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1. 发明授权

US06744102B2 MOS transistors with nitrogen in the gate oxide of the p-channel transistor 有权
标题翻译：在p沟道晶体管的栅极氧化物中具有氮的MOS晶体管
公开(公告)号：US06744102B2
公开(公告)日：2004-06-01
申请号：US10087416
申请日：2002-02-27
申请人： Jigish D. Trivedi , Zhongze Wang , Rongsheng Yang
发明人： Jigish D. Trivedi , Zhongze Wang , Rongsheng Yang
IPC分类号： H01L2994
CPC分类号： H01L21/823462
摘要： In accordance with an aspect of the invention, a semiconductor processing method of forming field effect transistors includes forming a first gate dielectric layer over a first area configured for forming p-type field effect transistors and a second area configured for forming n-type field effect transistors, both areas on a semiconductor substrate. The first gate dielectric layer is silicon dioxide having a nitrogen concentration of 0.1% molar to 10.0% molar within the first gate dielectric layer, the nitrogen atoms being higher in concentration within the first gate dielectric layer at one elevational location as compared to another elevational location. The first gate dielectric layer is removed from over the second area while leaving the first gate dielectric layer over the first area, and a second gate dielectric layer is formed over the second area. The second gate dielectric layer is a silicon dioxide material substantially void of nitrogen atoms. Transistor gates are formed over the first and second gate dielectric layers, and then p-type source/drain regions are formed proximate the transistor gates in the first area and n-type source/drain regions are formed proximate the transistor gates in the second area.
摘要翻译：根据本发明的一个方面，形成场效应晶体管的半导体处理方法包括在被配置用于形成p型场效应晶体管的第一区域上形成第一栅极电介质层，以及第二区域，用于形成n型场效应晶体管，半导体衬底上的两个区域。第一栅极电介质层是在第一栅极介电层内的氮浓度为0.1％摩尔至10.0％摩尔浓度的二氧化硅，与另一个高度位置相比，在一个高度位置处的第一栅极介电层内的氮原子的浓度较高。第一栅介质层在第二区域上被移除，同时在第一区域上留下第一栅极介质层，并且在第二区域上形成第二栅极电介质层。第二栅极电介质层是基本上不含氮原子的二氧化硅材料。在第一和第二栅极电介质层上形成晶体管栅极，然后在第一区域中的晶体管栅极附近形成p型源极/漏极区域，并且在第二区域中的晶体管栅极附近形成n型源极/漏极区域。

2. 发明授权

US06417546B2 P-type FET in a CMOS with nitrogen atoms in the gate dielectric 有权
标题翻译：在栅极电介质中具有氮原子的CMOS中的P型FET
公开(公告)号：US06417546B2
公开(公告)日：2002-07-09
申请号：US09444024
申请日：1999-11-19
申请人： Jigish D. Trivedi , Zhongze Wang , Rongsheng Yang
发明人： Jigish D. Trivedi , Zhongze Wang , Rongsheng Yang
IPC分类号： H01L2994
CPC分类号： H01L21/823462
摘要： In accordance with an aspect of the invention, a semiconductor processing method of forming field effect transistors includes forming a first gate dielectric layer over a first area configured for forming p-type field effect transistors and a second area configured for forming n-type field effect transistors, both areas on a semiconductor substrate. The first gate dielectric layer is silicon dioxide having a nitrogen concentration of 0.1% molar to 10.0% molar within the first gate dielectric layer, the nitrogen atoms being higher in concentration within the first gate dielectric layer at one elevational location as compared to another elevational location. The first gate dielectric layer is removed from over the second area while leaving the first gate dielectric layer over the first area, and a second gate dielectric layer is formed over the second area. The second gate dielectric layer is a silicon dioxide material substantially void of nitrogen atoms. Transistor gates are formed over the first and second gate dielectric layers, and then p-type source/drain regions are formed proximate the transistor gates in the first area and n-type source/drain regions are formed proximate the transistor gates in the second area.
摘要翻译：根据本发明的一个方面，形成场效应晶体管的半导体处理方法包括在被配置用于形成p型场效应晶体管的第一区域上形成第一栅极电介质层，以及第二区域，用于形成n型场效应晶体管，半导体衬底上的两个区域。第一栅极电介质层是在第一栅极介电层内的氮浓度为0.1％摩尔至10.0％摩尔浓度的二氧化硅，与另一个高度位置相比，在一个高度位置处的第一栅极介电层内的氮原子的浓度较高。第一栅介质层在第二区域上被移除，同时在第一区域上留下第一栅极介质层，并且在第二区域上形成第二栅极电介质层。第二栅极电介质层是基本上不含氮原子的二氧化硅材料。在第一和第二栅极电介质层上形成晶体管栅极，然后在第一区域中的晶体管栅极附近形成p型源极/漏极区域，并且在第二区域中的晶体管栅极附近形成n型源极/漏极区域。

