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1. 发明申请

US20110308739A1 METHOD AND APPARATUS FOR REMOVING A REVERSIBLY MOUNTED DEVICE WAFER FROM A CARRIER SUBSTRATE 有权
标题翻译：用于从载体基板移除可逆安装的装置的方法和装置
公开(公告)号：US20110308739A1
公开(公告)日：2011-12-22
申请号：US12819680
申请日：2010-06-21
申请人： Jeremy W. McCutcheon , Robert D. Brown
发明人： Jeremy W. McCutcheon , Robert D. Brown
IPC分类号： B26D5/42 , B26D3/28
CPC分类号： H01L21/187 , H01L21/67092 , H01L21/6835 , H01L21/68721 , H01L2221/68318 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , Y10S156/93 , Y10S156/941 , Y10T156/1168 , Y10T156/1978 , Y10T156/1989
摘要： New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.
摘要翻译：提供了用于分离由这些方法和装置形成的临时，永久或半永久粘合的基底和物品的新的拆卸方法和装置。这些方法包括从仅在其外周强度结合的载体晶片或基底上拆卸器件晶片。边缘粘合是化学，机械，声学或热软化，溶解或破坏，以允许晶片在非常低的力和在室温或在室温附近在制造过程中的适当阶段容易地分离。还提供了一种用于便于分离键合衬底的夹具。

2. 发明授权

US08852391B2 Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate 有权
标题翻译：从载体衬底去除可逆安装的器件晶片的方法和装置
公开(公告)号：US08852391B2
公开(公告)日：2014-10-07
申请号：US12819680
申请日：2010-06-21
申请人： Jeremy W. McCutcheon , Robert D. Brown
发明人： Jeremy W. McCutcheon , Robert D. Brown
IPC分类号： B32B38/10 , H01L21/683 , H01L21/18 , H01L21/687 , H01L21/67
CPC分类号： H01L21/187 , H01L21/67092 , H01L21/6835 , H01L21/68721 , H01L2221/68318 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , Y10S156/93 , Y10S156/941 , Y10T156/1168 , Y10T156/1978 , Y10T156/1989
摘要： New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.
摘要翻译：提供了用于分离由这些方法和装置形成的临时，永久或半永久粘合的基底和物品的新的拆卸方法和装置。这些方法包括从仅在其外周强度结合的载体晶片或基底上拆卸器件晶片。边缘粘合是化学，机械，声学或热软化，溶解或破坏，以允许晶片在非常低的力和在室温或在室温附近在制造过程中的适当阶段容易地分离。还提供了一种用于便于分离键合衬底的夹具。

3. 发明申请

US20080153405A1 CONTACT PLANARIZATION APPARATUS 有权
标题翻译：联系平面设备
公开(公告)号：US20080153405A1
公开(公告)日：2008-06-26
申请号：US11613898
申请日：2006-12-20
申请人： Jeremy W. McCutcheon , Robert D. Brown
发明人： Jeremy W. McCutcheon , Robert D. Brown
IPC分类号： B24B41/06
CPC分类号： G03F7/168 , H01L21/67092 , H01L21/67115
摘要： A contact planarization apparatus includes a lower membrane assembly, an upper membrane assembly, a differential pressure assembly, and a curing or reflowing assembly. The lower membrane assembly supports a substrate to be planarized and biases it toward the upper membrane assembly under the influence of the pressure differential assembly. The upper membrane assembly planarizes the coating on the substrate under the influence of the differential pressure assembly and includes a flexible sheet which is supported above the substrate stage and below the curing or reflowing assembly via a vacuum force applied by the differential pressure assembly. The differential pressure assembly moves the lower and upper membrane assemblies relative to one another to planarize the coating on the substrate entirely through the application of vacuum and pressure forces. The differential pressure assembly includes atop pressure chamber positioned above the upper face of the upper sheet, a bottom pressure chamber positioned below the lower face of the lower sheet, and a central pressure chamber positioned generally between the lower face of the upper sheet and the upper face of the lower sheet.
摘要翻译：接触平面化装置包括下膜组件，上膜组件，差压组件和固化或回流组件。下膜组件支撑待平坦化的基底，并在压差组件的影响下将其偏向上膜组件。上膜组件在差压组件的影响下平坦化基板上的涂层，并且包括柔性片，其通过由差压组件施加的真空力被支撑在基底台上并在固化或回流组件之下。差压组件相对于彼此移动下部膜组件和上部膜组件，以通过施加真空和压力力使衬底上的涂层完全平坦化。差压组件包括顶部压力室，其位于上板的上表面上方，位于下板的下表面下方的底压室以及通常位于上板的下表面和上板之间的中心压力室下表面。

