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1. 发明授权

US4809308A Method and apparatus for performing automated circuit board solder quality inspections 失效
标题翻译：执行自动化电路板焊料质量检查的方法和装置
公开(公告)号：US4809308A
公开(公告)日：1989-02-28
申请号：US831997
申请日：1986-02-20
申请人： John Adams , Juan Amoroso, Jr. , Paul Axford , Phil Bowles , Mike Juha , Van Nguyen , Charles Preskitt , Ed Ross , Doug Thompson , Paul Turner
发明人： John Adams , Juan Amoroso, Jr. , Paul Axford , Phil Bowles , Mike Juha , Van Nguyen , Charles Preskitt , Ed Ross , Doug Thompson , Paul Turner
IPC分类号： H01L21/66 , G01N23/04 , G01N23/18 , G01R31/304 , G06T7/00 , H05K3/34 , G06F15/46
CPC分类号： G06T7/0006 , G01N23/18 , G01R31/304 , G06T2207/10121 , G06T2207/30141 , G06T2207/30152 , Y10S378/901
摘要： A method and apparatus for measuring structural characteristics of a manufactured circuit board containing solder joints by automated real-time digital X-ray radiographic inspection techniques. A circuit board under examination is automatically positioned by a digitally controlled multi-axis positioning system between an electronic X-ray source and an electronic X-ray imaging system. X-rays, in a beam of X-rays from the X-ray source, are directed towards the circuit board. The X-rays are absorbed, scattered and transmitted through the circuit board. The X-rays transmitted through the circuit board are directed upon the X-ray imaging system. The X-ray imaging system converts the transmitted X-rays into digital images which represent the radiographic density of the portion of the circuit board under examination. The digital images are stored within a digital image processor. A computer, under program control, performs calculational measurements on the digital images so as to measure the structural characteristics of the solder joints and components on the circuit board. The calculational measurements are compared to predetermined standards corresponding to acceptable quality standards programmed into the computer. In response to the comparison, the computer provides an accept/reject decision on the circuit board in addition to providing manufacturing process control information for correction of found defects.
摘要翻译：一种用于通过自动实时数字X射线照相检查技术测量制造的包含焊点的电路板的结构特性的方法和装置。正在检查的电路板通过数字控制的多轴定位系统在电子X射线源和电子X射线成像系统之间自动定位。来自X射线源的X射线束中的X射线被引向电路板。 X射线被吸收，散射并透过电路板。通过电路板传输的X射线被引导到X射线成像系统。 X射线成像系统将透射的X射线转换为表示正在检查的电路板的部分的放射照相密度的数字图像。数字图像存储在数字图像处理器中。计算机在程序控制下，对数字图像执行计算测量，以便测量电路板上焊点和部件的结构特性。将计算测量与对应于编入计算机的可接受的质量标准的预定标准进行比较。响应于比较，除了提供用于校正发现的缺陷的制造过程控制信息之外，计算机还在电路板上提供接受/拒绝决定。

