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1. 发明申请

US20140071630A1 THERMAL DISSIPATING MODULE 有权
标题翻译：热释放模块
公开(公告)号：US20140071630A1
公开(公告)日：2014-03-13
申请号：US13958628
申请日：2013-08-05
申请人： Jia-Yu Hung , Chang-Yuan Wu , I-Feng Hsu , Ting-Wei Hsu
发明人： Jia-Yu Hung , Chang-Yuan Wu , I-Feng Hsu , Ting-Wei Hsu
IPC分类号： H05K1/02
CPC分类号： H05K1/0203 , H01L23/367 , H01L23/40 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H05K1/0209 , H05K2201/10393 , H01L2924/00
摘要： A thermal dissipating module suitable for removing heat from a heating element disposed on a circuit board is provided. The thermal dissipating module includes a heat conductive structure, an adhesive layer and an elastic member. The heat conductive structure is suitable for being disposed on the heating element. The adhesive layer is suitable for being disposed on the circuit board and adjacent to the heating element. The elastic member is glued to the circuit board by the adhesive layer, and the elastic member applies a force to make the heat conductive structure to be attached to the heating element.
摘要翻译：提供了一种适于从布置在电路板上的加热元件去除热量的散热模块。散热模块包括导热结构，粘合剂层和弹性构件。导热结构适于设置在加热元件上。粘合剂层适合于布置在电路板上并与加热元件相邻。弹性部件通过粘合剂层胶合到电路板上，并且弹性部件施加力以使导热结构附着到加热元件。

2. 发明授权

US09332627B2 Thermal dissipating module 有权
标题翻译：散热模块
公开(公告)号：US09332627B2
公开(公告)日：2016-05-03
申请号：US13958628
申请日：2013-08-05
申请人： Jia-Yu Hung , Chang-Yuan Wu , I-Feng Hsu , Ting-Wei Hsu
发明人： Jia-Yu Hung , Chang-Yuan Wu , I-Feng Hsu , Ting-Wei Hsu
IPC分类号： H05K7/20 , H05K1/02 , H01L23/367 , H01L23/473 , H01L23/40 , H01L23/427
CPC分类号： H05K1/0203 , H01L23/367 , H01L23/40 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H05K1/0209 , H05K2201/10393 , H01L2924/00
摘要： A thermal dissipating module suitable for removing heat from a heating element disposed on a circuit board is provided. The thermal dissipating module includes a heat conductive structure, an adhesive layer and an elastic member. The heat conductive structure is suitable for being disposed on the heating element. The adhesive layer is suitable for being disposed on the circuit board and adjacent to the heating element. The elastic member is glued to the circuit board by the adhesive layer, and the elastic member applies a force to make the heat conductive structure to be attached to the heating element.
摘要翻译：提供了一种适于从布置在电路板上的加热元件去除热量的散热模块。散热模块包括导热结构，粘合剂层和弹性构件。导热结构适于设置在加热元件上。粘合剂层适合于布置在电路板上并与加热元件相邻。弹性部件通过粘合剂层胶合到电路板上，并且弹性部件施加力以使导热结构附着到加热元件。

3. 发明申请

US20180228050A1 ELECTRONIC DEVICE AND METHOD FOR CONTROLLING FAN OPERATION 审中-公开
公开(公告)号：US20180228050A1
公开(公告)日：2018-08-09
申请号：US15854828
申请日：2017-12-27
申请人： Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
发明人： Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
IPC分类号： H05K7/20 , G06F1/20 , H05K5/00
摘要： An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.