4. 发明授权

US07775785B2 Contact planarization apparatus 有权
标题翻译：接触平面化装置
公开(公告)号：US07775785B2
公开(公告)日：2010-08-17
申请号：US11613898
申请日：2006-12-20
申请人： Jeremy W. McCutcheon , Robert D. Brown
发明人： Jeremy W. McCutcheon , Robert D. Brown
IPC分类号： B28B1/00 , B29C35/08
CPC分类号： G03F7/168 , H01L21/67092 , H01L21/67115
摘要： A contact planarization apparatus includes a lower membrane assembly, an upper membrane assembly, a differential pressure assembly, and a curing or reflowing assembly. The lower membrane assembly supports a substrate to be planarized and biases it toward the upper membrane assembly under the influence of the pressure differential assembly. The upper membrane assembly planarizes the coating on the substrate under the influence of the differential pressure assembly and includes a flexible sheet which is supported above the substrate stage and below the curing or reflowing assembly via a vacuum force applied by the differential pressure assembly. The differential pressure assembly moves the lower and upper membrane assemblies relative to one another to planarize the coating on the substrate entirely through the application of vacuum and pressure forces. The differential pressure assembly includes atop pressure chamber positioned above the upper face of the upper sheet, a bottom pressure chamber positioned below the lower face of the lower sheet, and a central pressure chamber positioned generally between the lower face of the upper sheet and the upper face of the lower sheet.
摘要翻译：接触平面化装置包括下膜组件，上膜组件，差压组件和固化或回流组件。下膜组件支撑待平坦化的基底，并在压差组件的影响下将其偏向上膜组件。上膜组件在差压组件的影响下平坦化基板上的涂层，并且包括柔性片，其通过由差压组件施加的真空力被支撑在基底台上并在固化或回流组件之下。差压组件相对于彼此移动下部膜组件和上部膜组件，以通过施加真空和压力力使衬底上的涂层完全平坦化。差压组件包括顶部压力室，其位于上板的上表面上方，位于下板的下表面下方的底压室以及通常位于上板的下表面和上板之间的中心压力室下表面。

5. 发明授权

US06598765B2 Disposable syringe dispenser system 失效
标题翻译：一次性注射器分配器系统
公开(公告)号：US06598765B2
公开(公告)日：2003-07-29
申请号：US09928543
申请日：2001-08-13
申请人： Russell T. Pagel , Jeremy W. McCutcheon , Jeffrey L. Kohne
发明人： Russell T. Pagel , Jeremy W. McCutcheon , Jeffrey L. Kohne
IPC分类号： B65D3700
CPC分类号： F16K7/065 , B05C5/0225 , B65D83/0005 , H01L21/6715
摘要： A dispenser (10) for flowable, viscous material (52) includes a housing (12) comprising a main body (18) and door (20), and a reservoir (50) for the material (52) with an elongated, synthetic resin deformable outlet tube (80) presenting an outlet end (82) coupled to the reservoir (50). A flow-controlling assembly (16) including a tube-engaging element (84, 132, 150, 158) and an actuator linkage assembly (86, 130, 144, 154); these components together with a pneumatically operated piston (54) within reservoir (50) allows precise on-off operation of the dispenser (10). In the flow-permitting position, the element (84, 132, 150, 158) is adjacent the tube (80). When it is desired to terminate material flow, the actuator linkage assembly (86, 130, 144, 154) is operated to cause the element (84, 132, 150, 158) to move into deforming engagement with the tube (80) against a backing surface (41); continued movement of the element (84, 132, 150, 158) along the length of the tube (80) in a direction away from outlet end (82) generates a suction force causing material (52) adjacent the end (82) to be drawn into the confines of the tube (80), preventing air-drying of material (52) at end (82).
摘要翻译：用于可流动的粘性材料（52）的分配器（10）包括包括主体（18）和门（20）的壳体（12）和用于材料（52）的储存器（50），其具有细长的合成树脂可变形出口管（80）具有联接到储存器（50）的出口端（82）。包括管接合元件（84,132,150,158）和致动器连杆组件（86,130,144,154）的流动控制组件（16）; 这些部件与储存器（50）内的气动活塞（54）一起允许分配器（10）的精确的开 - 关操作。在流动允许位置，元件（84,132,150,158）与管子（80）相邻。当期望终止材料流动时，致动器连杆组件（86,130,144,154）被操作以使元件（84,132,150,158）移动成与管（80）变形接合，抵抗背面（41）; 元件（84,132,150,158）沿着远离出口端（82）的方向沿着管（80）的长度继续运动，产生一个吸引力，导致邻近端部（82）的材料（52）为被吸入到管（80）的范围内，防止端部（82）处的材料（52）的空气干燥。

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