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    • 1. 发明授权
    • Buffer/driver circuits
    • 缓冲/驱动电路
    • US06975134B2
    • 2005-12-13
    • US10821048
    • 2004-04-08
    • Jente B. KuangHung C. NgoKevin J. Nowka
    • Jente B. KuangHung C. NgoKevin J. Nowka
    • H03K17/16H03K19/00H03K19/003H03K19/017
    • H03K19/00361H03K19/0016H03K19/01721
    • A buffer/driver having large output devices for driving multiple loads is configured with three parallel paths. The first logic path is made of small devices and is configured to provide the logic function of the buffer/driver without the ability to drive large loads. Second and third logic paths have the logic function of the first logic path up to the last inverting stage. The last inverting stage in each path is a single device for driving the logic states of the buffer output. The second and third logic paths have power-gating that allows the input to the pull-up and pull-down devices to float removing gate-leakage voltage stress. When the second and third logic paths are power-gated, the first logic path provides a keeper function to hold the logic state of the buffer output. The buffer/driver may be an inverter, non-inverter, or provide a multiple input logic function.
    • 具有用于驱动多个负载的大输出装置的缓冲器/驱动器配置有三个并行路径。 第一个逻辑路径由小型设备组成,并配置为提供缓冲器/驱动器的逻辑功能,而无需驱动大负载。 第二和第三逻辑路径具有直到上一个反相级的第一逻辑路径的逻辑功能。 每个路径中的最后一个反相级是用于驱动缓冲区输出逻辑状态的单个器件。 第二和第三逻辑路径具有电源门控,允许上拉和下拉器件的输入漂移去除栅极泄漏电压应力。 当第二和第三逻辑路径是电源门控时,第一逻辑路径提供保持器功能以保持缓冲器输出的逻辑状态。 缓冲器/驱动器可以是逆变器,非逆变器,或提供多输入逻辑功能。
    • 2. 发明申请
    • TEST STRUCTURE FOR CHARACTERIZING MULTI-PORT STATIC RANDOM ACCESS MEMORY AND REGISTER FILE ARRAYS
    • 表征多端口静态随机访问存储器和寄存器文件阵列的测试结构
    • US20120212997A1
    • 2012-08-23
    • US13459932
    • 2012-04-30
    • Leland ChangJente B. KuangRobert K. MontoyeHung C. NgoKevin J. Nowka
    • Leland ChangJente B. KuangRobert K. MontoyeHung C. NgoKevin J. Nowka
    • G11C29/00
    • G11C8/16G11C29/32G11C29/50G11C29/50012
    • A test structure for characterizing a production static random access memory (SRAM) array. The test structure includes a characterization circuit having multiple memory cell columns connected in series to form a ring configuration. The characterization circuit is fabricated on a wafer substrate in common with and proximate to a production SRAM array. The characterization circuit preferably includes SRAM cells having a circuit topology substantially identical to the circuit topology of memory cells within the production SRAM array. In one embodiment, the test structure is utilized for characterizing a multi-port memory array and includes multiple memory cell columns connected in series to form a ring oscillator characterization circuit. Each cell column in the characterization circuit includes multiple SRAM cells each having a latching node and multiple data path access nodes. Selection control circuitry selectively enables the multiple data path access nodes for the SRAM cells within the characterization circuit.
