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1. 发明授权

US06986197B2 Method of manufacturing an IC package 有权
标题翻译：制造IC封装的方法
公开(公告)号：US06986197B2
公开(公告)日：2006-01-17
申请号：US10006052
申请日：2001-12-06
申请人： Jian Wu , Yan Zhou , Shu Chuen Ho , Teng Hock Kuah
发明人： Jian Wu , Yan Zhou , Shu Chuen Ho , Teng Hock Kuah
IPC分类号： H01R43/00
CPC分类号： H01L24/86 , H01L2924/01005 , H01L2924/01082 , H01L2924/14 , Y10T29/49117 , Y10T29/49121 , Y10T29/49146 , Y10T29/49171 , Y10T29/4922 , Y10T29/53178 , Y10T29/53183
摘要： A method is provided for processing leadframe items of two or more types to form integrated circuit packages. The leadframe items are delivered along respective input paths and are received into holders, which are moved alternately between a processing region and a respective leadframe item reception position on a respective input path such that each of the holders moves to the processing region at a time when the other of the holders moves to its respective reception position. The leadframe items are delivered from the respective reception position to the processing region, and are then sent for encapsulation.
摘要翻译：提供了一种用于处理两种或多种类型的引线框项目以形成集成电路封装的方法。引线框架物品沿着相应的输入路径传送并被接收到保持器中，这些保持器在相应的输入路径上的处理区域和相应的引线框架物品接收位置之间交替移动，使得每个保持器在每个保持器移动到处理区域时移动，另一个持有者移动到其各自的接收位置。引线框项目从相应的接收位置传送到处理区域，然后发送以进行封装。

2. 发明授权

US06808661B2 Method for encapsulating leadframe-mounted integrated circuits 有权
标题翻译：封装引线框安装集成电路的方法
公开(公告)号：US06808661B2
公开(公告)日：2004-10-26
申请号：US10013079
申请日：2001-12-11
申请人： See Yap Ong , Kock Hien Wee , Shu Chuen Ho , Teng Hock Kuah , Jian Wu
发明人： See Yap Ong , Kock Hien Wee , Shu Chuen Ho , Teng Hock Kuah , Jian Wu
IPC分类号： B29C3108
CPC分类号： B29C45/14655 , B29C45/1701 , B29C45/18 , B29C70/72 , B29C2045/14868
摘要： A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the molds. To reduce the level of dust which enters the molding region, the path along which the leadframe items are conveyed to the molding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the molding region under a cover including a vacuum source, so that the dust is continually sucked away from them.
摘要翻译：提出一种用于封装在塑料材料引线框架中的系统，其包括连接到引线框的IC。塑料材料的粉尘从包封系统中除去，特别是从灰尘主要积聚的物品（如模具表面）中除去。为了降低进入模制区域的灰尘的水平，引导框架物品被输送到模制区域的路径在引导框架物品未被运送到那里时被关闭。此外，引线框架物品被输送到包括真空源的盖子下方的模制区域，使得灰尘被连续地从它们中吸出。

3. 发明授权

US06869556B2 Molding system for semiconductor packages 有权
标题翻译：半导体封装成型系统
公开(公告)号：US06869556B2
公开(公告)日：2005-03-22
申请号：US10197312
申请日：2002-07-16
申请人： Shu Chuen Ho , Teng Hock Kuah , Jian Wu , Si Liang Lu
发明人： Shu Chuen Ho , Teng Hock Kuah , Jian Wu , Si Liang Lu
IPC分类号： B29C45/14 , B29C45/26 , B29C45/27 , B29C45/64 , B29C70/72 , H01L21/56
CPC分类号： B29C45/14655 , B29C45/1742 , B29C45/2602 , B29C45/2737 , B29C45/2756
摘要： The present invention provides a molding system as well as a method for encapsulating semiconductor packages, wherein a cavity plate is kept at a desired temperature during molding. The system includes a mold comprising a first mold piece and a second mold piece adapted to define a mold cavity for enclosing one or more semiconductor devices for molding, and a cavity plate adapted for mounting in the cavity to introduce encapsulation material to the semiconductor device(s). The system also includes retaining means adapted selectively to hold the cavity plate against the first mold piece or the second mold piece whereby to maintain the cavity plate at the desired temperature.
摘要翻译：本发明提供了一种模制系统以及用于封装半导体封装的方法，其中在模制期间腔模板保持在所需温度。该系统包括模具，该模具包括第一模具件和第二模具件，该模具件适于限定用于封闭一个或多个用于模制的半导体器件的模腔，以及适于安装在腔体中以将密封材料引入到半导体器件的腔板 s）。该系统还包括适于选择性地保持空腔板抵靠第一模具件或第二模具件的保持装置，从而将空腔板保持在期望的温度。