3. 发明授权

US6093661A Integrated circuitry and semiconductor processing method of forming field effect transistors 有权
公开(公告)号：US6093661A
公开(公告)日：2000-07-25
申请号：US386076
申请日：1999-08-30
申请人： Jigish D. Trivedi , Zhongze Wang , Rongsheng Yang
发明人： Jigish D. Trivedi , Zhongze Wang , Rongsheng Yang
IPC分类号： H01L21/8234 , H01L21/31 , H01L21/336
CPC分类号： H01L21/823462
摘要： In accordance with an aspect of the invention, a semiconductor processing method of forming field effect transistors includes forming a first gate dielectric layer over a first area configured for forming p-type field effect transistors and a second area configured for forming n-type field effect transistors, both areas on a semiconductor substrate. The first gate dielectric layer is silicon dioxide having a nitrogen concentration of 0.1% molar to 10.0% molar within the first gate dielectric layer, the nitrogen atoms being higher in concentration within the first gate dielectric layer at one elevational location as compared to another elevational location. The first gate dielectric layer is removed from over the second area while leaving the first gate dielectric layer over the first area, and a second gate dielectric layer is formed over the second area. The second gate dielectric layer is a silicon dioxide material substantially void of nitrogen atoms. Transistor gates are formed over the first and second gate dielectric layers, and then p-type source/drain regions are formed proximate the transistor gates in the first area and n-type source/drain regions are formed proximate the transistor gates in the second area.

4. 发明授权

US06541395B1 Semiconductor processing method of forming field effect transistors 有权
标题翻译：形成场效应晶体管的半导体处理方法
公开(公告)号：US06541395B1
公开(公告)日：2003-04-01
申请号：US09616959
申请日：2000-07-13
申请人： Jigish D. Trivedi , Zhongze Wang , Rongsheng Yang
发明人： Jigish D. Trivedi , Zhongze Wang , Rongsheng Yang
IPC分类号： H01L2131
CPC分类号： H01L21/823462
摘要： In accordance with an aspect of the invention, a semiconductor processing method of forming field effect transistors includes forming a first gate dielectric layer over a first area configured for forming p-type field effect transistors and a second area configured for forming n-type field effect transistors, both areas on a semiconductor substrate. The first gate dielectric layer is silicon dioxide having a nitrogen concentration of 0.1% molar to 10.0% molar within the first gate dielectric layer, the nitrogen atoms being higher in concentration within the first gate dielectric layer at one elevational location as compared to another elevational location. The first gate dielectric layer is removed from over the second area while leaving the first gate dielectric layer over the first area, and a second gate dielectric layer is formed over the second area. The second gate dielectric layer is a silicon dioxide material substantially void of nitrogen atoms. Transistor gates are formed over the first and second gate dielectric layers, and then p-type source/drain regions are formed proximate the transistor gates in the first area and n-type source/drain regions are formed proximate the transistor gates in the second area.
摘要翻译：根据本发明的一个方面，形成场效应晶体管的半导体处理方法包括在被配置用于形成p型场效应晶体管的第一区域上形成第一栅极电介质层，以及第二区域，用于形成n型场效应晶体管，半导体衬底上的两个区域。第一栅极电介质层是在第一栅极介电层内的氮浓度为0.1％摩尔至10.0％摩尔浓度的二氧化硅，与另一个高度位置相比，在一个高度位置处的第一栅极介电层内的氮原子的浓度较高。第一栅介质层在第二区域上被移除，同时在第一区域上留下第一栅极介质层，并且在第二区域上形成第二栅极电介质层。第二栅极电介质层是基本上不含氮原子的二氧化硅材料。在第一和第二栅极电介质层上形成晶体管栅极，然后在第一区域中的晶体管栅极附近形成p型源极/漏极区域，并且在第二区域中的晶体管栅极附近形成n型源极/漏极区域。