4. 发明授权

US08213178B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US08213178B2
公开(公告)日：2012-07-03
申请号：US12757057
申请日：2010-04-09
申请人： Ching-Chung Chen , I-Feng Hsu , Chang-Yuan Wu , Jenq-Haur Pan
发明人： Ching-Chung Chen , I-Feng Hsu , Chang-Yuan Wu , Jenq-Haur Pan
IPC分类号： H05K7/20
CPC分类号： H05K7/20145 , G06F1/203
摘要： An electronic device includes a housing, a module, a main board, and a fan. The module, the main board and the fan are all installed in the housing. The main board divides the interior of the housing into a first space and a second space, and there exists a channel opening between the main board and the module so as to communicate the first space with the second space. The fan is electrically connected to the main board, has a fan outlet and is capable of outputting airflow through the fan outlet to the outside of the housing.
摘要翻译：电子设备包括壳体，模块，主板和风扇。模块，主板和风扇都安装在外壳中。主板将壳体的内部分成第一空间和第二空间，并且在主板和模块之间存在通道开口，以将第一空间与第二空间连通。风扇电连接到主板，具有风扇出口，并且能够将通过风扇出口的气流输出到壳体的外部。

5. 发明授权

US08649178B2 Heat dissipation module for electronic apparatus 失效
标题翻译：电子设备散热模块
公开(公告)号：US08649178B2
公开(公告)日：2014-02-11
申请号：US12944727
申请日：2010-11-12
申请人： Ching-Yuan Huang , Chang-Yuan Wu , I-Feng Hsu , Tzu-Chang Chen
发明人： Ching-Yuan Huang , Chang-Yuan Wu , I-Feng Hsu , Tzu-Chang Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/36 , H01L23/427 , H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion and an extending portion. The heat-conducting portion is adhered between the heat-generating structure and the heat dissipation structure. The heat generated by the heat-generating structure is transmitted to the heat dissipation structure through the heat-conducting portion. The extending portion is connected to the heat-conducting portion and exposed to the heat-generating structure and the heat dissipation structure. When the extending portion is forced to move along a direction away from the heat-generating structure and the heat dissipation structure, the heat-conducting portion is deformed to release the adhesion between the heat-conducting portion and the heat-generating structure and the adhesion between the heat-conducting portion and the heat dissipation structure.
摘要翻译：提供了一种用于包括发热结构的电子设备的散热模块。散热模块包括散热结构和导热结构。导热结构包括导热部分和延伸部分。导热部分粘附在发热结构和散热结构之间。由发热结构产生的热量通过导热部分传递到散热结构。延伸部分连接到导热部分并暴露于发热结构和散热结构。当延伸部分被迫沿远离发热结构和散热结构的方向移动时，导热部分变形以释放导热部分和发热结构之间的粘合力和粘附力在导热部分和散热结构之间。

6. 发明申请

US20110116238A1 HEAT DISSIPATION MODULE FOR ELECTRONIC APPARATUS 失效
标题翻译：电子设备散热模块
公开(公告)号：US20110116238A1
公开(公告)日：2011-05-19
申请号：US12944727
申请日：2010-11-12
申请人： Ching-Yuan Huang , Chang-Yuan Wu , I-Feng Hsu , Tzu-Chang Chen
发明人： Ching-Yuan Huang , Chang-Yuan Wu , I-Feng Hsu , Tzu-Chang Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/36 , H01L23/427 , H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion and an extending portion. The heat-conducting portion is adhered between the heat-generating structure and the heat dissipation structure. The heat generated by the heat-generating structure is transmitted to the heat dissipation structure through the heat-conducting portion. The extending portion is connected to the heat-conducting portion and exposed to the heat-generating structure and the heat dissipation structure. When the extending portion is forced to move along a direction away from the heat-generating structure and the heat dissipation structure, the heat-conducting portion is deformed to release the adhesion between the heat-conducting portion and the heat-generating structure and the adhesion between the heat-conducting portion and the heat dissipation structure.
摘要翻译：提供了一种用于包括发热结构的电子设备的散热模块。散热模块包括散热结构和导热结构。导热结构包括导热部分和延伸部分。导热部分粘附在发热结构和散热结构之间。由发热结构产生的热量通过导热部分传递到散热结构。延伸部分连接到导热部分并暴露于发热结构和散热结构。当延伸部分被迫沿远离发热结构和散热结构的方向移动时，导热部分变形以释放导热部分和发热结构之间的粘合力和粘附力在导热部分和散热结构之间。

