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    • 4. 发明授权
    • Modified source side inserted anti-type diffusion ESD protection device
    • US06541824B2
    • 2003-04-01
    • US09957275
    • 2001-09-21
    • Jian-Hsing LeeJiaw-Ren ShihShui-Hung ChenYi-Hsun Wu
    • Jian-Hsing LeeJiaw-Ren ShihShui-Hung ChenYi-Hsun Wu
    • H01L2362
    • H01L27/0277H01L27/0259H01L2924/0002H01L2924/00
    • An ESD protection circuit that will prevent internal circuits of an integrated circuit is formed on a semiconductor substrate to prevent damage during extreme voltage levels from an ESD voltage source and is connected to an input/output pad. A plurality of drains of multiple MOS FET's is formed within the surface of the semiconductor substrate and are each connected to the input/output pad. A plurality of sources of the multiple MOS FET's is formed within the surface of the semiconductor substrate and are placed at a distance from the plurality of drains and are connected to a ground reference potential. Pairs of the plurality of sources are adjacent to each other. A plurality of isolation regions placed between each source of the pairs of sources and are allowed to float. The multiple MOS FET's have a plurality of parasitic bipolar junction transistors. When contacting an ESD voltage source to the collectors of the plurality of parasitic bipolar junction transistors, the junction formed between the collector and the base of the parasitic bipolar junction transistor enters into avalanche breakdown. The avalanche breakdown generates a large current through the substrate bulk resistances that is sufficiently large as to cause the base emitter junctions of all the parasitic bipolar junction transistors and turn on the parasitic bipolar junction transistors. The conduction of all the parasitic bipolar junction transistors is sufficient to cause the ESD voltage to be discharged thus preventing damage to the internal circuitry.
    • 5. 发明授权
    • ESD structure for high voltage ESD protection
    • ESD结构用于高压ESD保护
    • US07462885B2
    • 2008-12-09
    • US11606424
    • 2006-11-30
    • Shui-Hung ChenJian-Hsing LeeYi-Hsun WuD. J. PerngAnthony Oates
    • Shui-Hung ChenJian-Hsing LeeYi-Hsun WuD. J. PerngAnthony Oates
    • H01L29/72H01L23/62
    • H01L29/0847H01L27/0266H01L29/0692H01L29/0696H01L29/0878H01L29/42368H01L29/7816H01L29/7835
    • An electrostatic discharge-protected MOS structure is disclosed. An electrostatic discharge-protected MOS structure includes a semiconductor substrate of a first type, a first well of the first type formed in the semiconductor substrate, and a second well of a second type disposed adjacent to the first well. The MOS structure further includes a source region, a drain region, and an oxide layer and a polysilicon layer for forming a gate electrode of the MOS structure. In addition, the MOS structure includes a parasitic SCR comprising at least a parasitic NPN bipolar transistor and a buried layer of the second type interposed between the second well and the semiconductor substrate. The buried layer functions to lower a resistance of the semiconductor substrate during an ESD event so that ESD currents generated by the parasitic SCR are dissipated through the buried layer and the semiconductor substrate, thereby protecting the MOS structure.
    • 公开了一种静电放电保护的MOS结构。 静电放电保护的MOS结构包括第一类型的半导体衬底,形成在半导体衬底中的第一类型的第一阱和与第一阱相邻布置的第二类型的第二阱。 MOS结构还包括用于形成MOS结构的栅电极的源极区,漏极区和氧化物层以及多晶硅层。 此外,MOS结构包括至少包括寄生NPN双极晶体管和插入在第二阱和半导体衬底之间的第二类型的掩埋层的寄生SCR。 掩埋层用于在ESD事件期间降低半导体衬底的电阻,使得由寄生SCR产生的ESD电流通过掩埋层和半导体衬底消散,从而保护MOS结构。
    • 6. 发明授权
    • Modified source side inserted anti-type diffusion ESD protection device
    • 修改源极侧插入防扩散ESD保护装置
    • US06306695B1
    • 2001-10-23
    • US09407110
    • 1999-09-27
    • Jian-Hsing LeeJiaw-Ren ShihShui-Hung ChenYi-Hsun Wu
    • Jian-Hsing LeeJiaw-Ren ShihShui-Hung ChenYi-Hsun Wu
    • H01L2100
    • H01L27/0277H01L27/0259H01L2924/0002H01L2924/00
    • An ESD protection circuit that will prevent internal circuits of an integrated circuit is formed on a semiconductor substrate to prevent damage during extreme voltage levels from an ESD voltage source and is connected to an input/output pad. A plurality of drains of multiple MOS FET's is formed within the surface of the semiconductor substrate and are each connected to the input/output pad. A plurality of sources of the multiple MOS FET's is formed within the surface of the semiconductor substrate and are placed at a distance from the plurality of drains and are connected to a ground reference potential. Pairs of the plurality of sources are adjacent to each other. A plurality of isolation regions placed between each source of the pairs of sources and are allowed to float. The multiple MOS FET's have a plurality of parasitic bipolar junction transistors. When contacting an ESD voltage source to the collectors of the plurality of parasitic bipolar junction transistors, the junction formed between the collector and the base of the parasitic bipolar junction transistor enters into avalanche breakdown. The avalanche breakdown generates a large current through the substrate bulk resistances that is sufficiently large as to cause the base emitter junctions of all the parasitic bipolar junction transistors and turn on the parasitic bipolar junction transistors. The conduction of all the parasitic bipolar junction transistors is sufficient to cause the ESD voltage to be discharged thus preventing damage to the internal circuitry.
