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    • 3. 发明授权
    • Semiconductor device having a byte-erasable EEPROM memory
    • 具有字节可擦除EEPROM存储器的半导体器件
    • US07006381B2
    • 2006-02-28
    • US10497262
    • 2002-10-24
    • Guido Jozef Maria DormansRobertus Dominicus Joseph VerhaarJoachim Christoph Hans Garbe
    • Guido Jozef Maria DormansRobertus Dominicus Joseph VerhaarJoachim Christoph Hans Garbe
    • G11C11/34
    • H01L27/115G11C16/0433G11C16/16
    • The invention relates to a semiconductor device having a byte-erasable EEPROM memory comprising a matrix of rows and columns of memory cells. In order to provide a semiconductor device having a byte-erasable EEPROM which has a reduced chip size and increased density and which is suitable for low-power applications it is proposed according to the present invention that the memory cells each comprise a selection transistor having a selection gate and, arranged in series therewith, a memory transistor having a floating gate and a control gate, the selection transistor being further connected to a source line of the byte-erasable EEPROM memory, which source line is common for a plurality of memory cells, and the memory transistor being further connected to a bit line of the byte-erasable EEPROM memory, wherein the columns of memory cells are located in separate p-type wells separated by n-type wells. Preferably, high voltage switching elements are provided for dividing global control gates into local control gates for each column of bytes.
    • 本发明涉及一种具有字节可擦除EEPROM存储器的半导体器件,其包括存储器单元的行和列的矩阵。 为了提供具有字节可擦除EEPROM的半导体器件,其具有减小的芯片尺寸和增加的密度,并且适用于低功率应用,根据本发明提出,存储器单元各自包括选择晶体管,其具有 选择栅极,与串联布置的具有浮置栅极和控制栅极的存储晶体管,所述选择晶体管进一步连接到所述字节可擦除EEPROM存储器的源极线,所述源极线对于多个存储单元是公共的 并且存储晶体管进一步连接到字节可擦除EEPROM存储器的位线,其中存储器单元的列位于由n型阱分离的单独的p型阱中。 优选地,提供高压开关元件,用于将全局控制门分成用于每列字节的本地控制门。
    • 8. 发明授权
    • Multilevel poly-Si tiling for semiconductor circuit manufacture
    • 用于半导体电路制造的多层多晶硅拼接
    • US07148103B2
    • 2006-12-12
    • US10492888
    • 2002-10-16
    • Antonius Maria Petrus Johannes HendriksGuido Jozef Maria DormansRobertus Dominicus Joseph Verhaar
    • Antonius Maria Petrus Johannes HendriksGuido Jozef Maria DormansRobertus Dominicus Joseph Verhaar
    • H01L21/8242
    • H01L27/11526H01L21/32137H01L21/8234H01L27/11531
    • Method of manufacturing a semiconductor device, including a first baseline technology electronic circuit (1) and a second option technology electronic circuit (2) as functional parts of a system-on-chip, by: manufacturing the first electronic circuit (1) with a first conductive layer (6; 6) that is patterned by subjecting an exposed layer portion thereof to Reactive Ion Etching (RIE); manufacturing the second electronic circuit (2) with a second conductive layer (6; 8) that is patterned by subjecting an exposed layer portion thereof to RIE; providing a tile structure (25; 26); providing the tile structure (25; 26) with at least one dummy conductive layer (6; 8) produced in the same processing step as the second conductive layer (6; 8); and exposing the dummy conductive layer (6; 8), at least partially, to obtain an exposed dummy layer portion, and RIE-etching of that exposed portion too when the second (6; 8) conductive layer is subjected to RIE.
    • 一种制造半导体器件的方法,包括第一基线技术电子电路(1)和第二选择技术电子电路(2)作为片上系统的功能部件,通过以下步骤:制造第一电子电路(1) 通过使其暴露的层部分经受反应离子蚀刻(RIE)而被图案化的第一导电层(6; 6); 用第二导电层(6; 8)制造所述第二电子电路(2),所述第二导电层通过使其暴露的层部分经受RIE而被图案化; 提供瓷砖结构(25; 26); 在与第二导电层(6; 8)相同的处理步骤中制造的至少一个虚设导电层(6; 8)提供瓦片结构(25; 26); 并且至少部分地暴露所述虚设导电层(6; 8),以获得暴露的虚设层部分,以及当所述第二(6; 8)导电层经受RIE时也暴露部分的RIE蚀刻。
    • 9. 发明授权
    • Non-volatile memory cells, high voltage transistors and logic transistors integrated on a single chip
    • 集成在单个芯片上的非易失性存储单元,高压晶体管和逻辑晶体管
    • US06815755B2
    • 2004-11-09
    • US10390946
    • 2003-03-18
    • Roy Arthur ColclaserGuido Jozef Maria DormansDonald Robert Wolters
    • Roy Arthur ColclaserGuido Jozef Maria DormansDonald Robert Wolters
    • H01L2976
    • H01L27/11526H01L27/105H01L27/11546
    • Semiconductor device having on a single substrate (1) at least one memory cell (3) and at least one logic transistor (25); the at least one memory cell having a floating gate (5), a tunnel oxide layer (11) between the floating gate and the substrate (1), a control gate (15), and a control oxide layer (13) between the control gate (15) and the floating gate (5); the at least one logic transistor (25) having a logic transistor gate (5′, 15″) and a logic transistor gate oxide (11″) between the logic transistor gate (5′, 15″) and the substrate (1), the tunnel oxide layer (11) of the memory cell (3) and the logic transistor gate oxide (11″) having a same or substantially same predetermined first thickness. The invention also relates to a method of manufacturing such a device and to such a device that also comprises a high voltage transistor (17) which is optionally made so as to be an integral part of at least the memory cell (3).
    • 具有在单个衬底(1)上的至少一个存储器单元(3)和至少一个逻辑晶体管(25)的半导体器件;所述至少一个存储器单元具有浮置栅极(5),隧道氧化物层(11) 所述浮栅和所述衬底(1),所述控制栅极(15)和所述控制栅极(15)和所述浮动栅极(5)之间的控制氧化物层(13);所述至少一个逻辑晶体管(25)具有 在逻辑晶体管栅极(5',15“)和衬底(1)之间的逻辑晶体管栅极(5',15”)和逻辑晶体管栅极氧化物(11“),隧道氧化物层(11) 的存储单元(3)和逻辑晶体管栅极氧化物(11“)具有相同或基本相同的预定第一厚度。 本发明还涉及一种制造这种器件的方法以及这种器件,其还包括高压晶体管(17),其可选地制成为至少是存储器单元(3)的整体部分。