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1. 发明申请

US20070184580A1 Method of making a small substrate compatible for processing 审中-公开
标题翻译：制造小基板兼容加工的方法
公开(公告)号：US20070184580A1
公开(公告)日：2007-08-09
申请号：US10597994
申请日：2005-02-02
申请人： Johan Klootwijk , Cornelis Timmering , Jacob Snijder , Ronald Dekker , Theodorus Michelsen
发明人： Johan Klootwijk , Cornelis Timmering , Jacob Snijder , Ronald Dekker , Theodorus Michelsen
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L2221/68313
摘要： A method of making a comparatively small substrate (12) compatible with manufacturing equipment for a larger-size standard substrate is disclosed. The standard substrate (1) has a surface (10) in which a depression (8) is formed, in which depression the small substrate is connected by means of a layer of a bonding material (13). The depression is formed so as to have a flat bottom (9) extending parallel to the surface. The depression has a depth such that, after the small substrate has been connected with its rear side to the bottom of the depression of the standard substrate by means of the layer of bonding material, the front side (14) of the small substrate forms a free surface which practically coincides with the surface (10) of the carrier wafer. When the standard substrate with the small substrate positioned in the depression is placed into a lithographic stepper, the free surface of the small substrate is placed automatically in a position such that patterns having very small dimensions can be projected onto a photoresist layer formed on said free surface.
摘要翻译：公开了一种制造与较大尺寸标准基板的制造设备兼容的较小基板（12）的方法。标准基板（1）具有其中形成有凹部（8）的表面（10），其中小基板通过粘合材料层（13）连接。凹陷形成为具有平行于表面延伸的平坦的底部（9）。凹陷具有这样的深度，使得在通过粘合材料层将小基板与其后侧连接到标准基板的凹陷的底部之后，小基板的正面（14）形成实际上与载体晶片的表面（10）重合的自由表面。当将具有位于凹陷中的小衬底的标准衬底放置在光刻步进器中时，小衬底的自由表面被自动放置在使得具有非常小的尺寸的图案能够投影到形成在所述自由表面。

2. 发明申请

US20130149215A1 SYSTEM-IN-PACKAGE PLATFORM FOR ELECTRONIC-MICROFLUIDIC DEVICES 有权
标题翻译：用于电子微流体装置的系统级封装平台
公开(公告)号：US20130149215A1
公开(公告)日：2013-06-13
申请号：US13755293
申请日：2013-01-31
申请人： Ronald Dekker , Remco Henricus Wilhelmus Pijnenburg , Nicolaas Johannes Anthonius Van Veen
发明人： Ronald Dekker , Remco Henricus Wilhelmus Pijnenburg , Nicolaas Johannes Anthonius Van Veen
IPC分类号： H01L37/00 , B01L3/00
CPC分类号： H01L37/00 , B01J2219/00783 , B01J2219/0095 , B01L3/502707 , B01L3/502715 , B01L2200/12 , B01L2200/14 , B01L2300/0645 , B01L2300/1827 , B01L2300/1883 , B01L2400/0415 , B81B2201/058 , B81C1/0023 , H01L2224/11 , Y10T436/11
摘要： The present invention relates to an integrated electronic-microfluidic device an integrated electronic-microfluidic device, comprising a semiconductor substrate (106) on a first (122) support, an electronic circuit (102, 104) on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. The signal interface structure is arranged on the first semiconductor-substrate side and configured to receive electrical signals from the electronic circuit. A microfluidic structure (126) is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away form the first support. The electronic-microfluidic device forms a flexible platform for the formation of various System-in-Package applications. It achieves a clear separation between electrical and wet-chemical interfaces. The claimed method for fabricating the device of the invention also allows a simple formation of thermally isolated microfluidic structures.
摘要翻译：本发明涉及一种集成电子微流体装置，集成的电子微流体装置，其包括在第一（122）支撑件上的半导体衬底（106），电子电路（102,104）的第一半导体衬底半导体衬底和与外部设备的信号接口结构。信号接口结构布置在第一半导体衬底侧并被配置为从电子电路接收电信号。微流体结构（126）形成在半导体衬底中，并且被配置为限制流体并允许仅在与第一半导体衬底相反的第二半导体衬底侧上流体流过微流体结构，衬底侧面和背面形成第一支撑件。电子微流体装置形成用于形成各种系统级封装应用的灵活平台。它实现了电气和湿化学界面之间的清晰分离。所要求的制造本发明装置的方法还允许简单地形成热分离的微流体结构。

