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1. 发明授权

US08373234B2 Semiconductor device and method for forming the same 有权
标题翻译：半导体装置及其形成方法
公开(公告)号：US08373234B2
公开(公告)日：2013-02-12
申请号：US12649637
申请日：2009-12-30
申请人： Jeong Hoon Park , Dong Sauk Kim
发明人： Jeong Hoon Park , Dong Sauk Kim
IPC分类号： H01L21/70
CPC分类号： H01L21/823456 , H01L27/10876 , H01L27/10894 , H01L29/4236
摘要： A semiconductor device includes a structure in which a difference in height between a cell region and a peripheral region are formed so that a buried gate structure of the cell region is substantially equal in height to the gate of the peripheral region, whereby a bit line and a storage node contact can be more easily formed in the cell region and parasitic capacitance can be decreased. The semiconductor device includes a cell region including a gate buried in a substrate, and a peripheral region adjacent to the cell region, where a step height between a surface of the cell and a surface of the peripheral region is generated.
摘要翻译：半导体器件包括其中形成单元区域和外围区域之间的高度差的结构，使得单元区域的掩埋栅极结构的高度与周边区域的栅极高度相等，由此位线可以更容易地在单元区域中形成存储节点接触，并且可以减小寄生电容。半导体器件包括包含埋在衬底中的栅极的单元区域和与单元区域相邻的周边区域，其中生成单元表面和外围区域表面之间的台阶高度。

2. 外观设计

USD496468S1 Low frequency foot stimulating unit 失效
标题翻译：低频脚刺激单位
公开(公告)号：USD496468S1
公开(公告)日：2004-09-21
申请号：US29192618
申请日：2003-10-27
申请人： Jeong Hoon Park
设计人： Jeong Hoon Park

3. 发明授权

US08779561B2 LED backlight unit without printed circuit board and method of manufacturing the same 有权
标题翻译：没有印刷电路板的LED背光单元及其制造方法
公开(公告)号：US08779561B2
公开(公告)日：2014-07-15
申请号：US12779695
申请日：2010-05-13
申请人： Gi Ho Jeong , Si Young Yang , Jae Wook Kwon , Jeong Hoon Park , Hyun Ju Yi , Choon Keun Lee
发明人： Gi Ho Jeong , Si Young Yang , Jae Wook Kwon , Jeong Hoon Park , Hyun Ju Yi , Choon Keun Lee
IPC分类号： H01L23/58
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2924/01019 , H05K1/056 , H05K3/045 , H05K2201/0376 , H05K2201/09036 , H05K2201/10106 , H05K2203/0108 , H05K2203/025 , Y10T29/49158 , Y10T29/49172 , H01L2924/00014
摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.
摘要翻译：本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。绝缘树脂层形成在底座上。电路图案形成在绝缘树脂层上。光源模块安装在绝缘树脂层上并电连接到电路图案。绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

4. 发明授权

US08053804B2 Backlight unit equipped with light emitting diodes 有权
标题翻译：背光单元配有发光二极管
公开(公告)号：US08053804B2
公开(公告)日：2011-11-08
申请号：US12693994
申请日：2010-01-26
申请人： Gi Ho Jeong , Jae Wook Kwon , Dong Jin Kim , Yoon Tak Yang , Hyeong Won Yun , Hyun Ho Lee , Jeong Hoon Park
发明人： Gi Ho Jeong , Jae Wook Kwon , Dong Jin Kim , Yoon Tak Yang , Hyeong Won Yun , Hyun Ho Lee , Jeong Hoon Park
IPC分类号： H01L33/64
CPC分类号： H05K1/0206 , F21K9/00 , G02F1/133603 , G02F2001/133628 , H01L2224/48091 , H05K3/0061 , H05K2201/10106 , H05K2201/10409 , H01L2924/00014
摘要： Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.
摘要翻译：这里公开了配备有LED的背光单元。背光源包括绝缘基板，多个LED封装，上部散热板和下部散热板。绝缘基板设置有预定的电路图案。 LED封装安装在绝缘基板上方，并且电连接到电路图案。上部散热板形成在绝缘基板上，并被配置为与电路图案接触并散热。下部散热板形成在绝缘基板上，构成为透过上部散热板透过的热量。上散热板和下散热板通过至少一个通孔彼此连接，并且通孔和上散热板具有预定的面积比。

5. 发明申请

US20070221942A1 LED backlight unit without printed circuit board and method of manufacturing the same 审中-公开
标题翻译：没有印刷电路板的LED背光单元及其制造方法
公开(公告)号：US20070221942A1
公开(公告)日：2007-09-27
申请号：US11723235
申请日：2007-03-19
申请人： Gi Ho Jeong , Si Young Yang , Jae Wook Kwon , Jeong Hoon Park , Hyun Ju Yi , Choon Keun Lee
发明人： Gi Ho Jeong , Si Young Yang , Jae Wook Kwon , Jeong Hoon Park , Hyun Ju Yi , Choon Keun Lee
IPC分类号： H01L33/00 , H01L29/22
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2924/01019 , H05K1/056 , H05K3/045 , H05K2201/0376 , H05K2201/09036 , H05K2201/10106 , H05K2203/0108 , H05K2203/025 , Y10T29/49158 , Y10T29/49172 , H01L2924/00014
摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.
摘要翻译：本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。绝缘树脂层形成在底座上。电路图案形成在绝缘树脂层上。光源模块安装在绝缘树脂层上并电连接到电路图案。绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

