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1. 发明申请

US20110228492A1 METHOD OF PREPARING A FLEXIBLE SUBSTRATE ASSEMBLY AND FLEXIBLE SUBSTRATE ASSEMBLY THEREFROM 有权
标题翻译：制造柔性基板组件的方法和柔性基板组装
公开(公告)号：US20110228492A1
公开(公告)日：2011-09-22
申请号：US13118225
申请日：2011-05-27
申请人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
发明人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
IPC分类号： H05K1/00 , H05K1/18 , H05K3/00 , B32B37/02 , B32B37/06 , B32B37/12 , B32B37/14 , B32B38/10 , B32B38/00
CPC分类号： H05K1/0271 , H05K1/0277 , H05K1/0393 , H05K1/181 , H05K3/00 , H05K3/007 , H05K3/281 , H05K2201/0145 , H05K2201/0154 , H05K2201/068 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.
摘要翻译：一些实施例教导了制备柔性基底组件的方法。该方法可以包括：（a）提供载体衬底; （b）提供交联粘合剂; （c）提供塑料基材; 和（d）使用交联粘合剂将载体衬底连接到塑料衬底上。在本申请中公开了其它实施例。

2. 发明申请

US20130271930A1 Method Of Preparing A Flexible Substrate Assembly And Flexible Substrate Assembly Therefrom 有权
标题翻译：制备柔性基板组件和柔性基板组件的方法
公开(公告)号：US20130271930A1
公开(公告)日：2013-10-17
申请号：US13913141
申请日：2013-06-07
申请人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
发明人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
IPC分类号： H05K1/02 , H05K3/00 , H05K1/18
CPC分类号： H05K1/0271 , H05K1/0277 , H05K1/0393 , H05K1/181 , H05K3/00 , H05K3/007 , H05K3/281 , H05K2201/0145 , H05K2201/0154 , H05K2201/068 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.
摘要翻译：一些实施例包括制备柔性基底组件的方法。还公开了相关方法和结构的其它实施方案。

3. 发明授权

US09155190B2 Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom 有权
标题翻译：从其制备柔性基底组件和柔性基底组件的方法
公开(公告)号：US09155190B2
公开(公告)日：2015-10-06
申请号：US13913141
申请日：2013-06-07
申请人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
发明人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
IPC分类号： H05K1/00 , H05K1/02 , H05K3/00 , H05K1/18 , H05K1/03 , H05K3/28
CPC分类号： H05K1/0271 , H05K1/0277 , H05K1/0393 , H05K1/181 , H05K3/00 , H05K3/007 , H05K3/281 , H05K2201/0145 , H05K2201/0154 , H05K2201/068 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.
摘要翻译：一些实施例包括制备柔性基底组件的方法。还公开了相关方法和结构的其它实施方案。

4. 发明授权

US08481859B2 Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom 有权
标题翻译：从其制备柔性基底组件和柔性基底组件的方法
公开(公告)号：US08481859B2
公开(公告)日：2013-07-09
申请号：US13118225
申请日：2011-05-27
申请人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
发明人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H05K1/0277 , H05K1/0393 , H05K1/181 , H05K3/00 , H05K3/007 , H05K3/281 , H05K2201/0145 , H05K2201/0154 , H05K2201/068 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.
摘要翻译：一些实施例教导了制备柔性衬底组件的方法。该方法可以包括：（a）提供载体衬底; （b）提供交联粘合剂; （c）提供塑料基材; 和（d）使用交联粘合剂将载体衬底连接到塑料衬底上。在本申请中公开了其它实施例。

5. 发明授权

US08999778B2 Method of providing a flexible semiconductor device at high temperatures and flexible semiconductor device thereof 有权
标题翻译：在高温下提供柔性半导体器件的方法及其柔性半导体器件
公开(公告)号：US08999778B2
公开(公告)日：2015-04-07
申请号：US13298451
申请日：2011-11-17
申请人： Shawn O'Rourke , Curtis Moyer , Scott Ageno , Dirk Bottesch , Barry O'Brien , Michael Marrs
发明人： Shawn O'Rourke , Curtis Moyer , Scott Ageno , Dirk Bottesch , Barry O'Brien , Michael Marrs
IPC分类号： H01L21/84 , H01L21/683 , H01L29/66 , H01L29/786
CPC分类号： H01L21/6835 , H01L29/66765 , H01L29/78603 , H01L2221/6835 , H01L2924/3025 , H05K1/0393 , H05K3/007 , H05K2201/0145 , H05K2201/0154 , H05K2201/068
摘要： Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180° C.; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.
摘要翻译：一些实施例包括提供半导体器件的方法。该方法可以包括：（a）提供柔性基底; （b）在所述柔性基底上沉积至少一层材料，其中所述至少一层材料在柔性基底上的沉积在至少180℃的温度下发生; 和（c）在金属层和a-Si层之间提供扩散阻挡层。在本申请中公开了其它实施例。