5. 发明授权

US06673715B2 Methods of forming conductive contacts 有权
公开(公告)号：US06673715B2
公开(公告)日：2004-01-06
申请号：US10002335
申请日：2001-10-24
申请人： Jigish D. Trivedi , Zhongze Wang , Chi-Chen Cho
发明人： Jigish D. Trivedi , Zhongze Wang , Chi-Chen Cho
IPC分类号： H01L2144
CPC分类号： H01L21/76888 , H01L21/76897
摘要： Methods of forming conductive contacts are described. According to one implementation, the method includes forming a transistor gate structure over a substrate. The gate structure includes a conductive silicide covered by insulative material. A dielectric layer is formed over the substrate and the gate structure. A contact opening is etched into the dielectric layer adjacent the gate structure. After the etching, the substrate is exposed to oxidizing conditions effective to oxidize any conductive silicide within the contact opening which was exposed during the contact opening etch. After the oxidizing, conductive material is formed within the contact opening. According to another embodiment, after the etching, it is determined whether conductive silicide of the gate structure was exposed during the etching. The substrate is then exposed to oxidizing conditions only if conductive silicide of the gate structure was exposed during the etching.

6. 发明授权

US06599789B1 Method of forming a field effect transistor 失效
标题翻译：形成场效应晶体管的方法
公开(公告)号：US06599789B1
公开(公告)日：2003-07-29
申请号：US09713844
申请日：2000-11-15
申请人： Todd R. Abbott , Zhongze Wang , Jigish D. Trivedi , Chih-Chen Cho
发明人： Todd R. Abbott , Zhongze Wang , Jigish D. Trivedi , Chih-Chen Cho
IPC分类号： H01L2184
CPC分类号： H01L29/66651 , H01L21/26533 , H01L29/0653 , H01L29/41766 , H01L29/66636
摘要： A method of forming a field effect transistor includes forming a channel region within bulk semiconductive material of a semiconductor substrate. Source/drain regions are formed on opposing sides of the channel region. An insulative dielectric region is formed within the bulk semiconductive material proximately beneath at least one of the source/drain regions. A method of forming a field effect transistor includes providing a semiconductor-on-insulator substrate, said substrate comprising a layer of semiconductive material formed over a layer of insulative material. All of a portion of the semiconductive material layer and all of the insulative material layer directly beneath the portion are removed thereby creating a void in the semiconductive material layer and the insulative material layer. Semiconductive channel material is formed within the void. Opposing source/drain regions are provided laterally proximate the channel material. A gate is formed over the channel material. Integrated circuitry includes a bulk semiconductor substrate. A field effect transistor thereon includes a gate, a channel region in the bulk semiconductor substrate, and source/drain regions within the substrate on opposing sides of the channel region. A field isolation region is formed in the bulk semiconductor substrate and laterally adjoins with one of the source/drain regions. The field isolation region includes a portion which extends beneath at least some of the one source/drain region. Other aspects are contemplated.
摘要翻译：形成场效应晶体管的方法包括在半导体衬底的本体半导体材料内形成沟道区。源极/漏极区域形成在沟道区域的相对侧上。绝缘电介质区域在本体半导体材料内形成在源极/漏极区域中的至少一个附近。形成场效应晶体管的方法包括提供绝缘体上半导体衬底，所述衬底包括在绝缘材料层上形成的半导体材料层。半导体材料层的一部分和直接在该部分正下方的所有绝缘材料层被除去，从而在半导体材料层和绝缘材料层中产生空隙。半导体通道材料形成在空隙内。相邻的源极/漏极区域横向靠近通道材料提供。在通道材料上形成一个栅极。集成电路包括体半导体衬底。其中的场效应晶体管包括栅极，体半导体衬底中的沟道区，以及在沟道区的相对侧上的衬底内的源极/漏极区。在体半导体衬底中形成场隔离区域，并且与源极/漏极区域之一横向邻接。场隔离区域包括在一个源极/漏极区域中的至少一些的下方延伸的部分。考虑其他方面。

