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1. 发明授权

US4786864A Photon assisted tunneling testing of passivated integrated circuits 失效
标题翻译：钝化集成电路的光子辅助隧道测试
公开(公告)号：US4786864A
公开(公告)日：1988-11-22
申请号：US932128
申请日：1986-11-18
申请人： Johannes G. Beha , Russell W. Dreyfus , Allan M. Hartstein , Gary W. Rubloff
发明人： Johannes G. Beha , Russell W. Dreyfus , Allan M. Hartstein , Gary W. Rubloff
IPC分类号： G01R31/308 , H01L21/66 , G01R31/02
CPC分类号： G01R31/308 , H01L22/14 , H01L2924/0002
摘要： Covering metal test pads of a passivated integrated circuit process intermediate wafer or completed integrated circuit chip-to-test, with a thin conductive overlayer, and then accessing the test pads through the passivation layer and conductive overlayer, by a pulsed laser to provide voltage-modulated photon-assisted tunneling through the insulation layer, to the conductive overlayer as an electron current, and detecting the resulting electron current, provides a nondestructive test of integrated circuits. The passivation, normally present to protect the integrated circuit, also lowers the threshold for photoelectron emission. The conductive overlayer acts as a photoelectron collector for the detector. A chip-to-test which is properly designed for photon assisted tunneling testing has test sites accessible to laser photons even though passivated. Such a chip-to-test may be nondestructively tested in air at one or several stages of its processing, without the sacrifices of mechanical probing or of bringing test sites out to output pads. The conductive overlayer may be removed after tests have been completed. Integrated circuit process intermediate chips may be specially designed for testability, with test sites grouped for easy access through windows left uncovered by subsequent layers.
摘要翻译：覆盖钝化集成电路工艺中间晶片或完成的集成电路芯片到测试的金属测试焊盘，具有薄的导电覆盖层，然后通过脉冲激光器通过钝化层和导电覆盖层访问测试焊盘，通过绝缘层调制的光子辅助隧穿，作为电子电流的导电覆层，并检测所得的电子电流，为集成电路提供非破坏性测试。通常存在的用于保护集成电路的钝化也降低了光电子发射的阈值。导电覆盖层用作检测器的光电收集器。适用于光子辅助隧道测试的芯片对测试即使钝化，激光光子也可以使用测试点。这样的芯片到测试可以在其处理的一个或几个阶段的空气中进行非破坏性测试，而不会牺牲机械探测或将测试点带到输出焊盘。测试完成后，导电覆层可以被去除。集成电路过程中间芯片可以特别设计用于可测试性，测试站点分组，以便通过后续层未被覆盖的窗口轻松访问。

2. 发明授权

US4644264A Photon assisted tunneling testing of passivated integrated circuits 失效
公开(公告)号：US4644264A
公开(公告)日：1987-02-17
申请号：US717409
申请日：1985-03-29
申请人： Johannes G. Beha , Russell W. Dreyfus , Allan M. Hartstein , Gary W. Rubloff
发明人： Johannes G. Beha , Russell W. Dreyfus , Allan M. Hartstein , Gary W. Rubloff
IPC分类号： G01R31/28 , G01R31/308 , H01L21/66 , G01R15/12 , G01R31/22 , G01R31/26
CPC分类号： G01R31/308 , H01L22/14 , H01L2924/0002
摘要： Covering metal test pads of a passivated integrated circuit process intermediate wafer or completed integrated circuit chip-to-test, with a thin conductive overlayer, and then accessing the test pads through the passivation layer and conductive overlayer, by a pulsed laser to provide voltage-modulated photon-assisted tunneling through the insulation layer, to the conductive overlayer as an electron current, and detecting the resulting electron current, provides a nondestructive test of integrated circuits. The passivation, normally present to protect the integrated circuit, also lowers the threshold for photoelectron emission. The conductive overlayer acts as a photoelectron collector for the detector. A chip-to-test which is properly designed for photon assisted tunneling testing has test sites accessible to laser photons even though passivated. Such a chip-to-test may be nondestructively tested in air at one or several stages of its processing, without the sacrifices of mechanical probing or of bringing test sites out to output pads. The conductive overlayer may be removed after tests have been completed. Integrated circuit process intermediate chips may be specially designed for testability, with test sites grouped for easy access through windows left uncovered by subsequent layers.