6. 发明申请

US20120061672A1 METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AT HIGH TEMPERATURES AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF 有权
标题翻译：在高温下提供柔性半导体器件的方法及其柔性半导体器件
公开(公告)号：US20120061672A1
公开(公告)日：2012-03-15
申请号：US13298451
申请日：2011-11-17
申请人： Shawn O'Rourke , Curtis Moyer , Scott Ageno , Dirk Bottesch , Barry O'Brien , Michael Marrs
发明人： Shawn O'Rourke , Curtis Moyer , Scott Ageno , Dirk Bottesch , Barry O'Brien , Michael Marrs
IPC分类号： H01L29/16 , H01L21/31 , H01L21/20
CPC分类号： H01L21/6835 , H01L29/66765 , H01L29/78603 , H01L2221/6835 , H01L2924/3025 , H05K1/0393 , H05K3/007 , H05K2201/0145 , H05K2201/0154 , H05K2201/068
摘要： Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180° C.; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.
摘要翻译：一些实施例包括提供半导体器件的方法。该方法可以包括：（a）提供柔性基底; （b）在所述柔性基底上沉积至少一层材料，其中所述至少一层材料在柔性基底上的沉积在至少180℃的温度下发生; 和（c）在金属层和a-Si层之间提供扩散阻挡层。在本申请中公开了其它实施例。

7. 发明申请

US20150348935A1 Method of Temporarily Attaching a Rigid Carrier to a Substrate 审中-公开
标题翻译：将刚性载体暂时附着在基材上的方法
公开(公告)号：US20150348935A1
公开(公告)日：2015-12-03
申请号：US14665514
申请日：2015-03-23
申请人： Shawn O'Rourke
发明人： Shawn O'Rourke
IPC分类号： H01L23/00 , H05K3/38 , H05K3/00
CPC分类号： H01L24/89 , C09J5/06 , C09J2203/326 , C09J2205/302 , C09J2469/00 , H01L21/6835 , H01L23/4985 , H01L2221/68318 , H01L2221/68345 , H01L2221/6835 , H01L2224/80007 , H01L2224/80047 , H01L2224/8085 , H01L2224/80948 , H01L2924/0002 , H05K1/0393 , H05K3/007 , H05K3/386 , H05K2203/016 , H05K2203/083 , H05K2203/085 , H05K2203/1105 , Y10T29/49156
摘要： Method for temporarily attaching a substrates to a rigid carrier is described which includes forming a sacrificial layer of a thermally-decomposable polymer, e.g., poly(alkylene carbonate), and bonding the flexible substrate to the rigid carrier with the sacrificial layer positioned therebetween. Electronic components and/or circuits may then be fabricated or other semiconductor processing steps employed (e.g., backgrinding) on the attached substrate. Once fabrication is completed, the substrate may be detached from the rigid carrier by heating the assembly to decompose the sacrificial layer.
摘要翻译：描述了将基板临时附接到刚性载体的方法，其包括形成可热分解的聚合物（例如聚（碳酸亚烷基酯））的牺牲层，并且将柔性基板结合到刚性载体上，牺牲层位于它们之间。然后可以制造电子元件和/或电路或在所附接的衬底上采用其他半导体处理步骤（例如，背面研磨）。一旦制造完成，可以通过加热组件来分解牺牲层，从而将基板从刚性载体上拆下。

