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    • 7. 发明申请
    • Data output circuit of semiconductor memory apparatus
    • 半导体存储装置的数据输出电路
    • US20070147149A1
    • 2007-06-28
    • US11592205
    • 2006-11-03
    • Sang-Sic Yoon
    • Sang-Sic Yoon
    • G11C7/00
    • G11C7/1051G11C7/1069G11C29/1201G11C29/48G11C2207/2227
    • A data output circuit of a semiconductor memory apparatus includes: a control unit that outputs a first standby instruction signal, a second standby instruction signal, a first output instruction signal, and a second output instruction signal in response to an input of a standby instruction signal, an output instruction signal, a first test signal, and a second test signal; a first output driver that causes first data to be output or to enter a standby state according to whether or not the first standby instruction signal or the first output instruction signal is enabled; and a second output driver that causes second data to be output or to enter a standby state according to whether or not the second standby instruction signal or the second output instruction signal is enabled.
    • 半导体存储装置的数据输出电路包括:控制单元,响应于待机指令信号的输入而输出第一待机指令信号,第二待机指令信号,第一输出指令信号和第二输出指令信号 ,输出指令信号,第一测试信号和第二测试信号; 第一输出驱动器,其根据所述第一备用指令信号还是所述第一输出指令信号是否被使能而使得第一数据被输出或进入待机状态; 以及第二输出驱动器,其根据第二待机指令信号还是第二输出指令信号被使能而使第二数据输出或进入待机状态。
    • 8. 发明授权
    • Semiconductor integrated circuit
    • 半导体集成电路
    • US08570097B2
    • 2013-10-29
    • US13411727
    • 2012-03-05
    • Sang-Sic Yoon
    • Sang-Sic Yoon
    • G05F1/10
    • G05F1/56G11C5/147
    • A semiconductor integrated circuit includes a first pad configured to receive a first voltage, a second pad configured to receive a second voltage, an internal voltage generation circuit configured to generate a third voltage having the same voltage level as the first voltage in response to the second voltage during a test mode, and an internal circuit configured to perform a normal operation using the first voltage and the second voltage during a normal mode and perform a test operation using the second voltage and the third voltage during the test mode.
    • 半导体集成电路包括:被配置为接收第一电压的第一焊盘,被配置为接收第二电压的第二焊盘;内部电压产生电路,被配置为响应于所述第二电压产生具有与所述第一电压相同的电压电平的第三电压 测试模式期间的电压以及在正常模式期间使用第一电压和第二电压进行正常操作的内部电路,并且在测试模式期间使用第二电压和第三电压进行测试操作。
    • 9. 发明授权
    • Delay locked loop and integrated circuit including the same
    • 延迟锁定环和集成电路包括相同
    • US08258840B2
    • 2012-09-04
    • US12980880
    • 2010-12-29
    • Sang-Sic Yoon
    • Sang-Sic Yoon
    • H03L7/06
    • H03L7/0814
    • A delay locked loop includes a first delay unit configured to output an output clock by delaying an input clock by a delay; a replica delay unit configured to output a feedback clock by delaying the output clock with a delay equal to a sum of a first delay amount for a first operational frequency of the delayed locked loop and an additional delay amount for a second operational frequency of the delayed locked loop, wherein the second operational frequency is lower than the first operational frequency; and a delay amount control unit configured to control the delay of the first delay unit by comparing a phase of the input clock with a phase of the feedback clock.
    • 延迟锁定环包括第一延迟单元,其被配置为通过延迟输入时钟来输出输出时钟; 复制延迟单元,被配置为通过延迟等于延迟锁定环路的第一操作频率的第一延迟量和延迟锁定环路的第一操作频率的附加延迟量的延迟来延迟输出时钟来输出反馈时钟, 锁定环,其中所述第二操作频率低于所述第一操作频率; 以及延迟量控制单元,被配置为通过将输入时钟的相位与反馈时钟的相位进行比较来控制第一延迟单元的延迟。
    • 10. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07940576B2
    • 2011-05-10
    • US12323687
    • 2008-11-26
    • Bo-Kyeom KimSang-Sic Yoon
    • Bo-Kyeom KimSang-Sic Yoon
    • G11C7/10
    • G11C7/1078G11C7/1039G11C7/1084G11C7/1096G11C8/06G11C8/12G11C11/408G11C11/4093G11C11/4096
    • There is provided a semiconductor memory device, including: a plurality of bank groups each comprising a plurality of banks; a plurality of data pads grouped by a predetermined number for receiving data for the bank groups, wherein the data pads are divided into a plurality of first pad groups receiving data and a plurality of second pad groups selectively receiving data according to a data input/output option value; a first driving unit configured to drive data input via the first pad group to transfer the data input via the first pad group to the bank group corresponding to the first pad group; a second driving unit configured to drive data input via the second pad group to transfer the data input via the second pad group to the bank group corresponding to the second pad group; and a third driving unit configured to drive data input via the first pad group to transfer the data input via the first pad group to the bank group corresponding to the second pad group in response to the data input/output option value.
    • 提供了一种半导体存储器件,包括:多个银行组,每个组包括多个存储体; 多个用于接收银行组的数据的预定数量的数据焊盘,其中数据焊盘被分成多个接收数据的第一焊盘组和根据数据输入/输出有选择地接收数据的多个第二焊盘组 期权价值 第一驱动单元,被配置为驱动经由所述第一焊盘组输入的数据,以将经由所述第一焊盘组输入的数据传送到对应于所述第一焊盘组的所述存储体组; 第二驱动单元,被配置为驱动经由所述第二焊盘组输入的数据,以将经由所述第二焊盘组输入的数据传送到对应于所述第二焊盘组的所述存储体组; 以及第三驱动单元,被配置为响应于所述数据输入/输出选项值,经由所述第一焊盘组驱动经由所述第一焊盘组输入的数据到与所述第二焊盘组对应的所述存储体组。