7. 发明授权

US06583518B2 Cross-diffusion resistant dual-polycide semiconductor structure and method 有权
公开(公告)号：US06583518B2
公开(公告)日：2003-06-24
申请号：US09945380
申请日：2001-08-31
申请人： Jigish D. Trivedi , Zhongze Wang , Todd R. Abbott , Chih-Chen Cho
发明人： Jigish D. Trivedi , Zhongze Wang , Todd R. Abbott , Chih-Chen Cho
IPC分类号： H01L2711
CPC分类号： H01L27/11 , H01L27/1104 , Y10S257/903 , Y10S257/904
摘要： A dual-polycide semiconductor structure and method for forming the same having reduced dopant cross-diffusion. A conductive layer is formed over a polysilicon layer having a first region doped with a first dopant and a second region adjoining the first region at an interface doped with a second dopant. A region of discontinuity is then formed in the conductive layer located away from the interface. The conductive layer formed over the polysilicon gate overlaps the interface to provide electrical continuity between the first and second regions of the polysilicon gate, but also includes a region of discontinuity to reduce dopant cross-diffusion.

8. 发明授权

US07153731B2 Method of forming a field effect transistor with halo implant regions 有权
标题翻译：用卤素注入区域形成场效应晶体管的方法
公开(公告)号：US07153731B2
公开(公告)日：2006-12-26
申请号：US10236662
申请日：2002-09-05
申请人： Todd R. Abbott , Zhongze Wang , Jigish D. Trivedi , Chih-Chen Cho
发明人： Todd R. Abbott , Zhongze Wang , Jigish D. Trivedi , Chih-Chen Cho
IPC分类号： H01L21/336 , H01L21/331 , H01L21/76 , H01L21/3205 , H01L21/44
CPC分类号： H01L29/66651 , H01L21/26533 , H01L29/0653 , H01L29/41766 , H01L29/66636
摘要： A method of forming a field effect transistor includes forming a channel region within bulk semiconductive material of a semiconductor substrate. Source/drain regions are formed on opposing sides of the channel region. An insulative dielectric region is formed within the bulk semiconductive material proximately beneath at least one of the source/drain regions. A method of forming a field effect transistor includes providing a semiconductor-on-insulator substrate, said substrate comprising a layer of semiconductive material formed over a layer of insulative material. All of a portion of the semiconductive material layer and all of the insulative material layer directly beneath the portion are removed thereby creating a void in the semiconductive material layer and the insulative material layer. Semiconductive channel material is formed within the void. Opposing source/drain regions are provided laterally proximate the channel material. A gate is formed over the channel material. Integrated circuitry includes a bulk semiconductor substrate. A field effect transistor thereon includes a gate, a channel region in the bulk semiconductor substrate, and source/drain regions within the substrate on opposing sides of the channel region. A field isolation region is formed in the bulk semiconductor substrate and laterally adjoins with one of the source/drain regions. The field isolation region includes a portion which extends beneath at least some of the one source/drain region. Other aspects are contemplated.
摘要翻译：形成场效应晶体管的方法包括在半导体衬底的本体半导体材料内形成沟道区。源极/漏极区域形成在沟道区域的相对侧上。绝缘电介质区域在本体半导体材料内形成在源极/漏极区域中的至少一个附近。形成场效应晶体管的方法包括提供绝缘体上半导体衬底，所述衬底包括在绝缘材料层上形成的半导体材料层。半导体材料层的一部分和直接在该部分正下方的所有绝缘材料层被除去，从而在半导体材料层和绝缘材料层中产生空隙。半导体通道材料形成在空隙内。相邻的源极/漏极区域横向靠近通道材料提供。在通道材料上形成一个栅极。集成电路包括体半导体衬底。其中的场效应晶体管包括栅极，体半导体衬底中的沟道区，以及在沟道区的相对侧上的衬底内的源极/漏极区。在体半导体衬底中形成场隔离区域，并且与源极/漏极区域之一横向邻接。场隔离区域包括在一个源极/漏极区域中的至少一些的下方延伸的部分。考虑其他方面。

