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    • 10. 发明申请
    • ETSOI CMOS With Back Gates
    • ETSOI CMOS后盖
    • US20130005095A1
    • 2013-01-03
    • US13611656
    • 2012-09-12
    • Jin CaiRobert H. DennardAli Khakifirooz
    • Jin CaiRobert H. DennardAli Khakifirooz
    • H01L21/8238
    • H01L27/1203
    • A method to fabricate a structure includes providing a silicon-on-insulator wafer, implanting through a semiconductor layer and an insulating layer a functional region having a first type of conductivity to be adjacent to a top surface of the substrate; implanting within the functional region through the semiconductor layer and the insulating layer an electrically floating back gate region having a second type of conductivity; forming isolation regions in the semiconductor layer; forming first and second transistor devices to have the same type of conductivity over the semiconductor layer such that one of the transistor devices overlies the implanted back gate region and the other one of the transistor devices overlies only the underlying top surface of the functional region not overlapped by the implanted back gate region; and providing an electrical contact to the functional region for applying a bias voltage.
    • 制造结构的方法包括提供绝缘体上硅晶片,通过半导体层和绝缘层注入具有与衬底顶表面相邻的第一导电类型的功能区域; 在功能区域内通过半导体层和绝缘层注入具有第二类导电性的电浮置背栅区; 在半导体层中形成隔离区; 形成第一和第二晶体管器件以在半导体层上具有相同类型的导电性,使得晶体管器件中的一个覆盖在注入的背栅极区域上,另一个晶体管器件仅覆盖不重叠的功能区域的下面的顶部表面 通过植入的背栅区; 以及向所述功能区域提供电接触以施加偏置电压。