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1. 发明授权

US07269027B2 Ceramic optical sub-assembly for optoelectronic modules 有权
标题翻译：陶瓷光电子组件用于光电模块
公开(公告)号：US07269027B2
公开(公告)日：2007-09-11
申请号：US11344721
申请日：2006-01-31
申请人： Jia Liu , Luu Thanh Nguyen , Ken Pham , William Paul Mazotti , Bruce Carlton Roberts , Stephen Andrew Gee , John P. Briant
发明人： Jia Liu , Luu Thanh Nguyen , Ken Pham , William Paul Mazotti , Bruce Carlton Roberts , Stephen Andrew Gee , John P. Briant
IPC分类号： H05K7/02
CPC分类号： H01S5/02284 , H01S5/4025
摘要： Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. It is particularly well adapted for use with vertical cavity surface emitting lasers (or laser arrays) and detectors (or detector arrays). In some embodiments, at least the cathode of the photonic device is soldered directly to a cathode pad on the base substrate. Similarly, in some embodiments, the semiconductor chip assembly is electrically connected to the base substrate by direct soldering. Specific base substrate structures are disclosed as well.
摘要翻译：光电子部件，特别是陶瓷光学子组件被描述。在一个方面，光电子部件包括具有一对成角度（或大致垂直）面的陶瓷基底基板。电迹线直接形成在陶瓷表面上并在一对面之间延伸。半导体芯片组件安装在陶瓷基底基板的第一面上，光子器件安装在第二面上。半导体芯片组件和光子器件都与陶瓷基底衬底上的迹线电连接。半导体芯片组件通常被布置成电连接到外部设备。光子器件通常布置成与一根或多根光纤光学通信。所描述的结构可以与各种各样的光子器件一起使用。它特别适用于垂直腔表面发射激光（或激光阵列）和检测器（或检测器阵列）。在一些实施例中，光子器件的至少阴极直接焊接到基底衬底上的阴极焊盘。类似地，在一些实施例中，半导体芯片组件通过直接焊接电连接到基底基板。还公开了特定的基底结构。

2. 发明授权

US07023705B2 Ceramic optical sub-assembly for optoelectronic modules 有权
公开(公告)号：US07023705B2
公开(公告)日：2006-04-04
申请号：US10165711
申请日：2002-06-06
申请人： Jia Liu , Luu Thanh Nguyen , Ken Pham , William Paul Mazotti , Bruce Carlton Roberts , Stephen Andrew Gee , John P. Briant
发明人： Jia Liu , Luu Thanh Nguyen , Ken Pham , William Paul Mazotti , Bruce Carlton Roberts , Stephen Andrew Gee , John P. Briant
IPC分类号： H05K7/02
CPC分类号： H05K1/0219 , G02B6/4201 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121
摘要： Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. It is particularly well adapted for use with vertical cavity surface emitting lasers (or laser arrays) and detectors (or detector arrays). In some embodiments, at least the cathode of the photonic device is soldered directly to a cathode pad on the base substrate. Similarly, in some embodiments, the semiconductor chip assembly is electrically connected to the base substrate by direct soldering. Specific base substrate structures are disclosed as well.

