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    • 1. 发明授权
    • Buffer to multiply memory interface
    • 缓冲区来乘以内存接口
    • US06553450B1
    • 2003-04-22
    • US09664985
    • 2000-09-18
    • Jim M. DoddMichael W. WilliamsJohn B. HalbertRandy M. BonellaChung Lam
    • Jim M. DoddMichael W. WilliamsJohn B. HalbertRandy M. BonellaChung Lam
    • G06F1202
    • G06F13/16Y02D10/14
    • Providing electrical isolation between the chipset and the memory data is disclosed. The disclosure includes providing at least one buffer in a memory interface between a chipset and memory modules. Each memory module includes a plurality of memory ranks. The at least one buffer allows the memory interface to be split into first and second sub-interfaces. The first sub-interface is between the chipset and the buffer. The second sub-interface is between the buffer and the memory modules. The method also includes interleaving output of the memory ranks in the memory modules, and configuring the at least one buffer to properly latch data being transferred between the chipset and the memory modules. The first and second sub-interfaces operate independently but in synchronization with each other.
    • 公开了在芯片组和存储器数据之间提供电隔离。 本公开包括在芯片组和存储器模块之间的存储器接口中提供至少一个缓冲器。 每个存储器模块包括多个存储器等级。 至少一个缓冲器允许将存储器接口拆分成第一和第二子接口。 第一个子接口位于芯片组和缓冲区之间。 第二个子接口位于缓冲区和内存模块之间。 该方法还包括交织存储器模块中的存储器级别的输出,以及配置至少一个缓冲器以适当地锁存正在芯片组和存储器模块之间传输的数据。 第一子接口和第二子接口彼此独立地操作,但是彼此同步。
    • 2. 发明授权
    • Buffering and interleaving data transfer between a chipset and memory modules
    • 在芯片组和存储器模块之间缓冲和交织数据传输
    • US07249232B2
    • 2007-07-24
    • US10777921
    • 2004-02-11
    • John B. HalbertJim M. DoddChung LamRandy M. Bonella
    • John B. HalbertJim M. DoddChung LamRandy M. Bonella
    • G06F13/00G06F3/00G06F5/06
    • G06F13/4234
    • Providing electrical isolation between the chipset and the memory data is disclosed. The disclosure includes providing at least one buffer in a memory interface between a chipset and memory modules. Each memory module includes a plurality of memory ranks. The buffers allow the memory interface to be split into first and second sub-interfaces. The first sub-interface is between the chipset and the buffers. The second sub-interface is between the buffers and the memory modules. The method also includes interleaving output of the buffers, and configuring the buffers to properly latch the data being transferred between the chipset and the memory modules. The first and second sub-interfaces operate independently but in synchronization with each other.
    • 公开了在芯片组和存储器数据之间提供电隔离。 本公开包括在芯片组和存储器模块之间的存储器接口中提供至少一个缓冲器。 每个存储器模块包括多个存储器等级。 这些缓冲区允许将存储器接口拆分成第一和第二子接口。 第一个子接口位于芯片组和缓冲区之间。 第二个子接口位于缓冲区和内存模块之间。 该方法还包括交织缓冲器的输出,以及配置缓冲器以适当地锁存正在芯片组和存储器模块之间传输的数据。 第一子接口和第二子接口彼此独立地操作,但是彼此同步。
    • 4. 发明授权
    • Buffering and interleaving data transfer between a chipset and memory modules
    • 在芯片组和存储器模块之间缓冲和交织数据传输
    • US06697888B1
    • 2004-02-24
    • US09675304
    • 2000-09-29
    • John B. HalbertJim M. DoddChung LamRandy M. Bonella
    • John B. HalbertJim M. DoddChung LamRandy M. Bonella
    • G06F300
    • G06F13/4234
    • Providing electrical isolation between the chipset and the memory data is disclosed. The disclosure includes providing at least one buffer in a memory interface between a chipset and memory modules. Each memory module includes a plurality of memory ranks. The buffers allow the memory interface to be split into first and second sub-interfaces. The first sub-interface is between the chipset and the buffers. The second sub-interface is between the buffers and the memory modules. The method also includes interleaving output of the buffers, and configuring the buffers to properly latch the data being transferred between the chipset and the memory modules. The first and second sub-interfaces operate independently but in synchronization with each other.
    • 公开了在芯片组和存储器数据之间提供电隔离。 本公开包括在芯片组和存储器模块之间的存储器接口中提供至少一个缓冲器。 每个存储器模块包括多个存储器等级。 这些缓冲区允许将存储器接口拆分成第一和第二子接口。 第一个子接口位于芯片组和缓冲区之间。 第二个子接口位于缓冲区和内存模块之间。 该方法还包括交织缓冲器的输出,以及配置缓冲器以适当地锁存正在芯片组和存储器模块之间传输的数据。 第一子接口和第二子接口彼此独立地操作,但是彼此同步。
    • 6. 发明授权
    • Apparatus for implementing a buffered daisy chain connection between a memory controller and memory modules
    • 用于在存储器控制器和存储器模块之间实现缓冲菊花链连接的装置
    • US06317352B1
    • 2001-11-13
    • US09665196
    • 2000-09-18
    • John B. HalbertJim M. DoddChung LamRandy M. Bonella
    • John B. HalbertJim M. DoddChung LamRandy M. Bonella
    • G11C502
    • G11C8/12G06F13/409G06F13/4256G11C5/02G11C5/14Y02D10/14Y02D10/151
    • A plurality of memory modules interface through a daisy-chain providing a point-to-point connection for each memory module. The first and the last memory module in the daisy chain each connect to a separate memory controller port forming a ring circuit. A distinct set of signals connect the memory modules in each direction. A junction circuit in each memory module provides line isolation, a coupling to the adjoining memory modules in the daisy chain, or in the case of the first and last memory module in the daisy chain, a memory module and a memory controller, and a data synchronization circuit. Each junction circuit provides as well as voltage conversion so that the memory devices on a memory module operate at a different voltage than the memory controller, and multiplexing/de-multiplexing so that a lesser number of lines interface with each junction circuit.
    • 多个存储器模块通过菊花链接口,为每个存储器模块提供点对点连接。 菊花链中的第一个和最后一个存储器模块都连接到形成环形电路的单独的存储器控​​制器端口。 一组独特的信号在每个方向连接存储器模块。 每个存储器模块中的结电路提供线路隔离,耦合到菊花链中的相邻存储器模块,或者在菊花链中的第一和最后存储器模块的情况下,存储器模块和存储器控制器以及数据 同步电路 每个结电路提供以及电压转换,使得存储器模块上的存储器件以与存储器控制器不同的电压工作,以及多路复用/解复用,使得较少数量的线路与每个结电路接口。