3. 发明申请

US20120116209A1 HIGH MAGNETIC FIELD COMPATIBLE INTERVENTIONAL NEEDLE AND INTEGRATED NEEDLE TRACKING SYSTEM 有权
标题翻译：高磁场兼容传统针和集成针脚追踪系统
公开(公告)号：US20120116209A1
公开(公告)日：2012-05-10
申请号：US13265387
申请日：2010-04-13
申请人： Mareike Klee , Axel Winkel , John Brean Mills , Ronald Dekker , Bernardus Hendrikus Wilhelmus Hendriks
发明人： Mareike Klee , Axel Winkel , John Brean Mills , Ronald Dekker , Bernardus Hendrikus Wilhelmus Hendriks
IPC分类号： A61B5/055 , H01L21/822 , H01F41/00
CPC分类号： G01R33/287 , G01R33/34007 , G01R33/34084 , Y10T29/4902
摘要： An elongate device (e.g. a catheter) for interventional MRI has one or more passive LC-circuits (wireless markers) attached to its distal tip portion for position tracking. The LC-circuits comprise an inductor winding (480) and a three-dimensional “trench” capacitor (420-440) and are integrated in a piece of silicon (410). Optical fibres may be included in the device for optical probing of tissue surrounding the distal tip portion.
摘要翻译：用于介入MRI的细长装置（例如，导管）具有附接到其远侧末端部分的位置跟踪的一个或多个无源LC电路（无线标记）。 LC电路包括电感器绕组（480）和三维“沟槽”电容器（420-440）并且集成在一块硅片（410）中。光纤可以包括在用于光学探测围绕远端尖端部分的组织的装置中。

4. 发明申请

US20120094323A1 CARDIOMYOCYTES-CONTAINING DEVICE AND METHOD FOR MANUFACTURING AND USING THE SAME 失效
标题翻译：含有血小板活性的装置及其制造和使用方法
公开(公告)号：US20120094323A1
公开(公告)日：2012-04-19
申请号：US13147607
申请日：2010-02-02
申请人： Ronald Dekker , Anja Van De Stolpe
发明人： Ronald Dekker , Anja Van De Stolpe
IPC分类号： C12Q1/18 , H01B13/00 , B05D5/00 , C12M1/34 , B05D1/36
CPC分类号： G01N1/30 , C12N5/0657 , C12N2503/02 , C12N2535/10 , G01N33/5061
摘要： Disclosed is a device for determining the cardiotoxicity of a chemical compound, comprising a substrate (10) carrying a deformable stack (34), said stack being partially detached from the substrate by a cavity (32) allowing an out-of-plane deformation of the stack, said stack comprising a first deformable layer (16), a second deformable layer (20) and a multi-electrode structure (18) sandwiched between the first and second deformable layers, the second deformable layer carrying a pattern of cardiomyocytes (28) adhered thereto; and a liquid container (26) mounted on the substrate for exposing the cardiomyocytes to the chemical compound. A method of manufacturing such a device is also disclosed. The present invention further relates to the use of the device for drug target discovery and/or drug development and a method for developing a disease model for a disease that is caused by or modified by stretching of cells, in particular a cardiac disease model.
摘要翻译：公开了一种用于确定化合物的心脏毒性的装置，包括承载可变形叠层（34）的基底（10），所述叠层通过空腔（32）部分地与基底分离，允许外部变形所述堆叠包括夹在所述第一和第二可变形层之间的第一可变形层（16），第二可变形层（20）和多电极结构（18），所述第二可变形层承载心肌细胞图案（28 ）和安装在基板上的用于将心肌细胞暴露于化合物的液体容器（26）。还公开了制造这种装置的方法。本发明还涉及该装置用于药物靶发现和/或药物开发的用途，以及用于开发由细胞拉伸，特别是心脏疾病模型引起或改变的疾病的疾病模型的方法。

5. 发明授权

US07915707B2 Deformable integrated circuit device 有权
标题翻译：可变形集成电路器件
公开(公告)号：US07915707B2
公开(公告)日：2011-03-29
申请号：US12377673
申请日：2007-08-07
申请人： Ronald Dekker , Antoon Marie Henrie Tombeur , Theodoros Zoumpoulidis
发明人： Ronald Dekker , Antoon Marie Henrie Tombeur , Theodoros Zoumpoulidis
IPC分类号： H01L29/00
CPC分类号： H01L23/49833 , H01L23/5387 , H01L2924/0002 , H01L2924/00
摘要： An integrated-circuit device includes a rigid substrate island having a main substrate surface with a circuit region circuit elements and at least one fold structure. The fold structure is attached to the substrate island and is unfoldable from a relaxed, folded state to a strained unfolded state. The fold structure contains at least one passive electrical component. The fold structure further has in its folded state at least one surface with an area vector that includes a non-vanishing area-vector component in a direction parallel to the main substrate surface, which area-vector component is diminished or vanishes when deforming the fold structure from the folded into the unfolded state.
摘要翻译：集成电路器件包括具有主衬底表面的刚性衬底岛，其具有电路区域电路元件和至少一个折叠结构。折叠结构附接到基底岛，并且可以从松弛的折叠状态展开到应变展开状态。折叠结构包含至少一个无源电组件。折叠结构在其折叠状态下进一步具有面向向的至少一个表面，该区域向量在平行于主衬底表面的方向上包括非消失的面积 - 矢量分量，该区域 - 矢量分量在折叠变形时减少或消失结构从折叠到展开状态。