3. 发明授权

US10338923B2 Branch prediction path wrong guess instruction 有权
公开(公告)号：US10338923B2
公开(公告)日：2019-07-02
申请号：US12435631
申请日：2009-05-05
申请人： Philip G. Emma , Allan M. Hartstein , Keith N. Langston , Brian R. Prasky , Thomas R. Puzak , Charles F. Webb
发明人： Philip G. Emma , Allan M. Hartstein , Keith N. Langston , Brian R. Prasky , Thomas R. Puzak , Charles F. Webb
IPC分类号： G06F9/30 , G06F9/38 , G06F12/0862 , G06F8/41
摘要： A method for branch prediction, the method comprising, receiving a branch wrong guess instruction having a branch wrong guess instruction address and data including an opcode and a branch target address, determining whether the branch wrong guess instruction was predicted by a branch prediction mechanism, sending the branch wrong guess instruction to an execution unit responsive to determining that the branch wrong guess instruction was predicted by the branch prediction mechanism, and receiving and decoding instructions at the branch target address.

4. 发明申请

US20100287358A1 Branch Prediction Path Instruction 审中-公开
标题翻译：分支预测路径指令
公开(公告)号：US20100287358A1
公开(公告)日：2010-11-11
申请号：US12435631
申请日：2009-05-05
申请人： Philip G. Emma , Allan M. Hartstein , Keith N. Langston , Brian R. Prasky , Thomas R. Puzak , Charles F. Webb
发明人： Philip G. Emma , Allan M. Hartstein , Keith N. Langston , Brian R. Prasky , Thomas R. Puzak , Charles F. Webb
IPC分类号： G06F9/38 , G06F9/30
CPC分类号： G06F9/30047 , G06F8/4442 , G06F9/3005 , G06F9/30054 , G06F9/30058 , G06F9/30076 , G06F9/3802 , G06F9/3804 , G06F9/3806 , G06F9/383 , G06F9/3842 , G06F9/3844 , G06F9/3846 , G06F9/3848 , G06F12/0862 , G06F2212/6028
摘要： A method for branch prediction, the method comprising, receiving a branch wrong guess instruction having a branch wrong guess instruction address and data including an opcode and a branch target address, determining whether the branch wrong guess instruction was predicted by a branch prediction mechanism, sending the branch wrong guess instruction to an execution unit responsive to determining that the branch wrong guess instruction was predicted by the branch prediction mechanism, and receiving and decoding instructions at the branch target address.
摘要翻译：一种分支预测方法，所述方法包括：接收具有分支错误猜测指令地址的分支错误猜测指令和包括操作码和分支目标地址的数据，确定分支错误猜测指令是否由分支预测机制预测，发送分支对执行单元的错误猜测指令响应于确定分支错误猜测指令由分支预测机制预测，以及在分支目标地址处的接收和解码指令。

5. 发明授权

US4672423A Voltage controlled resonant transmission semiconductor device 失效
标题翻译：压控谐振传输半导体器件
公开(公告)号：US4672423A
公开(公告)日：1987-06-09
申请号：US801497
申请日：1985-11-22
申请人： Alan B. Fowler , Allan M. Hartstein
发明人： Alan B. Fowler , Allan M. Hartstein
IPC分类号： H01L29/66 , H01L29/78
CPC分类号： B82Y10/00 , H01L29/66977
摘要： In a transistor structure a buried gate positioned in the layer above a conduction channel and below a broad gate which overlaps the source and drain, when the voltages applied to the buried gate and the overlapping gate are varied independently, a potential well between two barriers can be established which permits conduction by the physical mechanism of resonant transmission. The potential well between two barriers required for the resonant transmission mechanism is achieved in one structure by a buried gate under an overlapping gate with both width and separation dimension control and in a second structure using split-buried gate under an overlapping gate that is embossed in the region of the split gate. With gate and separation dimensions of the order of 1000 .ANG. switching speeds of the order of 10.sup.-12 seconds are achieved.
摘要翻译：在晶体管结构中，当施加到掩埋栅极和重叠栅极的电压独立地变化时，位于导电沟道上方并且在与栅极和漏极重叠的宽栅极之下的层中的掩埋栅极，两个势垒之间的势阱可以可以通过谐振传输的物理机制进行导通。谐振传输机构所需的两个障碍之间的潜在井在一个结构中通过在具有宽度和间隔尺寸控制的重叠栅极下的掩埋栅极实现，并且在第二结构中使用在重叠栅极下方的分裂掩埋栅极被压印分裂门的区域。具有门极和分离尺寸为1000安培开关速度的量级为10-12秒。