3. 发明授权

US06749345B1 Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards 有权
标题翻译：用于电光封装的装置和方法，其有助于将光缆耦合到印刷电路板
公开(公告)号：US06749345B1
公开(公告)日：2004-06-15
申请号：US10155743
申请日：2002-05-24
申请人： Stephen Andrew Gee , Luu Thanh Nguyen , Ken Pham , Jia Liu , William Paul Mazotti , Bruce Carlton Roberts , Peter Deane
发明人： Stephen Andrew Gee , Luu Thanh Nguyen , Ken Pham , Jia Liu , William Paul Mazotti , Bruce Carlton Roberts , Peter Deane
IPC分类号： G02B638
CPC分类号： G02B6/4277 , G02B6/421 , G02B6/424 , G02B6/425 , G02B6/4261 , G02B6/4269 , G02B6/428 , G02B6/4292
摘要： Electro-optical packages that embed the electronics of the packages directly to the optical cabling, provide short electrical connection paths for high performance, and that provide a robust interconnects. A first electro-optical package includes an integrated circuit and a connector sleeve configured to receive a plug-in optical assembly from the underside of the PC board. The plug-in optical assembly includes a backing piece and an opto-electric device mounted onto the backing piece. An electrical connection is provided between the opto-electric device and a contact location on the backing piece and a contact is provided between the contact location on the backing piece and the integrated circuit. With a second electro-optical package, an integrated circuit having an active surface facing in a first direction and an opto-electric device having contact points facing a second direction are provided. The integrated circuit and the opto-electric are positioned with respect to one another such that a direct electrical connection can be formed between the active surface of the integrated circuit and the contact points of the opto-electrical device.
摘要翻译：将封装的电子元件直接嵌入光缆的电光封装，为高性能提供短的电连接路径，并提供稳健的互连。第一电光学封装包括集成电路和连接器套管，其被配置为从PC板的下侧接收插入式光学组件。插入式光学组件包括背衬片和安装在背衬片上的光电装置。在光电装置和背衬片上的接触位置之间提供电连接，并且在背衬片上的接触位置和集成电路之间提供触点。通过第二电光封装，提供具有面向第一方向的有源表面的集成电路和具有面向第二方向的接触点的光电装置。集成电路和光电相对于彼此定位，使得可以在集成电路的有源表面和光电装置的接触点之间形成直接电连接。

4. 发明授权

US06916121B2 Optical sub-assembly for optoelectronic modules 有权
标题翻译：用于光电子模块的光学子组件
公开(公告)号：US06916121B2
公开(公告)日：2005-07-12
申请号：US10165553
申请日：2002-06-06
申请人： William Paul Mazotti , Peter Deane , Luu Thanh Nguyen , Ken Pham , Bruce Carlton Roberts , Jia Liu , Yongseon Koh , John P. Briant , Roger William Clarke , Michael R. Nelson , Christopher J. Smith , Janet E. Townsend
发明人： William Paul Mazotti , Peter Deane , Luu Thanh Nguyen , Ken Pham , Bruce Carlton Roberts , Jia Liu , Yongseon Koh , John P. Briant , Roger William Clarke , Michael R. Nelson , Christopher J. Smith , Janet E. Townsend
IPC分类号： G02B6/42 , H05K1/02 , H05K1/18 , H05K3/40 , H01L23/12 , H01L23/28
CPC分类号： G02B6/4201 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2924/00014 , H01L2924/00
摘要： Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. In some embodiments the base substrate is formed from a ceramic material having the electrical traces formed thereon. In other implementations the substrate includes a backing block having a flexible printed circuit substrate adhered thereto.
摘要翻译：描述了用于方便地布置用于将电压和电流域的信号传导到红外辐射域的装置的概念。具体地说，描述了光电子元件及其制造方法。在一个方面，光电子部件包括具有一对成角度（或基本上垂直）的表面的基底基板，其间延伸有电迹线。半导体芯片组件安装在基底基板的第一面上，并且光子器件安装在第二面上。半导体芯片组件和光子器件都与基底衬底上的迹线电连接。半导体芯片组件通常被布置成电连接到外部设备。光子器件通常布置成与一根或多根光纤光学通信。所描述的结构可以与各种各样的光子器件一起使用。在一些实施例中，基底由具有形成在其上的电迹线的陶瓷材料形成。在其它实施方式中，基板包括具有粘附到其上的柔性印刷电路基板的背衬块。