4. 发明授权

US06988879B2 Apparatus and method for reducing substrate warpage 有权
标题翻译：减少基板翘曲的装置和方法
公开(公告)号：US06988879B2
公开(公告)日：2006-01-24
申请号：US10274598
申请日：2002-10-18
申请人： Shu Chuen Ho , Teng Hock Kuah , Kock Hien Eugene Wee , Jian Wu
发明人： Shu Chuen Ho , Teng Hock Kuah , Kock Hien Eugene Wee , Jian Wu
IPC分类号： B29C45/14 , H01L21/56
CPC分类号： H01L21/68707 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/014 , Y10S414/141
摘要： The invention provides an apparatus and method for reducing warpage of a substrate undergoing a molding process, comprising a conveying device for transporting the substrate during molding and pressure means adapted to act on the substrate whereby to maintain the flatness of the substrate. Using the invention, it is possible to provide an apparatus and method which are usable with conventional substrates and which reduce reliance on material formulation to maintain flatness of the substrate.
摘要翻译：本发明提供了一种用于减少经历模制过程的基底的翘曲的装置和方法，包括用于在模制期间输送基底的输送装置和适于作用在基底上的压力装置，从而保持基底的平坦度。使用本发明，可以提供可与常规基板一起使用的装置和方法，并且减少对材料配方的依赖性以保持基板的平坦度。

5. 发明授权

US06770163B1 Mold and method for encapsulation of electronic device 有权
标题翻译：电子器件封装的模具和方法
公开(公告)号：US06770163B1
公开(公告)日：2004-08-03
申请号：US10129258
申请日：2002-05-02
申请人： Teng Hock Kuah , Shu Chuen Ho , Charles Joseph Vath, III , Loon Aik Lim , Man Ho Hui , Juay Sim Koh
发明人： Teng Hock Kuah , Shu Chuen Ho , Charles Joseph Vath, III , Loon Aik Lim , Man Ho Hui , Juay Sim Koh
IPC分类号： B29C4514
CPC分类号： H01L21/565 , B29C45/14655 , B29C2045/14934 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2924/00012 , H01L2924/00
摘要： A mold (1) is for molding a one-sided encapsulated electronic device. The mold (1) includes a first mold section (2) defining a mold cavity (4), and a second mold section (3) including a first recessed portion (6) adapted to receive a layer of material (15) attached to a leadframe (10), but not the leadframe (10).
摘要翻译：模具（1）用于模制单面封装的电子设备。模具（1）包括限定模腔（4）的第一模具部分（2）和包括第一凹部（6）的第二模具部分（3），第一凹部（6）适于容纳附着到模具引线框架（10），而不是引线框架（10）。

6. 发明授权

US09427893B2 Molding press and a platen for a molding press 有权
标题翻译：成型压力机和压模机
公开(公告)号：US09427893B2
公开(公告)日：2016-08-30
申请号：US14489640
申请日：2014-09-18
申请人： Jian Xiong Su , Teng Hock Kuah , Shu Chuen Ho , Jiapei Ding , Ravindra Raghavendra
发明人： Jian Xiong Su , Teng Hock Kuah , Shu Chuen Ho , Jiapei Ding , Ravindra Raghavendra
IPC分类号： B29C33/30 , B29C43/36 , H01L21/56 , B29C43/32
CPC分类号： B29C33/308 , B29C33/307 , B29C43/18 , B29C43/32 , B29C43/36 , B29C2043/5858 , B30B1/103 , B30B15/007 , B30B15/067 , H01L21/56 , H01L21/565
摘要： Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the center of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.
摘要翻译：公开了一种用于将半导体管芯封装在基板上的模压机的压板，所述压板包括：具有第一模具走向表面的第一模具追逐; 所述压板可操作以与具有第二模具追逐的另一个压板配合，其具有第二模具走走表面，以夹紧基板，所述基板保持在与第一或第二模具追逐表面相关的面向基板的表面上，第二模具追逐表面以相对于所述基板限定至少一个模腔; 其中所述压板还包括旋转安装装置，所述第一或第二模具追逐可以围绕穿过所述面向衬底的表面的中心的至少一个轴线旋转，以调整所述第一和第二模具走走表面的相对布置。还公开了一种成型压力机，其包括压板，并且另外的压板与压板配合。

7. 发明授权

US06860731B2 Mold for encapsulating a semiconductor chip 有权
标题翻译：用于封装半导体芯片的模具
公开(公告)号：US06860731B2
公开(公告)日：2005-03-01
申请号：US09901517
申请日：2001-07-09
申请人： Shu Chuen Ho , Teng Hock Kuah , Man Ho Hui , Srikanth Narasimulau , Murali Sarangapani
发明人： Shu Chuen Ho , Teng Hock Kuah , Man Ho Hui , Srikanth Narasimulau , Murali Sarangapani
IPC分类号： H01L21/56 , B29C45/14
CPC分类号： H01L21/565 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.
摘要翻译：模具具有两个半模（6,7）。半模（6）中的一个包括接触部分（8），该接触部分适于在使用中接触安装在模具中的半导体芯片（1）的表面（5）。