2. 再颁专利

USRE35423E Method and apparatus for performing automated circuit board solder quality inspections 失效
标题翻译：执行自动化电路板焊料质量检查的方法和装置
公开(公告)号：USRE35423E
公开(公告)日：1997-01-14
申请号：US182841
申请日：1994-01-14
申请人： John Adams , Juan Amoroso, Jr. , Paul Axford , Phil Bowles , Mike Juha , Van Nguyen , Charles Preskitt , Ed Ross , Doug Thompson , Paul Turner
发明人： John Adams , Juan Amoroso, Jr. , Paul Axford , Phil Bowles , Mike Juha , Van Nguyen , Charles Preskitt , Ed Ross , Doug Thompson , Paul Turner
IPC分类号： H01L21/66 , G01N23/04 , G01N23/18 , G01R31/304 , G06T7/00 , H05K3/34 , G06F15/46
CPC分类号： G06T7/0006 , G01N23/18 , G01R31/304 , G06T2207/10121 , G06T2207/30141 , G06T2207/30152 , Y10S378/901
摘要： A method and apparatus for measuring structural characteristics of a manufactured circuit board containing solder joints by automated real-time digital X-ray radiographic inspection techniques. A circuit board under examination is automatically positioned by a digitally controlled multi-axis positioning system between an electronic X-ray source and an electronic X-ray imaging system, X-rays, in a beam of X-rays from the X-ray source, are directed towards the circuit board. The X-rays are absorbed, scattered and transmitted through the circuit board. The X-rays transmitted through the circuit board are directed upon the X-ray imaging system. The X-ray imaging system converts the transmitted X-rays into digital images which represent the radiographic density of the portion of the circuit board under examination. The digital images are stored within a digital image processor. A computer, under program control, performs calculational measurements on the digital images so as to measure the structural characteristics of the solder joints and components on the circuit board. The calculational measurements are compared to predetermined standards corresponding to acceptable quality standards programmed into the computer. In response to the comparison, the computer provides an accept/reject decision on the circuit board in addition to providing manufacturing process control information for correction of found defects.The questions raised in reexamination request No. 90/002,298, filed Mar. 15, 1991, have been considered and the results thereof are reflected in this reissue patent which constitutes the reexamination certificate required by 35 U.S.C. 307 as provided in 37 CRF 1.570(e).
摘要翻译：一种用于通过自动实时数字X射线照相检查技术测量制造的包含焊点的电路板的结构特性的方法和装置。正在检查的电路板通过数字控制的多轴定位系统在电子X射线源和电子X射线成像系统之间通过X射线从X射线源X射线自动定位，指向电路板。 X射线被吸收，散射并透过电路板。通过电路板传输的X射线被引导到X射线成像系统。 X射线成像系统将透射的X射线转换为表示正在检查的电路板的部分的放射照相密度的数字图像。数字图像存储在数字图像处理器中。计算机在程序控制下，对数字图像执行计算测量，以便测量电路板上焊点和部件的结构特性。将计算测量与对应于编入计算机的可接受的质量标准的预定标准进行比较。响应于比较，除了提供用于校正发现的缺陷的制造过程控制信息之外，计算机还在电路板上提供接受/拒绝决定。已经考虑了1991年3月15日提交的第90 / 002,298号复审请求中提出的问题，其结果反映在该重新颁发专利中，该专利构成了35U.S.C.所要求的复审证书。 307如CRF 1.570（e）所述。

3. 发明授权

US5793480A Combined interferometer/ellipsometer for measuring small spacings 失效
标题翻译：用于测量小间距的组合式干涉仪/椭偏仪
公开(公告)号：US5793480A
公开(公告)日：1998-08-11
申请号：US719003
申请日：1996-09-24
申请人： Christopher A. Lacey , Kenneth H. Womack , Carlos Duran , Ed Ross , Semyon Nodelman
发明人： Christopher A. Lacey , Kenneth H. Womack , Carlos Duran , Ed Ross , Semyon Nodelman
IPC分类号： G01N21/21 , G01B9/02
CPC分类号： G01N21/211
摘要： An apparatus and method for measuring the space between a transparent member such as a substrate, and reflective member such as a slider. The apparatus includes a first optical system which detects a first light beam that is reflected from the substrate and the slider. The reflected light is separated into four separate beams. The intensities of the beams are detected and utilized to determine a first stokes parameter, a second stokes parameter, a third stokes parameter and a fourth stokes parameter of the reflected light. The stokes parameters are used to compute the real index of refraction n, extinction coefficient k and the thickness of the space. The four stokes parameters account for any depolarized light that is reflected from the slider. The first optical system may have a photodetector which detects an image of the slider. The image provides multiple data points that can be used to calculate n, k and the thickness of the air gap without a retract routine. The apparatus may also have a second optical system which detects a second light beam reflected from the substrate and the slider. The second optical system can be used to dynamically measure a thickness of the space. In the combined system the first optical system may accurately measure the n and k of a slider area while the second optical system dynamically measures the thickness of the air gap.
摘要翻译：用于测量诸如基板的透明构件之间的空间以及诸如滑块的反射构件之间的空间的装置和方法。该装置包括第一光学系统，其检测从基板和滑块反射的第一光束。反射光分成四个独立的光束。检测并利用光束的强度来确定反射光的第一斯托克斯参数，第二斯托克斯参数，第三斯托克斯参数和第四斯托克斯参数。斯托克斯参数用于计算实际折射率n，消光系数k和空间厚度。四个斯托克斯参数表示从滑块反射的任何去极化光。第一光学系统可以具有检测滑块的图像的光电检测器。图像提供了多个数据点，可用于计算n，k和气隙的厚度，而无需缩回程序。该装置还可以具有检测从基板和滑块反射的第二光束的第二光学系统。第二光学系统可用于动态测量空间的厚度。在组合系统中，第一光学系统可以精确地测量滑块区域的n和k，而第二光学系统动态地测量气隙的厚度。

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