专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5166308A Copolyimide film with improved properties 失效
标题翻译：具有改进性能的共聚酰亚胺膜
公开(公告)号：US5166308A
公开(公告)日：1992-11-24
申请号：US516887
申请日：1990-04-30
申请人： John A. Kreuz , Richard F. Sutton, Jr.
发明人： John A. Kreuz , Richard F. Sutton, Jr.
IPC分类号： B29C41/12 , B29K79/00 , C08G73/10 , C08J5/18 , H05K1/03 , H05K3/02
CPC分类号： C08J5/18 , C08G73/1042 , C08G73/1071 , C08J2379/08 , H05K1/0346 , H05K2201/0154 , H05K3/022
摘要： Disclosed is an aromatic copolyimide film prepared by chemical conversion of a copolyamide acid solution obtained by copolymerization of an aromatic tetracarboxylic acid component comprising from 30 to 50 mole % of biphenyltetracarboxylic acid dianhydride, 50 to 70 mole % of pyromellitic acid dianhydride, 60 to 80 mole % of p-phenylenediamine and 20 to 40 mole % of 4,4'-diaminodiphenyl ether. The aromatic copolyimide film has a low coefficient of thermal expansion, low water absorption, a low coefficient of hygroscopic expansion, high mechanical strength and is readily etchable making it suitable for use an advanced electronic substrate.

2. 发明授权

US5196500A Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride 失效
标题翻译：含有苯并噻唑酮的四聚酰亚胺薄膜
公开(公告)号：US5196500A
公开(公告)日：1993-03-23
申请号：US628769
申请日：1990-12-17
申请人： John A. Kreuz , Richard F. Sutton, Jr. , Stuart N. Milligan
发明人： John A. Kreuz , Richard F. Sutton, Jr. , Stuart N. Milligan
IPC分类号： C08J5/18 , B29K79/00 , C08G73/10 , C09J7/02 , H01L21/60 , H01L23/14 , H05K1/03
CPC分类号： H05K1/0346 , C08G73/1071 , H01L23/145 , H01L2924/0002 , Y10T428/31721
摘要： Tetrapolyimide films derived from 3,3',4,4'-benzophenone tetracarboxylic dianhydride, pyromellitic acid dianhydride, p-phenylene diamine and 4,4'-diaminodiphenyl ether, and their preparation, are described. The tetrapolymer films have low water absorption, low coefficients of thermal and hygroscopic expansion, high modulus and are caustic etachable and can be used in flexible printed circuit and tape automated bonding applications.

3. 发明授权

US5298331A Flexible multi-layer polyimide film laminates and preparation thereof 失效
标题翻译：柔性多层聚酰亚胺薄膜层压板及其制备
公开(公告)号：US5298331A
公开(公告)日：1994-03-29
申请号：US878483
申请日：1992-05-05
申请人： Kuppusamy Kanakarajan , John A. Kreuz
发明人： Kuppusamy Kanakarajan , John A. Kreuz
IPC分类号： B32B15/08 , B32B15/088 , B32B27/34 , C08G73/10 , H05K1/00 , H05K1/03 , H05K3/38
CPC分类号： H05K3/386 , B32B27/34 , C08G73/1042 , C08G73/1067 , C08G73/1071 , H05K1/0346 , H05K1/036 , H05K1/0393 , H05K2201/0154 , H05K2201/0355 , Y10T428/31681 , Y10T428/31721
摘要： Flexible multilayer polyimide metal-clad laminates, and their preparation, having at least one layer of aromatic polyimide bonded to at least one layer of a metallic substrate using a heat-sealable copolyimide adhesive containing repeating imide units derived from 4,4'-oxydiphthalic dianhydride and an aromatic ether diamine. The laminates are used in flexible printed circuits and tape automated bonding applications. Additionally, the metallic substrate may be directly coated with the copolyimide adhesive and used as a single-clad laminate for flexible printed circuits.
摘要翻译：柔性多层聚酰亚胺金属包覆层压板及其制备方法，其具有至少一层芳族聚酰亚胺，其使用可热封的共聚酰亚胺粘合剂结合至至少一层金属基底，该粘合剂含有源自4,4'-氧联二邻苯二甲酸二酐的重复酰亚胺单元和芳香醚二胺。层压板用于柔性印刷电路和胶带自动粘接应用。此外，金属基材可以直接涂覆有共聚酰亚胺粘合剂，并且用作柔性印刷电路的单覆层压板。