6. 发明授权

US4229732A Micromechanical display logic and array 失效
标题翻译：微机械显示逻辑和阵列
公开(公告)号：US4229732A
公开(公告)日：1980-10-21
申请号：US968054
申请日：1978-12-11
申请人： Allan M. Hartstein , Kurt E. Petersen
发明人： Allan M. Hartstein , Kurt E. Petersen
IPC分类号： H04N5/74 , G02B27/50 , G02F1/19 , G09F9/37 , H01H59/00 , G08B5/24
CPC分类号： G02B26/0833 , G09F9/372 , H01H59/0009 , Y10T29/49002
摘要： A display device, addressing circuitry, and semiconductor control logic are all portions of an integrated structure formed by thin film technology on a single silicon wafer. The display comprises a thin film micromechanical electrostatic form of light reflective display formed by depositing thin films upon a silicon wafer and selectively etching to form metal-amorphous oxide micromechanical leaves deflected by applying potential thereto to provide electrostatic deflection. MOSFET devices are also formed upon the silicon wafer in juxtaposition with a plurality of micromechanical display elements. Addressing circuitry is connected to the MOSFET devices.
摘要翻译：显示装置，寻址电路和半导体控制逻辑都是在单个硅晶片上由薄膜技术形成的集成结构的部分。显示器包括薄膜微机械静电形式的光反射显示器，其通过在硅晶片上沉积薄膜并选择性地蚀刻以形成通过施加电位而偏转以提供静电偏转的金属非晶氧化物微机械叶片。 MOSFET器件也与多个微机械显示元件并置在硅晶片上。寻址电路连接到MOSFET器件。

7. 发明申请

US20130283009A1 3-D STACKED MULTIPROCESSOR STRUCTURES AND METHODS FOR MULTIMODAL OPERATION OF SAME 有权
公开(公告)号：US20130283009A1
公开(公告)日：2013-10-24
申请号：US13452113
申请日：2012-04-20
申请人： Alper Buyuktosunoglu , Philip G. Emma , Allan M. Hartstein , Michael B. Healy , Krishnan Kunjunny Kailas
发明人： Alper Buyuktosunoglu , Philip G. Emma , Allan M. Hartstein , Michael B. Healy , Krishnan Kunjunny Kailas
IPC分类号： G06F9/02
CPC分类号： G06F15/17387 , G06F9/3802
摘要： Three-dimensional (3-D) processor devices are provided, which are constructed by connecting processors in a stacked configuration. For instance, a processor system includes a first processor chip comprising a first processor and a second processor chip comprising a second processor. The first and second processor chips are connected in a stacked configuration with the first and second processors connected through vertical connections between the first and second processor chips. The processor system further includes a mode control circuit to selectively operate the processor system in one of a plurality of operating modes. For example, in a one mode of operation, the first and second processors are configured to implement a run-ahead function, wherein the first processor operates a primary thread of execution and the second processor operates a run-ahead thread of execution.

8. 发明申请

US20090313462A1 METHODS INVOLVING BRANCH PREDICTION 有权
标题翻译：涉及分支预测的方法
公开(公告)号：US20090313462A1
公开(公告)日：2009-12-17
申请号：US12138789
申请日：2008-06-13
申请人： Philip G. Emma , Allan M. Hartstein , Keith N. Langston , Brian R. Prasky , Thomas R. Puzak , Charles F. Webb
发明人： Philip G. Emma , Allan M. Hartstein , Keith N. Langston , Brian R. Prasky , Thomas R. Puzak , Charles F. Webb
IPC分类号： G06F9/38
CPC分类号： G06F9/3844 , G06F9/3005 , G06F9/30076 , G06F9/3806
摘要： A method for branch prediction, the method comprising, receiving a load instruction including a first data location in a first memory area, retrieving data including a branch address and a target address from the first data location data location, and saving the data in a branch prediction memory.
摘要翻译：一种用于分支预测的方法，所述方法包括：从第一数据位置数据位置接收包括第一数据位置的加载指令，从第一数据位置数据位置检索包括分支地址和目标地址的数据，并将数据保存在分支预测记忆