6. 发明授权

US07893632B2 LED luminaire with optical feedback by image mapping on segmented light sensors 有权
标题翻译：具有光分路光传感器图像映射的光学反馈的LED灯具
公开(公告)号：US07893632B2
公开(公告)日：2011-02-22
申请号：US11719298
申请日：2005-11-15
申请人： Eduard Johannes Meijer , Ronald Dekker , Eugene Timmering , Christoph Gerard August Hoelen , Johannes Petrus Maria Ansems
发明人： Eduard Johannes Meijer , Ronald Dekker , Eugene Timmering , Christoph Gerard August Hoelen , Johannes Petrus Maria Ansems
IPC分类号： H05B37/00 , F21V5/00 , F21V5/04
CPC分类号： F21V23/0442 , F21S10/02 , F21V23/0457 , F21Y2115/10 , G01J1/04 , G01J1/0411 , G01J1/0414 , G01J1/32 , G02B19/0028 , G02B19/0066 , G02B19/0085 , H01L25/167 , H01L2924/0002 , H05B33/0869 , H05B37/029 , H01L2924/00
摘要： The present invention relates to a luminaire comprising an array of LEDs emitting light of at least one color, and a control system for controlling the light output of the luminaire. The control system comprises photosensor array for detecting light output of the luminaire. An imaging unit is arranged in front of the photosensor array such that it maps an image of said array of LEDs on said photosensor array. The photosensor array is divided into subareas each detecting light output from a single one of the LEDs. The control system uses the output of the subareas for controlling the luminaire light output. Thus, it is possible to act on different LED light colors or the light output of individual LEDs without having to separate them in time by means of a time pulsing method.
摘要翻译：本发明涉及一种包括发射至少一种颜色的光的LED阵列的照明器和用于控制照明器的光输出的控制系统。控制系统包括用于检测照明器的光输出的光电传感器阵列。成像单元布置在光电传感器阵列的前面，使得它将所述LED阵列的图像映射在所述光传感器阵列上。光传感器阵列被分成每个检测来自单个LED的光输出的子区域。控制系统使用子区域的输出来控制照明器光输出。因此，可以通过时间脉冲方式对不同的LED光颜色或各个LED的光输出作用，而不必在时间上分离它们。

7. 发明授权

US07891836B2 Semiconductor light-emitting device with improved heatsinking 有权
标题翻译：具有改善散热效果的半导体发光器件
公开(公告)号：US07891836B2
公开(公告)日：2011-02-22
申请号：US11577367
申请日：2005-10-17
申请人： Ronald Dekker , Eduard Johannes Meijer , Eugene Timmering , Marc Andre De Samber
发明人： Ronald Dekker , Eduard Johannes Meijer , Eugene Timmering , Marc Andre De Samber
IPC分类号： F21V4/00
CPC分类号： H01L33/647 , H01L33/62 , H01L33/642 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： The present invention relates to a light-emitting device comprising a substrate, a circuitry, a LED in electrical connection with said circuitry, and a heat sink arranged to transport heat away from the LED, wherein the LED is in thermal contact with said heat sink through an opening in said substrate. The present invention also relates to methods for the manufacture of such a device.
摘要翻译：本发明涉及一种发光装置，其包括基板，电路，与所述电路电连接的LED，以及布置成将热量从LED传送的散热器，其中所述LED与所述散热片热接触通过所述衬底中的开口。本发明还涉及制造这种装置的方法。

8. 发明申请

US20100270640A1 DEFORMABLE INTEGRATED CIRCUIT DEVICE 有权
标题翻译：可变电容集成电路
公开(公告)号：US20100270640A1
公开(公告)日：2010-10-28
申请号：US12377673
申请日：2007-08-07
申请人： Ronald Dekker , Antoon Marie Henrie Tombeur , Theodoros Zoumpoulidis
发明人： Ronald Dekker , Antoon Marie Henrie Tombeur , Theodoros Zoumpoulidis
IPC分类号： H01L23/52 , H01L21/98
CPC分类号： H01L23/49833 , H01L23/5387 , H01L2924/0002 , H01L2924/00
摘要： An integrated-circuit device is provided, which comprises a rigid substrate island having a main substrate surface with a circuit region circuit elements and at least one fold structure. The fold structure is attached to the substrate island and is unfoldable from a relaxed, folded state to a strained unfolded state. The fold structure contains at least one passive electrical component. The fold structure further has in its folded state at least one surface with an area vector that includes a non-vanishing area-vector component in a direction parallel to the main substrate surface, which area-vector component is diminished or vanishes when deforming the fold structure from the folded into the unfolded state. The fold structure provided by the present invention allows fabricating the integrated-circuit device with small lateral extensions and thus takes up a particularly small amount of chip area, which reduces the cost per device.
摘要翻译：提供了一种集成电路器件，其包括具有主衬底表面的刚性衬底岛，其具有电路区域电路元件和至少一个折叠结构。折叠结构附接到基底岛，并且可以从松弛的折叠状态展开到应变展开状态。折叠结构包含至少一个无源电组件。折叠结构在其折叠状态下进一步具有面向向的至少一个表面，该区域向量在平行于主衬底表面的方向上包括非消失的面积 - 矢量分量，该区域 - 矢量分量在折叠变形时减少或消失结构从折叠到展开状态。由本发明提供的折叠结构允许制造具有小横向延伸的集成电路器件，因此占据特别小量的芯片面积，这降低了每个器件的成本。