4. 发明授权

US5411765A Flexible multi-layer polyimide film laminates and preparation thereof 失效
标题翻译：柔性多层聚酰亚胺薄膜层压板及其制备
公开(公告)号：US5411765A
公开(公告)日：1995-05-02
申请号：US168866
申请日：1993-12-14
申请人： Kuppusamy Kanakarajan , John A. Kreuz
发明人： Kuppusamy Kanakarajan , John A. Kreuz
IPC分类号： B32B15/08 , B32B15/088 , B32B27/34 , C08G73/10 , H05K1/00 , H05K1/03 , H05K3/38 , B05D3/02 , B05D3/10
CPC分类号： H05K3/386 , B32B27/34 , C08G73/1042 , C08G73/1067 , C08G73/1071 , H05K1/0346 , H05K1/036 , H05K1/0393 , H05K2201/0154 , H05K2201/0355 , Y10T428/31681 , Y10T428/31721
摘要： A process of making flexible multilayer polyimide metal-clad laminates, and their preparation, having at least one layer of aromatic polyimide bonded to at least one layer of a metallic substrate using a heat-sealable copolyimide adhesive containing repeating imide units derived from 4,4'-oxydiphthalic dianhydride and an aromatic ether diamine. The laminates are used in flexible printed circuits and tape automated bonding applications. Additionally, the metallic substrate may be directly coated with the copolyimide adhesive and used as a single-clad laminate for flexible printed circuits.
摘要翻译：制备柔性多层聚酰亚胺金属包覆层压板的方法及其制备方法，其具有至少一层芳族聚酰亚胺，该芳族聚酰亚胺结合至少一层金属基材，使用含有重复酰亚胺单元的可热封的共聚酰亚胺粘合剂 '氧基二邻苯二甲酸二酐和芳香醚二胺。层压板用于柔性印刷电路和胶带自动粘接应用。此外，金属基材可以直接涂覆有共聚酰亚胺粘合剂，并且用作柔性印刷电路的单覆层压板。

5. 发明授权

US5175240A Aromatic homopolyimide or copolyimide films having low water absorption and high thermal durability 失效
标题翻译：具有低吸水性和高耐热性的芳族聚酰亚胺或共聚酰亚胺膜
公开(公告)号：US5175240A
公开(公告)日：1992-12-29
申请号：US628234
申请日：1990-12-17
申请人： John A. Kreuz , Stuart N. Milligan
发明人： John A. Kreuz , Stuart N. Milligan
IPC分类号： C08G73/10 , C08J5/18 , H05K1/03 , H05K3/28
CPC分类号： C08G73/1067 , C08G73/1071 , H05K1/0346 , H05K3/281 , Y10T428/31721
摘要： Aromatic homopolyimide and copolyimide films derived from an aromatic dianhydride and a chlorinated aromatic diamine such as 2-chloro-p-phenylene diamine and 2,2'-dichloro-4,4'-diaminodiphenyl ether are described. The films have low water absorption, high elastic modulus and elongation and can be heat-processed without embrittlement.

