道密封系统(10)。 放电管(18)的一端与计量泵(14)上的配件(20)接合,放电管(18)的另一端与配件(22)接合。 容纳系统(10)包括一对联接螺母(30,32),三通(34)形式的连接器,两个圆柱形管(36,38),一对接头(40,42)和 排水管(44)。 管(36,38)的内径和外径的尺寸设定成允许管(38)滑动或伸缩到管(36)中,以允许调节容纳系统(10)的长度。 联接件(40)构造成沿着管(38)的长度密封地接合管(38)以适应调节。 这允许容纳系统(10)适应不同长度的放电管(18),如由容纳系统(10)组装到的特定化学添加系统(12)所规定的。
    • 9. 发明授权
    • Coin chute assembly
    • 硬币滑槽总成
    • US4664245A
    • 1987-05-12
    • US166357
    • 1980-07-07
    • Rex M. MaloyJohn C. Moore
    • Rex M. MaloyJohn C. Moore
    • G07D5/00G07D5/08G07F1/04
    • G07D5/08
    • An improved coin chute assembly wherein the housing contains a coin receiving opening, a first coin exit opening, a second coin exit opening, and a coin passageway disposed therein and interconnecting the coin receiving opening with the first and second coin exit openings. The coin passageway is characterized as having an upper coin path, a coin receiving section and a coin reject section, the upper coin path being oriented to permit a coin to fall in a substantially downward direction through the chute assembly and thus through the coin receiving section towards the first coin exit opening or through the coin reject section towards the second coin exit opening. A coil having a coin slot formed therethrough is positioned around the upper coin path such that an object traveling through the upper coin path passes through the coin slot. A gate assembly is movably disposed in a portion of the coin path for blocking movement of a coin through the coin receiving section of the coin path in one position and directing the coin into the coin reject section; or for permitting movement of the coin into and through the coin receiving section while blocking movement of the coin through the coin reject section.
    • 一种改进的硬币滑槽组件,其中壳体包含硬币接收开口,第一硬币出口,第二硬币出口和设置在其中的硬币通道,并将硬币接收开口与第一和第二硬币出口相互连接。 硬币通道的特征在于具有上硬币路径,硬币接收部分和硬币拒绝部分,所述上方硬币路径被定向成允许硬币通过所述滑槽组件向大致向下的方向落下,并且因此通过所述硬币接收部分 朝向第一硬币出口开口或通过硬币拒绝部分朝向第二硬币出口。 具有穿过其形成的硬币槽的线圈围绕上方硬币路径定位,使得穿过上方硬币路径的物体穿过硬币槽。 门组件可移动地设置在硬币路径的一部分中,用于阻挡硬币通过硬币路径的硬币接收部分在一个位置的运动,并将硬币引导到硬币拒绝部分中; 或者用于允许硬币进入和通过硬币接收部分,同时阻止硬币通过硬币拒绝部分的移动。