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1. 外观设计

USD605609S1 Light emitting diode 有权
公开(公告)号：USD605609S1
公开(公告)日：2009-12-08
申请号：US29328313
申请日：2008-11-21
申请人： Jin-Won Lee , Kyoung-Il Park , Sun-Hong Kim , Min-Sik Kim , Ji-Na Lee
设计人： Jin-Won Lee , Kyoung-Il Park , Sun-Hong Kim , Min-Sik Kim , Ji-Na Lee

2. 外观设计

USD606032S1 Light emitting diode 有权
公开(公告)号：USD606032S1
公开(公告)日：2009-12-15
申请号：US29328308
申请日：2008-11-21
申请人： Jin-Won Lee , Kyoung-Il Park , Sun-Hong Kim , Min-Sik Kim , Ji-Na Lee
设计人： Jin-Won Lee , Kyoung-Il Park , Sun-Hong Kim , Min-Sik Kim , Ji-Na Lee

3. 发明授权

US08013357B2 Side view light emitting diode package 有权
标题翻译：侧视发光二极管封装
公开(公告)号：US08013357B2
公开(公告)日：2011-09-06
申请号：US12495854
申请日：2009-07-01
申请人： Kyoung-Il Park , Jin-Won Lee , Sun-Hong Kim , Min-Sik Kim , Ji-Na Lee
发明人： Kyoung-Il Park , Jin-Won Lee , Sun-Hong Kim , Min-Sik Kim , Ji-Na Lee
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： H01L33/62 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.
摘要翻译：提供一种侧视发光二极管封装，其包括壳体，该壳体包括前侧部分和与前侧部分一体形成的后侧部分，前侧部分具有发光部分; 以及位于前侧部分和后侧部分之间的引线框架，其中引线框架包括连接到发光二极管（LED）芯片的第一电极的第一引线和连接到第二电极的第二引线所述LED芯片，其中所述前侧部分包括第一凹槽，第二凹槽和第三凹槽，其中所述第一引线和所述第二引线分别延伸穿过所述第一凹槽和所述第二凹槽，并且散热部分从第一引线延伸通过第三凹槽延伸到LED封装的外部。

4. 外观设计

USD605608S1 Light emitting diode 有权
公开(公告)号：USD605608S1
公开(公告)日：2009-12-08
申请号：US29328311
申请日：2008-11-21
申请人： Jin-Won Lee , Kyoung-Il Park , Sun-Hong Kim , Min-Sik Kim , Ji-Na Lee
设计人： Jin-Won Lee , Kyoung-Il Park , Sun-Hong Kim , Min-Sik Kim , Ji-Na Lee

5. 发明授权

US07910948B2 Light emitting diode package 失效
标题翻译：发光二极管封装
公开(公告)号：US07910948B2
公开(公告)日：2011-03-22
申请号：US12483560
申请日：2009-06-12
申请人： Sun-Hong Kim , Jin-Won Lee , Kyoung-Il Park
发明人： Sun-Hong Kim , Jin-Won Lee , Kyoung-Il Park
IPC分类号： H01L23/495
CPC分类号： H01L33/62 , H01L23/49537 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.
摘要翻译：提供了一种发光二极管封装，包括：引线框架，其包括彼此一体形成的电极焊盘和电极引线; 以及壳体，其中所述电极焊盘通过由所述壳体的内壁形成的窗口沿第一方向暴露，并且所述电极引线通过通孔在第二方向上暴露，其中所述壳体包括由沉没房屋内墙。

6. 外观设计

USD599305S1 Light emitting diode 有权
公开(公告)号：USD599305S1
公开(公告)日：2009-09-01
申请号：US29324178
申请日：2008-09-08
申请人： Sun-Hong Kim , Jin-Won Lee , Kyoung-Il Park
设计人： Sun-Hong Kim , Jin-Won Lee , Kyoung-Il Park

7. 外观设计

USD601518S1 Light emitting diode 有权
公开(公告)号：USD601518S1
公开(公告)日：2009-10-06
申请号：US29323341
申请日：2008-08-22
申请人： Jin-Won Lee , Kyoung-Il Park , Sun-Hong Kim
设计人： Jin-Won Lee , Kyoung-Il Park , Sun-Hong Kim

8. 发明申请

US20090189175A1 Side view type light emitting diode package 审中-公开
标题翻译：侧视型发光二极管封装
公开(公告)号：US20090189175A1
公开(公告)日：2009-07-30
申请号：US12078117
申请日：2008-03-27
申请人： Ik-Seong Park , Sun-Hong Kim , Jin-Won Lee , Kyoung-Il Park
发明人： Ik-Seong Park , Sun-Hong Kim , Jin-Won Lee , Kyoung-Il Park
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a side view light emitting diode (LED) package whose light emitting surface has been relatively expanded. The LED package includes a housing and a lead frame extended externally through the housing and bent in a direction of the recessed space. The housing includes a reflecting housing having a cavity and a supporting housing.
摘要翻译：公开了一种其发光表面相对膨胀的侧视发光二极管（LED）封装。 LED封装包括壳体和引线框架，引线框架从外部延伸穿过壳体并在凹陷空间的方向上弯曲。壳体包括具有空腔和支撑壳体的反射壳体。

9. 发明申请

US20090309122A1 LIGHT EMITTING DIODE PACKAGE 失效
标题翻译：发光二极管封装
公开(公告)号：US20090309122A1
公开(公告)日：2009-12-17
申请号：US12483560
申请日：2009-06-12
申请人： Sun-Hong Kim , Jin-Won Lee , Kyoung-Il Park
发明人： Sun-Hong Kim , Jin-Won Lee , Kyoung-Il Park
IPC分类号： H01L23/495
CPC分类号： H01L33/62 , H01L23/49537 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.
摘要翻译：提供了一种发光二极管封装，包括：引线框架，其包括彼此一体形成的电极焊盘和电极引线; 以及壳体，其中所述电极焊盘通过由所述壳体的内壁形成的窗口沿第一方向暴露，并且所述电极引线通过通孔在第二方向上暴露，其中所述壳体包括由沉没房屋内墙。

10. 发明申请

US20090189171A1 Light emitting diode package 审中-公开
标题翻译：发光二极管封装
公开(公告)号：US20090189171A1
公开(公告)日：2009-07-30
申请号：US12078106
申请日：2008-03-27
申请人： Jin-Won Lee , Kyoung-Il Park , Sun-Hong Kim
发明人： Jin-Won Lee , Kyoung-Il Park , Sun-Hong Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/00014 , H01L2924/00
摘要： An LED package includes a housing, a substrate, a pad frame and an LED chip. The housing includes a plastic material, and has a recess with an opening at a top of the housing. The substrate includes substantially the same material with the housing. The pad frame includes conductive material, and is inserted on the substrate, and is fixed between the housing and the substrate. The LED chip is mounted on the pad frame and is disposed at a center of the recess. The housing is protruded and extended to a lower portion of the LED chip. Thicknesses of the housing's sidewalls facing to each other through the recess are substantially the same with each other.
摘要翻译： LED封装包括壳体，衬底，衬垫框架和LED芯片。壳体包括塑料材料，并且具有在壳体的顶部具有开口的凹部。衬底包括与壳体基本相同的材料。垫框架包括导电材料，并且被插入到基板上，并且固定在壳体和基板之间。 LED芯片安装在垫框架上并且设置在凹部的中心。壳体突出并延伸到LED芯片的下部。通过凹槽彼此面对的壳体的侧壁的厚度基本上彼此相同。

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