5. 发明授权

US07086788B2 Optical sub-assembly for opto-electronic modules 有权
标题翻译：光电子模块的光学子组件
公开(公告)号：US07086788B2
公开(公告)日：2006-08-08
申请号：US11095637
申请日：2005-03-30
申请人： William Paul Mazotti , Peter Deane , Luu Thanh Nguyen , Ken Pham , Bruce Carlton Roberts , Jia Liu , Yongseon Koh , John P. Briant , Roger William Clarke , Michael R. Nelson , Christopher J. Smith , Janet E. Townsend
发明人： William Paul Mazotti , Peter Deane , Luu Thanh Nguyen , Ken Pham , Bruce Carlton Roberts , Jia Liu , Yongseon Koh , John P. Briant , Roger William Clarke , Michael R. Nelson , Christopher J. Smith , Janet E. Townsend
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2924/00014 , H01L2924/00
摘要： Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. In some embodiments the base substrate is formed from a ceramic material having the electrical traces formed thereon. In other implementations the substrate includes a backing block having a flexible printed circuit substrate adhered thereto.
摘要翻译：描述了用于方便地布置用于将电压和电流域的信号传导到红外辐射域的装置的概念。具体地说，描述了光电子元件及其制造方法。在一个方面，光电子部件包括具有一对成角度（或基本上垂直）的表面的基底基板，其间延伸有电迹线。半导体芯片组件安装在基底基板的第一面上，并且光子器件安装在第二面上。半导体芯片组件和光子器件都与基底衬底上的迹线电连接。半导体芯片组件通常被布置成电连接到外部设备。光子器件通常布置成与一根或多根光纤光学通信。所描述的结构可以与各种各样的光子器件一起使用。在一些实施例中，基底由具有形成在其上的电迹线的陶瓷材料形成。在其它实施方式中，基板包括具有粘附到其上的柔性印刷电路基板的背衬块。

6. 发明授权

US07199440B2 Techniques for joining an opto-electronic module to a semiconductor package 有权
标题翻译：将光电模块连接到半导体封装的技术
公开(公告)号：US07199440B2
公开(公告)日：2007-04-03
申请号：US11026749
申请日：2004-12-30
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
IPC分类号： H01L29/84 , H01L31/0232 , H01L23/02 , H01L29/40
CPC分类号： G02B6/4292 , G02B6/3825 , G02B6/3874 , G02B6/3897 , G02B6/4201 , G02B6/4239 , G02B2006/4297 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73207 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00015 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753
摘要： The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.
摘要翻译：本发明提供了一种具有对外部光纤连接的真实裸片的低成本装置。具体而言，本发明涉及与半导体器件封装相连接的光学器件封装。在一些情况下，使用引线键和粘合剂材料连接组合。在其他情况下，使用各向异性导电膜接合组合。然而，在其他情况下，使用焊料材料连接组合。这些连接机构中的每一个提供高水平的热，电和光学性能。连接机构可以应用于收发器，发射器以及光电子封装的接收器中的光学子组件和芯片子组件接口。

7. 发明授权

US06838317B2 Techniques for joining an opto-electronic module to a semiconductor package 有权
标题翻译：将光电模块连接到半导体封装的技术
公开(公告)号：US06838317B2
公开(公告)日：2005-01-04
申请号：US10652805
申请日：2003-08-29
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
IPC分类号： G02B6/38 , G02B6/42 , H01L23/02 , H01L23/498 , H01L25/10 , H05K1/02 , H05K1/18 , H05K3/40 , H01L21/44 , H01L21/00
CPC分类号： G02B6/4292 , G02B6/3825 , G02B6/3874 , G02B6/3897 , G02B6/4201 , G02B6/4239 , G02B2006/4297 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73207 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00015 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753
摘要： The present invention provides a technique for manufacturing a low cost device that provides a true die to external fiber optic connection. Specifically, the present invention relates to several techniques for joining an optical device package to a semiconductor device package. The first technique involves using wirebond studs and an adhesive material, the second technique involves the use of an anisotropic conductive film, and the third technique involves the use of solder material. Each of these techniques provides high levels of thermal, electrical and optical performance. The methods apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.
摘要翻译：本发明提供了一种用于制造向外部光纤连接提供真正的裸片的低成本器件的技术。具体地，本发明涉及将光学器件封装连接到半导体器件封装件的几种技术。第一种技术包括使用引线键和粘合剂材料，第二种技术涉及使用各向异性导电膜，第三种技术涉及使用焊料材料。这些技术中的每一种提供高水平的热，电和光学性能。该方法适用于收发器，发射机以及光电子封装的接收器中的光学子组件和芯片子组件接口。