6. 外观设计

USD539914S1 Low frequency foot massage instrument 有权
标题翻译：低频足部按摩器械
公开(公告)号：USD539914S1
公开(公告)日：2007-04-03
申请号：US29252282
申请日：2006-01-20
申请人： Jeong Hoon Park
设计人： Jeong Hoon Park

7. 外观设计

USD511869S1 Beauty appliances washer using ultrasonic waves 失效
标题翻译：美容电器洗衣机使用超声波
公开(公告)号：USD511869S1
公开(公告)日：2005-11-22
申请号：US29212366
申请日：2004-08-31
申请人： Jeong Hoon Park
设计人： Jeong Hoon Park

8. 发明授权

US08330197B2 Semiconductor device having a reduced bit line parasitic capacitance and method for manufacturing the same 有权
标题翻译：具有减小的位线寄生电容的半导体器件及其制造方法
公开(公告)号：US08330197B2
公开(公告)日：2012-12-11
申请号：US12493275
申请日：2009-06-29
申请人： Jeong Hoon Park
发明人： Jeong Hoon Park
IPC分类号： H01L29/94 , H01L27/10
CPC分类号： H01L27/0207 , H01L23/5222 , H01L27/10814 , H01L27/10817 , H01L27/10855 , H01L27/10885 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device having a reduced bit line parasitic capacitance and a method of making same is presented. The semiconductor device includes a first, second, third, and fourth interlayer dielectric layers, first and second bit lines, first and second landing plug and first and second storage node contacts. An optional capacitor may be added to complete a CMOS configuration for the semiconductor device. The storage node contacts traverse through the interlayer dielectric layer and are electrically coupled to their respective landing plug contacts. The storage node contacts are deliberately offset, relative to the center of the corresponding landing plug contacts, at a predetermined distance in a direction away from the first bit line. This offsetting aids reducing the parasitic capacitance between the bit line and a storage node.
摘要翻译：提出了一种具有降低的位线寄生电容的半导体器件及其制造方法。半导体器件包括第一，第二，第三和第四层间电介质层，第一和第二位线，第一和第二着陆插头以及第一和第二存储节点触点。可以添加可选的电容器以完成半导体器件的CMOS配置。存储节点触点穿过层间电介质层并且电耦合到它们各自的着陆插头触头。存储节点触点相对于对应的着陆插头触点的中心在远离第一位线的方向上以预定的距离有意地偏移。该偏移有助于减少位线和存储节点之间的寄生电容。

9. 外观设计

USD630336S1 Foot massage instrument 有权
标题翻译：足部按摩器具
公开(公告)号：USD630336S1
公开(公告)日：2011-01-04
申请号：US29335067
申请日：2009-04-08
申请人： Jeong Hoon Park
设计人： Jeong Hoon Park

10. 发明申请

US20080033229A1 Music-synchronized low frequency stimulator 审中-公开
标题翻译：音乐同步低频刺激器
公开(公告)号：US20080033229A1
公开(公告)日：2008-02-07
申请号：US11484926
申请日：2006-07-12
申请人： Jeong Hoon Park
发明人： Jeong Hoon Park
IPC分类号： A61M21/00
CPC分类号： A61M21/02 , A61M2021/0022 , A61M2021/0027 , A61M2021/0072 , A61M2205/3553 , A61M2205/3584 , A61N1/36014
摘要： A music-synchronized low frequency stimulator is disclosed. In a low frequency stimulator that plays music such as classical music, pop song, folk song, etc. and generates a low frequency electric pulse in synchronization with the music for electrically stimulating and medically treating nerves of a human body, the music-synchronized low frequency stimulator comprises a sound output unit that outputs music such as classical music, pop song, folk song, etc. to a control unit; a control unit that outputs the music and simultaneously samples the music to generate a music-synchronized low frequency signal for stimulating various nerves of a human body; and a low frequency generation unit that generates a music-synchronized low frequency electric pulse in accordance with the control of the control unit.
摘要翻译：公开了一种音乐同步低频刺激器。在播放诸如古典音乐，流行歌曲，民歌等音乐的低频刺激器中，与用于电刺激和医疗治疗人体神经的音乐同步地产生低频电脉冲，音乐同步低音频率刺激器包括输出音乐的声音输出单元，例如古典音乐，流行歌曲，民歌等音乐到控制单元; 控制单元，其输出音乐并同时采样音乐以产生用于刺激人体各种神经的音乐同步低频信号; 以及根据控制单元的控制产生音乐同步的低频电脉冲的低频产生单元。

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