9. 发明申请

US20100045440A1 IMPLANTABLE DEVICE WITH REMOTE READOUT 审中-公开
标题翻译：具有远程读取功能的可移植设备
公开(公告)号：US20100045440A1
公开(公告)日：2010-02-25
申请号：US12447678
申请日：2007-10-31
申请人： Remco Henricus Wilhelmus Pijnenburg , Youri Victorovitch Ponomarev , Matthias Merz , Ronald Dekker
发明人： Remco Henricus Wilhelmus Pijnenburg , Youri Victorovitch Ponomarev , Matthias Merz , Ronald Dekker
IPC分类号： H04Q5/22
CPC分类号： G06K19/0723 , G06K7/0008
摘要： The invention relates to a remotely readable electronic device (10), particularly an implantable device, with an O associated reader (20). The device comprises a resonance circuit (12) that can selectively be set into one of at least three different resonance states, wherein this state can wirelessly be sensed by the remote reader. In a particular embodiment, the resonance circuit (12) comprises two capacitors (C1, C2) that can selectively be connected or disconnected to the resonance circuit (12). The reader (20) preferably scans a given frequency range to detect spectral absorption patterns that correspond to certain resonance states of the resonance circuit (12).
摘要翻译：本发明涉及一种具有O相关阅读器（20）的远程可读电子设备（10），特别是可植入设备。该装置包括可选择性地设置为至少三种不同共振状态中的一种的谐振电路（12），其中该状态可以由远程读取器无线地感测。在一个具体实施例中，谐振电路（12）包括两个电容器（C1，C2），可以选择性地连接或断开到谐振电路（12）。读取器（20）优选地扫描给定的频率范围以检测对应于谐振电路（12）的某些谐振状态的光谱吸收模式。

10. 发明申请

US20080150118A1 Method of Manufacturing a Semiconductor Packages and Packages Made 审中-公开
标题翻译：制造半导体封装和封装的方法
公开(公告)号：US20080150118A1
公开(公告)日：2008-06-26
申请号：US11816750
申请日：2006-02-27
申请人： Nicolaas Johannes Anthonius Van Veen , Ronald Dekker , Coen C. Tak
发明人： Nicolaas Johannes Anthonius Van Veen , Ronald Dekker , Coen C. Tak
IPC分类号： H01L23/52 , H01L23/48 , H01L21/02
CPC分类号： H01L23/5389 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2221/68331 , H01L2221/68345 , H01L2221/68368 , H01L2223/6677 , H01L2224/24226 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19042 , H01L2224/82 , H01L2924/00
摘要： The flexible package (100) has between a first (1) and a second side (2) a semiconductor device (20) with a thinned back substrate (10) and an interconnect structure. Contact means (31,33) for external contact and a first resin layer (52) are present at the first side (2) of the package (100), which contact means (31,33) are coupled to the interconnect structure. At the second side (2) the semiconductor device (20) is at least substantially covered with a second resin layer (12). The contact means (31,33) are present on the first resin layer (52) and are coupled to the interconnect structure with redistribution tracks (32,34) extending through the first resin layer (52). A passivation layer (55) covers the first resin layer (52) and the redistribution tracks (32,34) at least substantially.
摘要翻译：柔性封装（100）在第一（1）和第二侧（2）之间具有带有薄的背衬基板（10）和互连结构的半导体器件（20）。用于外部接触的接触装置（31,33）和第一树脂层（52）存在于封装（100）的第一侧（2）处，该接触装置（31,33）联接到互连结构。在第二侧（2），半导体器件（20）至少基本被第二树脂层（12）覆盖。接触装置（31,33）存在于第一树脂层（52）上，并且通过延伸穿过第一树脂层（52）的再分布轨道（32,34）与互连结构耦合。钝化层（55）至少基本上覆盖第一树脂层（52）和再分布轨道（32,34）。

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