8. 发明授权

US07247942B2 Techniques for joining an opto-electronic module to a semiconductor package 有权
公开(公告)号：US07247942B2
公开(公告)日：2007-07-24
申请号：US11015247
申请日：2004-12-15
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
IPC分类号： H01L23/12 , H01L23/48 , H01L23/52 , H01L23/495
CPC分类号： G02B6/4292 , G02B6/3825 , G02B6/3874 , G02B6/3897 , G02B6/4201 , G02B6/4239 , G02B2006/4297 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73207 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00015 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753
摘要： The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.

9. 发明申请

US20050117835A1 Techniques for joining an opto-electronic module to a semiconductor package 有权
标题翻译：将光电模块连接到半导体封装的技术
公开(公告)号：US20050117835A1
公开(公告)日：2005-06-02
申请号：US11026749
申请日：2004-12-30
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
IPC分类号： G02B6/38 , G02B6/42 , H01L23/02 , H01L23/498 , H01L25/10 , H05K1/02 , H05K1/18 , H05K3/40 , G02B6/12
CPC分类号： G02B6/4292 , G02B6/3825 , G02B6/3874 , G02B6/3897 , G02B6/4201 , G02B6/4239 , G02B2006/4297 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73207 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00015 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753
摘要： The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.
摘要翻译：本发明提供了一种具有对外部光纤连接的真实裸片的低成本装置。具体而言，本发明涉及与半导体器件封装相连接的光学器件封装。在一些情况下，使用引线键和粘合剂材料连接组合。在其他情况下，使用各向异性导电膜接合组合。然而，在其他情况下，使用焊料材料连接组合。这些连接机构中的每一个提供高水平的热，电和光学性能。连接机构可以应用于收发器，发射器以及光电子封装的接收器中的光学子组件和芯片子组件接口。

10. 发明授权

US06642613B1 Techniques for joining an opto-electronic module to a semiconductor package 有权
标题翻译：将光电模块连接到半导体封装的技术
公开(公告)号：US06642613B1
公开(公告)日：2003-11-04
申请号：US09947210
申请日：2001-09-04
申请人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
发明人： Luu Thanh Nguyen , Ken Pham , Peter Deane , William Paul Mazotti , Bruce Carlton Roberts , Jia Liu
IPC分类号： H01L2302
CPC分类号： G02B6/4292 , G02B6/3825 , G02B6/3874 , G02B6/3897 , G02B6/4201 , G02B6/4239 , G02B2006/4297 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73207 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H05K1/0219 , H05K1/189 , H05K3/403 , H05K2201/0715 , H05K2201/09236 , H05K2201/10121 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00015 , H01L2924/00012 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753
摘要： The present invention provides a technique for manufacturing a low cost device that provides a true die to external fiber optic connection. Specifically, the present invention relates to several techniques for joining an optical device package to a semiconductor device package. The first technique involves using wirebond studs and an adhesive material, the second technique involves the use of an anisotropic conductive film, and the third technique involves the use of solder material. Each of these techniques provides high levels of thermal, electrical and optical performance. The methods apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.
摘要翻译：本发明提供了一种用于制造向外部光纤连接提供真正的裸片的低成本器件的技术。具体地，本发明涉及将光学器件封装连接到半导体器件封装件的几种技术。第一种技术包括使用引线键和粘合剂材料，第二种技术涉及使用各向异性导电膜，第三种技术涉及使用焊料材料。这些技术中的每一种提供高水平的热，电和光学性能。该方法适用于收发器，发射机以及光电子封装的接收器中的光学子组件和芯片子组件接口。

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