会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • Miniaturized co-fired electrical interconnects for implantable medical devices
    • 用于可植入医疗器械的小型化共烧电互连
    • US20070060970A1
    • 2007-03-15
    • US11227375
    • 2005-09-15
    • Jeremy BurdonJoyce Yamamoto
    • Jeremy BurdonJoyce Yamamoto
    • A61N1/00
    • A61N1/3754H01L23/10H01L2924/0002H01L2924/01079H01L2924/09701H01L2924/15192H01L2924/16152H01L2924/16251H01L2924/3011H05K1/0306H05K1/115H05K3/4611H05K3/4629H05K2201/09627H05K2201/09709H01L2924/00
    • The invention includes a family of miniaturized, hermetic electrical feedthrough assemblies adapted for implantation within a biological system. An electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device (IMD) such as an implantable pulse generator, cardioverter-defibrillator, physiologic sensor, drug-delivery system and the like. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. Such an assembly is fabricated by interconnected electrical pathways, or vias, of a conductive metallic paste disposed between ceramic green-state material. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one embedded metallization pathway extending through the structure. The metallization pathway reliably conducts electrical signals even when exposed to body fluids and tissue and providing electrical communication between internal IMD circuitry and active electrical components and/or circuitry coupled to the exterior of an IMD.
    • 本发明包括一系列适于植入生物系统的小型化,密封电气馈通组件。 根据本发明的电馈通组件可以用作可植入医疗装置(IMD)的组件,例如可植入脉冲发生器,心律转复除颤器,生理传感器,药物递送系统等。 这样的组件需要在施加的偏置电流或电压下的生物相容性和耐劣化性。 这种组件由布置在陶瓷绿色材料之间的导电金属膏的互连电路或通路制成。 层叠在一起并烧结以形成具有延伸穿过该结构的至少一个嵌入金属化路径的基本上单片的电介质结构。 金属化路径即使暴露于体液和组织也可靠地传导电信号,并提供内部IMD电路与耦合到IMD外部的有源电气部件和/或电路之间的电气通信。
    • 5. 发明申请
    • Implantable co-fired electrical feedthroughs
    • 可植入联合电气馈通
    • US20070060969A1
    • 2007-03-15
    • US11227342
    • 2005-09-15
    • Jeremy BurdonJoyce YamamotoLea NygrenWilliam Wolf
    • Jeremy BurdonJoyce YamamotoLea NygrenWilliam Wolf
    • A61N1/375
    • A61N1/3754A61N1/375H01G9/10
    • The invention includes a family of miniaturized, hermetic electrical feedthrough assemblies adapted for implantation within a biological system. An electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device such as an implantable pulse generator, cardioverter-defibrillator, physiologic sensor, drug-delivery system and the like. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. Such an assembly is fabricated by interconnected electrical pathways, or vias, of a conductive metallic paste disposed between ceramic green-state material. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one embedded metallization pathway extending through the structure. The metallization pathway reliably conducts electrical signals even when exposed to body fluids and tissue and providing reliable electrical communication. After sintering the structure is hermetically diffusion bonded to a part of a ferrule and/or adjacent support member.
    • 本发明包括一系列适于植入生物系统的小型化,密封电气馈通组件。 根据本发明的电馈通组件可以用作可植入医疗装置的组件,例如可植入脉冲发生器,心律转复除颤器,生理传感器,药物递送系统等。 这样的组件需要在施加的偏置电流或电压下的生物相容性和耐劣化性。 这种组件由布置在陶瓷绿色材料之间的导电金属膏的互连电路或通路制成。 层叠在一起并烧结以形成具有延伸穿过该结构的至少一个嵌入金属化路径的基本上单片的电介质结构。 即使暴露于体液和组织并且提供可靠的电通信,金属化路径也可靠地传导电信号。 在烧结之后,结构气密地扩散粘合到套圈和/或相邻的支撑构件的一部分上。