8. 发明授权

US06752896B2 Method of detaching a film of material from a substrate 有权
标题翻译：从基材分离材料膜的方法
公开(公告)号：US06752896B2
公开(公告)日：2004-06-22
申请号：US09901142
申请日：2001-07-10
申请人： See Yap Ong , Keng Hock Chew , Shu Chuen Ho , Teng Hock Kuah
发明人： See Yap Ong , Keng Hock Chew , Shu Chuen Ho , Teng Hock Kuah
IPC分类号： B32B0000
CPC分类号： H01L21/67132 , B29C63/0013 , H01L21/67092 , Y10S29/001 , Y10S156/941 , Y10T29/49815 , Y10T29/49819 , Y10T29/49822 , Y10T29/53274 , Y10T29/53465 , Y10T29/53683 , Y10T156/1137 , Y10T156/1179 , Y10T156/19 , Y10T156/1906
摘要： A method of detaching a film of material (2) from the surface (5) of a substrate (1). An outlet (11) of a fluid delivery device (10) is engaged with an aperture (7, 8) in the substrate (1) from the opposite side of the substrate (1) from the surface (5) to which the film (2) is attached. Fluid is passed out of the outlet (11) and through the aperture (7, 8) to generate a detaching force between the film of material (2) and the surface (5) adjacent to the aperture (7, 8).
摘要翻译：从衬底（1）的表面（5）分离材料（2）的膜的方法。流体输送装置（10）的出口（11）与衬底（1）的与衬底（1）的相反侧的孔（7,8）与表面（5）接合，膜 2）。流体从出口（11）中通过并通过孔（7,8），以在材料膜（2）和邻近孔（7,8）的表面（5）之间产生分离力。

9. 发明授权

US06674165B2 Mold for a semiconductor chip 有权
标题翻译：模具用于半导体芯片
公开(公告)号：US06674165B2
公开(公告)日：2004-01-06
申请号：US09930506
申请日：2001-08-15
申请人： Shu Chuen Ho , Teng Hock Kuah , Si Liang Lu , Srikanth Narasimulau , Charles J. Vath, III
发明人： Shu Chuen Ho , Teng Hock Kuah , Si Liang Lu , Srikanth Narasimulau , Charles J. Vath, III
IPC分类号： H01L2304
CPC分类号： H01L21/565 , H01L23/3107 , H01L23/49548 , H01L2924/0002 , H01L2924/00
摘要： A mold (1) for a semiconductor chip (9) has two mold halves (2, 3). One mold half (3) includes sealing means (10) adapted to exert a sealing pressure between a surface of the mold and a surface (18) of a substrate (8) located in the mold (1) during a molding operation.
摘要翻译：用于半导体芯片（9）的模具（1）具有两个半模（2,3）。一个半模（3）包括适于在模制操作期间在模具表面和位于模具（1）中的基板（8）的表面（18）之间施加密封压力的密封装置（10）。

10. 发明授权

US06877933B2 Pellet feeding system for a molding machine 有权
标题翻译：成型机的造粒系统
公开(公告)号：US06877933B2
公开(公告)日：2005-04-12
申请号：US09957103
申请日：2001-09-20
申请人： Shu Chuen Ho , Teng Hock Kuah , Jie Liu
发明人： Shu Chuen Ho , Teng Hock Kuah , Jie Liu
IPC分类号： B29C31/02 , B65G51/30
CPC分类号： B29C31/02 , B29K2063/00
摘要： A feeding system (10) for epoxy mould compound (EMC) pellets which has a supply bowl (12) situated outside the clean environment (24) of a conventional automatic moulding machine (26). A tube (16) extends from the supply bowl (12) to a buffer hopper (14) within the clean environment and which is located above the feeder bowl (28) of the automatic moulding machine (26). EMC pellets are transported through the tube (16) from the supply bowl (12) into the buffer hopper (14) via a vacuum suction system (34), (36) which is connected to the tube (16) in proximity to the buffer hopper (14). A counter air flow may be provided to slow the speed of the pellets as they enter the buffer hopper. Batches of the pellets accumulated in the buffer hopper (14) are periodically released into the feeder bowl (28) of the automatic moulding machine (26). The vacuum transportation system reduces dust from the pellets. Also productivity is increased compared to conventional use of the automatic moulding machine (26) by providing for the supply bowl (12) to have a significantly larger capacity compared to the feeder bowl (28) of the automatic moulding machine (28).
摘要翻译：一种用于环氧模塑料（EMC）颗粒的进料系统（10），其具有位于常规自动模塑机（26）的清洁环境（24）外部的供给碗（12）。管（16）在清洁环境内从供应碗（12）延伸到缓冲料斗（14），并且位于自动模塑机（26）的进料碗（28）上方。 EMC丸粒通过真空抽吸系统（34）从管道（16）从供应碗（12）输送到缓冲料斗（14），（36），其连接到靠近缓冲器的管（16）料斗（14）。可以提供反气流以减小粒料进入缓冲料斗时的速度。积聚在缓冲料斗（14）中的批料被周期性地释放到自动模塑机（26）的进料碗（28）中。真空运输系统减少了颗粒的灰尘。与自动模塑机（28）的进料碗（28）相比，通过提供供给碗（12）具有显着更大的容量，与传统使用自动模制机（26）相比，生产率提高。

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