9. 发明授权

US07493480B2 Method and apparatus for prefetching branch history information 失效
标题翻译：用于预取分支历史信息的方法和装置
公开(公告)号：US07493480B2
公开(公告)日：2009-02-17
申请号：US10197714
申请日：2002-07-18
申请人： Philip G. Emma , Klaus J. Getzlaff , Allan M. Hartstein , Thomas Pflueger , Thomas R. Puzak , Eric Mark Schwarz , Vijayalakshmi Srinivasan
发明人： Philip G. Emma , Klaus J. Getzlaff , Allan M. Hartstein , Thomas Pflueger , Thomas R. Puzak , Eric Mark Schwarz , Vijayalakshmi Srinivasan
IPC分类号： G06F9/00
CPC分类号： G06F9/3806
摘要： A two level branch history table (TLBHT) is substantially improved by providing a mechanism to prefetch entries from the very large second level branch history table (L2 BHT) into the active (very fast) first level branch history table (L1 BHT) before the processor uses them in the branch prediction process and at the same time prefetch cache misses into the instruction cache. The mechanism prefetches entries from the very large L2 BHT into the very fast L1 BHT before the processor uses them in the branch prediction process. A TLBHT is successful because it can prefetch branch entries into the L1 BHT sufficiently ahead of the time the entry is needed. This feature of the TLBHT is also used to prefetch instructions into the cache ahead of their use. In fact, the timeliness of the prefetches produced by the TLBHT can be used to remove most of the cycle time penalty incurred by cache misses.
摘要翻译：通过提供一种将超大型第二级分支历史表（L2 BHT）中的条目预取到活动（非常快）的第一级分支历史表（L1 BHT）中的条目之前，两级分支历史表（TLBHT）被大大改善处理器在分支预测过程中使用它们，并且同时将高速缓存未命中预取到指令高速缓存中。在处理器在分支预测过程中使用它们之前，该机制将从非常大的L2 BHT中将条目预取到非常快的L1 BHT中。 TLBHT是成功的，因为它可以在需要输入的时间之前将分支条目预取到L1 BHT中。 TLBHT的这个功能也用于在使用之前将指令预取到高速缓存中。实际上，由TLBHT产生的预取的及时性可以用来消除高速缓存未命中引起的大部分周期时间损失。

10. 发明授权

US08799710B2 3-D stacked multiprocessor structures and methods to enable reliable operation of processors at speeds above specified limits 有权
公开(公告)号：US08799710B2
公开(公告)日：2014-08-05
申请号：US13535676
申请日：2012-06-28
申请人： Alper Buyuktosunoglu , Philip G. Emma , Allan M. Hartstein , Michael B. Healy , Krishnan K. Kailas
发明人： Alper Buyuktosunoglu , Philip G. Emma , Allan M. Hartstein , Michael B. Healy , Krishnan K. Kailas
IPC分类号： G06F11/00
CPC分类号： G06F15/7832 , G06F1/324 , G06F1/3287 , G06F1/329 , Y02D10/126 , Y02D10/171 , Y02D10/24
摘要： A three-dimensional (3-D) processor system includes a first processor chip and a second processor chip in a stacked configuration. The first processor chip includes a first processor having a first set of state registers. The second processor chip includes a second processor having a second set of state registers that corresponds to the first set of state registers. The first and second processors are connected through vertical connections between the first and second processor chips. A mode control circuit operates the processor system in one of a plurality of operating modes. In one mode of operation, the first processor is active and the second processor is inactive, and the first processor operates at a speed greater than a maximum safe speed of the first processor, and the first processor uses the second set of state registers of the second processor to checkpoint a state of the first processor.

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