6. 发明授权

US4426253A High speed etching of polyimide film 失效
标题翻译：高速蚀刻聚酰亚胺薄膜
公开(公告)号：US4426253A
公开(公告)日：1984-01-17
申请号：US327060
申请日：1981-12-03
申请人： John A. Kreuz , Christopher M. Hawkins
发明人： John A. Kreuz , Christopher M. Hawkins
IPC分类号： C08J7/02 , C08J7/12 , H01L21/308 , H01L21/311 , H05K1/03 , H05K3/00 , B29C17/08 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： C08J7/12 , H01L21/31133 , C08J2379/08 , H05K1/0346 , H05K3/0017
摘要： An aqueous solution of ethyl or propyl alcohol containing a basic compound such as KOH is shown to etch the surface of polyimide material up to 400 times faster than conventional aqueous KOH etching solutions.
摘要翻译：显示含有碱性化合物如KOH的乙基或丙醇的水溶液将聚酰亚胺材料的表面比常规KOH水溶液蚀刻溶液的蚀刻速度高达400倍。

7. 发明授权

US06444783B1 Melt-processible semicrystalline block copolyimides 失效
标题翻译：熔融加工半结晶嵌段共聚酰亚胺
公开(公告)号：US06444783B1
公开(公告)日：2002-09-03
申请号：US09741941
申请日：2000-12-21
申请人： John R. Dodd , John A. Kreuz , Brian C. Auman
发明人： John R. Dodd , John A. Kreuz , Brian C. Auman
IPC分类号： C08L7908
CPC分类号： C08G73/14 , C08G73/1014 , C08G73/1017 , C08G73/1042
摘要： Segmented, melt-processible, semicrystalline copolyimides are disclosed herein. These polymers are comprised of an amorphous or semicrystalline A segment (soft segment) and a semicrystalline B segment (hard segment), wherein the level of semicrystallinity in the A segment is less than that in the B segment. These copolyimides are semicrystalline and exhibit melting points in the range from about 330-395° C. In preferred embodiments, these copolyimides are end-capped and are crystallizable from their melts (i.e., they exhibit recoverable semicrystallinity). These copolyimides either inherently have suitably low melt visocosities to be melt-processible or can be made to have suitably low melt viscosities to be melt-processible by addition of certain additives. Tailoring of the melting points and glass transition temperatures of these copolyimides can be effected by changing their molecular architecture.
摘要翻译：本文公开了分段的，可熔融加工的半结晶共聚酰亚胺。这些聚合物由无定形或半结晶的A段（软链段）和半结晶B区段（硬链段）组成，其中A区段的半结晶度小于B区段的半结晶度。这些共聚酰亚胺是半结晶的，并且在约330-395℃的范围内显示出熔点。在优选的实施方案中，这些共聚酰亚胺被封端并且可以从它们的熔体中结晶（即它们表现出可回收的半结晶性）。这些共聚酰亚胺本质上具有适当的低熔融粘稠性以使其可熔融加工，或者可以制成具有合适的低熔融粘度，以通过加入某些添加剂而可熔融加工。这些共聚酰亚胺的熔点和玻璃化转变温度的调整可以通过改变它们的分子结构来实现。

8. 发明授权

US5219977A Tetrapolyimide film containing oxydipthalic dianhydride 失效
标题翻译：含有氧代二卤代二酐的四聚酰亚胺膜
公开(公告)号：US5219977A
公开(公告)日：1993-06-15
申请号：US920690
申请日：1992-07-30
申请人： John A. Kreuz
发明人： John A. Kreuz
IPC分类号： C08G73/10 , H01L23/14 , H05K1/03
CPC分类号： H05K1/0346 , C08G73/1071 , H01L23/145 , H01L2924/0002 , Y10T428/31721
摘要： Tetrapolyimide films derived from oxydiphthalic dianhydride, pyromellitic acid dianhydride, p-phenylene diamine and 4,4'-diaminodiphenyl ether, and their preparation are described. The tetrapolymer films have low water absorption, low coefficients of thermal and hygroscopic expansion, high modulus and are caustic etchable and can be used in flexible printed circuit and tape automated bonding applications.
摘要翻译：描述了衍生自氧联二邻苯二甲酸二酐，均苯四酸二酐，对苯二胺和4,4'-二氨基二苯醚的四聚酰亚胺膜及其制备方法。四元共聚物膜具有低吸水率，低吸热膨胀系数，高模量和碱腐蚀性，可用于柔性印刷电路和胶带自动粘合应用。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式