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    • 1. 发明授权
    • System and method for direct etching
    • 用于直接蚀刻的系统和方法
    • US07534711B2
    • 2009-05-19
    • US11615972
    • 2006-12-23
    • Jingang WuFei LuoGuanqie GaoCheng Yang
    • Jingang WuFei LuoGuanqie GaoCheng Yang
    • H01L21/20
    • H01L21/76802
    • System and method for direct etching. According to an embodiment, the present invention provides a method for manufacturing an integrated circuit device. The method includes a step for providing a substrate having a contact region, which is provided between a first word line and a second word line. The contact region has an overlying plug structure, which is provided within a thickness of a first dielectric layer. The first dielectric layer includes a portion overlying the plug structure. The first dielectric layer has a planarized surface region. The method also includes a step for forming a first line and a second line and a space provided between the first word line and the second world line. The space is provided within a region overlying the plug structure.
    • 用于直接蚀刻的系统和方法 根据实施例,本发明提供一种用于制造集成电路器件的方法。 该方法包括提供具有接触区域的基板的步骤,该接触区域设置在第一字线和第二字线之间。 接触区域具有覆盖的塞子结构,其设置在第一介电层的厚度内。 第一电介质层包括覆盖插塞结构的部分。 第一电介质层具有平坦化的表面区域。 该方法还包括用于形成第一线和第二线以及设置在第一字线和第二世界线之间的空间的步骤。 该空间设置在覆盖插头结构的区域内。
    • 2. 发明申请
    • SYSTEM AND METHOD FOR DIRECT ETCHING
    • 用于直接蚀刻的系统和方法
    • US20080146030A1
    • 2008-06-19
    • US11615972
    • 2006-12-23
    • Jingang WuFei LuoGuanqie GaoCheng Yang
    • Jingang WuFei LuoGuanqie GaoCheng Yang
    • H01L21/44
    • H01L21/76802
    • System and method for direct etching. According to an embodiment, the present invention provides a method for manufacturing an integrated circuit device. The method includes a step for providing a substrate having a contact region, which is provided between a first word line and a second word line. The contact region has an overlying plug structure, which is provided within a thickness of a first dielectric layer. The first dielectric layer includes a portion overlying the plug structure. The first dielectric layer has a planarized surface region. The method also includes a step for forming a first line and a second line and a space provided between the first word line and the second world line. The space is provided within a region overlying the plug structure.
    • 用于直接蚀刻的系统和方法 根据实施例,本发明提供一种用于制造集成电路器件的方法。 该方法包括提供具有接触区域的基板的步骤,该接触区域设置在第一字线和第二字线之间。 接触区域具有覆盖的塞子结构,其设置在第一介电层的厚度内。 第一电介质层包括覆盖插塞结构的部分。 第一电介质层具有平坦化的表面区域。 该方法还包括用于形成第一线和第二线以及设置在第一字线和第二世界线之间的空间的步骤。 该空间设置在覆盖插头结构的区域内。
    • 8. 发明授权
    • Identifying and reporting on frequent sequences of events in usage data
    • 识别和报告使用数据中的频繁事件序列
    • US07051029B1
    • 2006-05-23
    • US09755971
    • 2001-01-05
    • Usama FayyadNeal RothlederCheng Yang
    • Usama FayyadNeal RothlederCheng Yang
    • G06F17/30
    • G06F17/30876Y10S707/99943
    • A method, system, and computer-readable medium for identifying sequences of interaction events of interest that frequently occur is described. In particular, techniques are described for receiving multiple groups each having related interaction events in serial or sequential order, and for determining sequences of interaction events that frequently occur in the multiple groups. Reports can also be generated and provided that include information about the determined frequent sequences. The techniques can at times be used to provide a service to customers in which logs containing data about interaction events related to that customer (e.g., usage events for a provided service or of a provided Website) are received or obtained, in which frequent sequences in the log data are identified, and in which reports are provided to representatives of the customer about the frequent sequences (e.g., remotely over the Web based on interactive specifications).
    • 描述了用于识别经常发生的感兴趣的交互事件序列的方法,系统和计算机可读介质。 具体地,描述了用于接收多个组的技术,每个组具有串行或顺序的相关交互事件,并且用于确定多个组中经常发生的交互事件的序列。 还可以生成报告,并提供包括关于确定的频繁序列的信息。 这些技术有时可用于向客户提供服务,其中包含与该客户相关的交互事件的数据的日志(例如,所提供的服务或所提供的网站的使用事件)被接收或获得,其中频繁的序列 记录日志数据,并且向客户的代表提供有关频繁序列的报告(例如,基于交互式规范的Web远程访问)。