8. 发明授权

US06781056B1 Heater for temperature control integrated in circuit board and method of manufacture 失效
标题翻译：集成在电路板中的温度控制加热器和制造方法
公开(公告)号：US06781056B1
公开(公告)日：2004-08-24
申请号：US10376858
申请日：2003-02-28
申请人： Shawn O'Rourke , Daniel J. Sadler , Marc K. Chason , Manes Eliacin , Claudia V. Gamboa , Robert Terbrueggen , Ke K. Lian
发明人： Shawn O'Rourke , Daniel J. Sadler , Marc K. Chason , Manes Eliacin , Claudia V. Gamboa , Robert Terbrueggen , Ke K. Lian
IPC分类号： H05K103
CPC分类号： H05K1/0212 , H05K1/0298 , H05K1/167 , H05K3/429 , H05K2201/09536 , H05K2203/304
摘要： Circuit boards (1100, 1500, 1600, 1700) and methods for fabricating circuit boards that include heaters for maintaining temperature sensitive components at an operating temperature are provided. Resistive traces (602, 702,704) are included in the circuit boards proximate temperature sensitive apparatus (1004, 1304, 1602, 1712). Thermally conductive patches (802, 902, 904) are interposed between the resistive traces and the temperature sensitive components. The thermally conductive patches establish zones of relatively uniform temperatures. According to a preferred embodiment of the invention the temperature sensitive apparatus comprises a fluid conduit (1004).
摘要翻译：提供电路板（1100,1500,1600,1700）以及用于制造电路板的方法，该电路板包括用于将温度敏感元件保持在工作温度的加热器。电阻迹线（602,702,704）包括在温度敏感设备（1004,1304,1602,1712）附近的电路板中。导热贴片（802,902,904）插在电阻迹线和温度敏感元件之间。导热贴片建立相对均匀温度的区域。根据本发明的优选实施例，温度敏感设备包括流体导管（1004）。

9. 发明授权

US06280656B1 Phosphor and method for the fabrication thereof 失效
标题翻译：荧光体及其制造方法
公开(公告)号：US06280656B1
公开(公告)日：2001-08-28
申请号：US09499800
申请日：2000-02-08
申请人： Shawn O'Rourke , Matthew Stainer , Peter A. Smith
发明人： Shawn O'Rourke , Matthew Stainer , Peter A. Smith
IPC分类号： C09K1102
CPC分类号： C09K11/7784 , C09K11/025 , C09K11/7792 , Y10T428/2991 , Y10T428/2993
摘要： A phosphor includes about 99 dry weight % cathodoluminescent particles, which have a mean particle diameter equal to about 4 microns, and about 1 dry weight % non-cathodoluminescent inorganic particles, which have a mean particle diameter equal to about 20 microns. A method for fabricating phosphor includes the steps of providing an aqueous polyvinyl alcohol solution having about 7.5 weight % polyvinyl alcohol, adding cathodoluminescent particles to the aqueous polyvinyl alcohol solution to provide a cathodoluminescent particle solution having about 16.5 volume % cathodoluminescent particles, and adding non-cathodoluminescent inorganic particles to the cathodoluminescent particle solution to provide a phosphor paste. Non-cathodoluminescent inorganic particles function as dispersants and suspension-stabilizing agents in the phosphor paste.
摘要翻译：磷光体包括约99重量％的平均粒径等于约4微米的阴极发光颗粒和约1重量％的非阴极发光无机颗粒，其平均粒径等于约20微米。制造荧光体包括以下步骤：提供具有约7.5重量％聚乙烯醇的聚乙烯醇水溶液，向聚乙烯醇水溶液中加入阴极发光颗粒以提供具有约16.5体积％阴极发光颗粒的阴极发光颗粒溶液，并加入非阴极发光无机颗粒到阴极发光颗粒溶液中以提供荧光体浆料。非阴极发光无机颗粒在荧光膏中用作分散剂和悬浮稳定剂。

10. 发明授权

US08363201B2 Flexible transparent electrodes via nanowires and sacrificial conductive layer 有权
标题翻译：柔性透明电极经由纳米线和牺牲导电层
公开(公告)号：US08363201B2
公开(公告)日：2013-01-29
申请号：US12522862
申请日：2008-01-18
申请人： Shawn O'Rourke , Pete Smith
发明人： Shawn O'Rourke , Pete Smith
IPC分类号： G02F1/1333
CPC分类号： H01L51/444 , B82Y10/00 , G02F1/133305 , G02F1/13439 , H01B1/04 , H01B1/08 , H01L51/5215 , H01L2251/5338 , H05B33/28 , Y02E10/549 , Y10T428/24926
摘要： A flexible, transparent electrode structure and a method of fabrication thereof are provided comprising a transparent electrode which may maintain electrical connectivity across a surface of a flexible substrate so that the substrate may flex without affecting the integrity of an electrical contact. The transparent electrode includes conductive nanowires that are coupled to the substrate through a conducting oxide layer. The conducting oxide layer effectively provides a template onto which the nanowires are deposited and serves to anchor the nanowires to the substrate surface.
摘要翻译：提供了一种灵活的透明电极结构及其制造方法，其包括透明电极，其可以保持穿过柔性基底的表面的电连接，使得基底可以弯曲而不影响电接触的完整性。透明电极包括通过导电氧化物层耦合到衬底的导电纳米线。导电氧化物层有效地提供了一种模板，纳米线被沉积在该模板上，并用于将纳米线锚固到衬底表面。

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