7. 发明申请

US20180184546A1 ELECTRONIC ASSEMBLY 审中-公开
公开(公告)号：US20180184546A1
公开(公告)日：2018-06-28
申请号：US15808825
申请日：2017-11-09
申请人： Chien-Ming Su , Chang-Yuan Wu , I-Feng Hsu , Jen-Chang Chen
发明人： Chien-Ming Su , Chang-Yuan Wu , I-Feng Hsu , Jen-Chang Chen
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20154 , G06F1/203 , H05K7/20145 , H05K7/2029
摘要： An electronic assembly including a machine body and a docking station is provided. The machine body includes a casing, a heat transfer plate, and a heat dissipation fin set. The casing has a first hole and a second hole. The heat transfer plate and the heat dissipation fin set are disposed in the casing. The heat dissipation fin set includes heat dissipation fins, and a diversion portion of at least one of the heat dissipation fins is aligned to the first hole and the second hole. The docking station includes a body and a fan. The body has a third hole. The fan is disposed in the body. When the machine body is assembled to the docking station, an air flow generated by the fan flows into the casing via the third the first holes, and the air flow is divided into two flows by the diversion portion.

8. 发明授权

US10936028B2 Electronic device having a deformation sensor on a fan module of a fan and using a controller to monitor the deformation sensor and control operation of the fan based on a deformation signal of the sensor 有权
公开(公告)号：US10936028B2
公开(公告)日：2021-03-02
申请号：US15854828
申请日：2017-12-27
申请人： Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
发明人： Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
IPC分类号： G06F1/20 , H05K7/20 , H05K5/00 , F04D27/00 , F04D25/08
摘要： An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.

9. 发明授权

US10091907B2 Electronic assembly 有权
公开(公告)号：US10091907B2
公开(公告)日：2018-10-02
申请号：US15808825
申请日：2017-11-09
申请人： Chien-Ming Su , Chang-Yuan Wu , I-Feng Hsu , Jen-Chang Chen
发明人： Chien-Ming Su , Chang-Yuan Wu , I-Feng Hsu , Jen-Chang Chen
IPC分类号： H05K7/20 , G06F1/20
摘要： An electronic assembly including a machine body and a docking station is provided. The machine body includes a casing, a heat transfer plate, and a heat dissipation fin set. The casing has a first hole and a second hole. The heat transfer plate and the heat dissipation fin set are disposed in the casing. The heat dissipation fin set includes heat dissipation fins, and a diversion portion of at least one of the heat dissipation fins is aligned to the first hole and the second hole. The docking station includes a body and a fan. The body has a third hole. The fan is disposed in the body. When the machine body is assembled to the docking station, an air flow generated by the fan flows into the casing via the third the first holes, and the air flow is divided into two flows by the diversion portion.

10. 发明申请

US20080149321A1 THERMAL MODULE MOUNTED ON CARRIER BY USING MAGNETIC FORCE 审中-公开
标题翻译：通过使用磁力安装在载体上的热模块
公开(公告)号：US20080149321A1
公开(公告)日：2008-06-26
申请号：US11853030
申请日：2007-09-11
申请人： Chi-Wei Tien , Chang-Yuan Wu , Chang-Chiang Shih , Li-Kan Yeh , I-Feng Hsu
发明人： Chi-Wei Tien , Chang-Yuan Wu , Chang-Chiang Shih , Li-Kan Yeh , I-Feng Hsu
IPC分类号： F28F7/00
CPC分类号： F28F9/002 , F28D15/02 , F28F2275/08 , H01L23/40 , H01L23/4006 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A thermal module includes a thermal conductor and at least one first magnetic element. The thermal conductor is disposed above a carrier. In addition, the thermal module may further include at least one second magnetic element or at least one magnetically susceptible element. Either the second magnetic element or the magnetically susceptible element and the first magnetic element can produce magnetic attractive force or magnetic repulsion force therebetween. By such magnetic force, the thermal conductor can be retained with respect to the carrier, thus making contact with a heat generating component.
摘要翻译：热模块包括热导体和至少一个第一磁性元件。热导体设置在载体上方。此外，热模块还可以包括至少一个第二磁性元件或至少一个磁敏元件。第二磁性元件或磁敏元件和第一磁性元件可以产生磁吸引力或其间的磁排斥力。通过这种磁力，热导体可以相对于载体保持，从而与发热部件接触。

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