9. 发明授权

US07112482B2 Method of forming a field effect transistor 有权
公开(公告)号：US07112482B2
公开(公告)日：2006-09-26
申请号：US10901538
申请日：2004-07-28
申请人： Todd R. Abbott , Zhongze Wang , Jigish D. Trivedi , Chih-Chen Cho
发明人： Todd R. Abbott , Zhongze Wang , Jigish D. Trivedi , Chih-Chen Cho
IPC分类号： H01L21/8238
CPC分类号： H01L29/66651 , H01L21/26533 , H01L29/0653 , H01L29/41766 , H01L29/66636
摘要： A method of forming a field effect transistor includes forming a channel region within bulk semiconductive material of a semiconductor substrate. Source/drain regions are formed on opposing sides of the channel region. An insulative dielectric region is formed within the bulk semiconductive material proximately beneath at least one of the source/drain regions. A method of forming a field effect transistor includes providing a semiconductor-on-insulator substrate, said substrate comprising a layer of semiconductive material formed over a layer of insulative material. All of a portion of the semiconductive material layer and all of the insulative material layer directly beneath the portion are removed thereby creating a void in the semiconductive material layer and the insulative material layer. Semiconductive channel material is formed within the void. Opposing source/drain regions are provided laterally proximate the channel material. A gate is formed over the channel material. Integrated circuitry includes a bulk semiconductor substrate. A field effect transistor thereon includes a gate, a channel region in the bulk semiconductor substrate, and source/drain regions within the substrate on opposing sides of the channel region. A field isolation region is formed in the bulk semiconductor substrate and laterally adjoins with one of the source/drain regions. The field isolation region includes a portion which extends beneath at least some of the one source/drain region. Other aspects are contemplated.

10. 发明授权

US06987291B2 Integrated transistor circuitry 失效
标题翻译：集成晶体管电路
公开(公告)号：US06987291B2
公开(公告)日：2006-01-17
申请号：US10236282
申请日：2002-09-05
申请人： Todd R. Abbott , Zhongze Wang , Jigish D. Trivedi , Chih-Chen Cho
发明人： Todd R. Abbott , Zhongze Wang , Jigish D. Trivedi , Chih-Chen Cho
IPC分类号： H01L31/0328
CPC分类号： H01L29/66651 , H01L21/26533 , H01L29/0653 , H01L29/41766 , H01L29/66636
摘要： Integrated circuitry includes a bulk semiconductor substrate. A field effect transistor thereon includes a gate, a channel region in the bulk semiconductor substrate, and source/drain regions within the substrate on opposing sides of the channel region. A field isolation region is formed in the bulk semiconductor substrate and laterally adjoins with one of the source/drain regions. The field isolation region includes a portion which extends beneath at least some of the one source/drain region. Other aspects are contemplated.
摘要翻译：集成电路包括体半导体衬底。其中的场效应晶体管包括栅极，体半导体衬底中的沟道区，以及在沟道区的相对侧上的衬底内的源极/漏极区。在体半导体衬底中形成场隔离区域，并且与源极/漏极区域之一横向邻接。场隔离区域包括在一个源极/漏极区域中的至少一些的下方延伸的部分。考虑其他方面。

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