    • 在半导体衬底上形成防止集成电路的内部电路的ESD保护电路,以防止在来自ESD电压源的极端电压电平期间的损坏并连接到输入/输出焊盘。 多个MOS FET的漏极形成在半导体衬底的表面内,并且各自连接到输入/输出焊盘。 多个MOS FET的多个源极形成在半导体衬底的表面内并且被放置在与多个漏极相距一定距离处并连接到接地参考电位。 多个源的对彼此相邻。 放置在源对之间的每个源之间并被允许浮动的多个隔离区域。 多个MOS FET具有多个寄生双极结型晶体管。 当将ESD电压源接触到多个寄生双极结型晶体管的集电极时,在集电极与寄生双极结型晶体管的基极之间形成的结形成为雪崩击穿。 雪崩击穿通过衬底体电阻产生大的电流,该电阻足够大,以致引起所有寄生双极结型晶体管的基极发射极结并导通寄生双极结型晶体管。 所有寄生双极结晶体管的导通足以使ESD电压放电,从而防止对内部电路的损坏。
    • 7. 发明授权
    • Input/output devices with robustness of ESD protection
    • 具有ESD保护鲁棒性的输入/输出设备
    • US07508639B2
    • 2009-03-24
    • US11305983
    • 2005-12-19
    • Yi-Hsun WuJian-Hsing LeeShui-Hung Chen
    • Yi-Hsun WuJian-Hsing LeeShui-Hung Chen
    • H02H9/00H02H3/22H02H1/00H02H1/04H02H9/06H01C7/12
    • H01L27/0266H01L2924/0002H01L2924/00
    • Input/output devices with robustness of ESD protection are provided. An input/output device comprises an input/output pad, a first NMOS transistor, a second NMOS transistor and an ESD detector. The first NMOS transistor comprises a first drain, a first source and a first gate, wherein the first source and the first gate are coupled to a first ground power rail, and the first drain to the input/output pad. The second NMOS transistor comprises a second drain, a second source and a second gate, wherein the second source is coupled to the first ground power rail, the second drain to the input/output pad, and the second gate to a first pre-driver. When an ESD event is detected, the ESD detector makes the first pre-driver couple the second gate to the first ground power rail, thereby the first and second transistors evenly discharge ESD current.
    • 提供具有ESD保护鲁棒性的输入/输出设备。 输入/输出装置包括输入/​​输出焊盘,第一NMOS晶体管,第二NMOS晶体管和ESD检测器。 第一NMOS晶体管包括第一漏极,第一源极和第一栅极,其中第一源极和第一栅极耦合到第一接地电源轨,第一漏极耦合到输入/输出焊盘。 第二NMOS晶体管包括第二漏极,第二源极和第二栅极,其中第二源极耦合到第一接地电源轨,第二漏极耦合到输入/输出焊盘,第二栅极耦合到第一预驱动器 。 当检测到ESD事件时,ESD检测器使第一预驱动器将第二栅极耦合到第一接地电源轨,由此第一和第二晶体管均匀地放电ESD电流。
    • 9. 发明授权
    • N-type structure for n-type pull-up and down I/O protection circuit
    • N型结构用于n型上拉和下拉I / O保护电路
    • US06323523B1
    • 2001-11-27
    • US09494682
    • 2000-01-31
    • Jian-Hsing LeeYi-Hsun WuShui-Hung ChenJiaw-Ren Shih
    • Jian-Hsing LeeYi-Hsun WuShui-Hung ChenJiaw-Ren Shih
    • H01L2362
    • H01L27/0262H01L2924/0002H01L2924/00
    • An ESD protective circuit formed by n-type pull-up transistors and n-type pull-down transistors on a p-type silicon substrate for protecting an internal device circuit is disclosed. In the circuit, a n-well region having a p+ diffusion and a n+ diffusion therein being formed adjacent one drain region of one pull-up transistors, the p+ diffusion and a n+ diffusion, as well as all the drain regions of the pull-up transistors are coupled to a power supply. All the source regions of the pull-up transistors and drain regions of the pull-down transistors are connected to an I/O pad. All the source regions of the pull-down transistors including the p+ guardings are grounded. The gates of all transistors are connected to the internal device circuit so that the internal device circuit will be immunity from the ESD.
    • 公开了一种用于保护内部器件电路的p型硅衬底上的n型上拉晶体管和n型下拉晶体管形成的ESD保护电路。 在该电路中,在一个上拉晶体管的一个漏极区附近形成有p +扩散和n +扩散的n阱区,p +扩散和n +扩散以及所述漏极区的所有漏极区, 上拉晶体管耦合到电源。 下拉晶体管的上拉晶体管和漏极区域的所有源极区域都连接到I / O焊盘。 包括p +保护的下拉晶体管的所有源极区域接地。 所有晶体管的栅极连接到内部器件电路,使得内部器件电路将免受ESD的影响。