    • 用于表征生产静态随机存取存储器(SRAM)阵列的测试结构。 测试结构包括具有串联连接的多个存储单元列的表征电路,以形成环形结构。 表征电路在与生产SRAM阵列相同并且靠近生产SRAM阵列的晶片衬底上制造。 表征电路优选地包括具有与生产SRAM阵列内的存储器单元的电路拓扑基本相同的电路拓扑的SRAM单元。 在一个实施例中,测试结构用于表征多端口存储器阵列,并且包括串联连接的多个存储单元列,以形成环形振荡器表征电路。 表征电路中的每个单元列包括多个具有锁存节点和多个数据路径接入节点的SRAM单元。 选择控制电路选择性地启用表征电路内的SRAM单元的多个数据路径接入节点。
    • 3. 发明申请
    • Test Structure for Characterizing Multi-Port Static Random Access Memory and Register File Arrays
    • 用于表征多端口静态随机存取存储器和寄存器文件数组的测试结构
    • US20080155362A1
    • 2008-06-26
    • US11552158
    • 2006-10-24
    • Leland ChangJente B. KuangRobert K. MontoyeHung C. NgoKevin J. Nowka
    • Leland ChangJente B. KuangRobert K. MontoyeHung C. NgoKevin J. Nowka
    • G11C29/00
    • G11C8/16G11C29/32G11C29/50G11C29/50012
    • A test structure for characterizing a production static random access memory (SRAM) array. The test structure includes a characterization circuit having multiple memory cell columns connected in series to form a ring configuration. The characterization circuit is fabricated on a wafer substrate in common with and proximate to a production SRAM array. The characterization circuit preferably includes SRAM cells having a circuit topology substantially identical to the circuit topology of memory cells within the production SRAM array. In one embodiment, the test structure is utilized for characterizing a multi-port memory array and includes multiple memory cell columns connected in series to form a ring oscillator characterization circuit. Each cell column in the characterization circuit includes multiple SRAM cells each having a latching node and multiple data path access nodes. Selection control circuitry selectively enables the multiple data path access nodes for the SRAM cells within the characterization circuit.
    • 用于表征生产静态随机存取存储器(SRAM)阵列的测试结构。 测试结构包括具有串联连接的多个存储单元列的表征电路,以形成环形结构。 表征电路在与生产SRAM阵列相同并且靠近生产SRAM阵列的晶片衬底上制造。 表征电路优选地包括具有与生产SRAM阵列内的存储器单元的电路拓扑基本相同的电路拓扑的SRAM单元。 在一个实施例中,测试结构用于表征多端口存储器阵列,并且包括串联连接的多个存储单元列,以形成环形振荡器表征电路。 表征电路中的每个单元列包括多个具有锁存节点和多个数据路径接入节点的SRAM单元。 选择控制电路选择性地启用表征电路内的SRAM单元的多个数据路径接入节点。
    • 4. 发明授权
    • Power-gating cell for virtual power rail control
    • 用于虚拟电源轨控制的电源门控单元
    • US07276932B2
    • 2007-10-02
    • US10926597
    • 2004-08-26
    • Jente B. KuangJethro C. LawHung C. NgoKevin J. Nowka
    • Jente B. KuangJethro C. LawHung C. NgoKevin J. Nowka
    • H03K19/23
    • H03K19/0016
    • Virtual power-gated cells (VPC) are configured with control circuitry for buffering control signals and a power-gated block (PGB) comprising two or more NFETs for virtual ground rail nodes and PFETs for virtual positive rail nodes. Each VPC has a control voltage input, a control voltage output, a node coupled to a power supply voltage potential, and a virtual power-gated node that is coupled and decoupled from the power supply potential in response to logic states on the control input. The control signals are buffered by non-power-gated inverters before being applied to the input of a PGB. VPCs may propagate a control signal that is in phase with or inverted from a corresponding control signal at the control input. VPCs may be cascaded to create virtual power rails in chains and power grids. The control signals are latched at the cell boundaries or latched in response to a clock signal.
    • 虚拟功率门控单元(VPC)配置有用于缓冲控制信号的控制电路和包括用于虚拟接地轨道节点的两个或更多个NFET的功率门控块(PGB),以及用于虚拟正轨节点的PFET。 每个VPC具有控制电压输入,控制电压输出,耦合到电源电压电位的节点以及响应于控制输入上的逻辑状态与电源电位耦合和去耦合的虚拟电源门控节点。 在施加到PGB的输入之前,控制信号由非电源门控的逆变器进行缓冲。 VPC可以传播与控制输入处的相应控制信号同相或反相的控制信号。 VPC可以级联以在链和电网中创建虚拟电源轨。 控制信号在单元边界被锁存或响应于时钟信号锁存。
    • 5. 发明授权
    • Self limiting gate leakage driver
    • 自限制闸极泄漏驱动器
    • US06980018B2
    • 2005-12-27
    • US10835501
    • 2004-04-29
    • Hung C. NgoJente B. KuangKevin J. Nowka
    • Hung C. NgoJente B. KuangKevin J. Nowka
    • H03K19/003H03K19/017H03K19/094
    • H03K19/01721H03K19/00361
    • A buffer/driver having large output devices for driving multiple loads is configured with three parallel paths. The first logic path is made of small devices and is configured to provide the logic function of the buffer without the ability to drive large loads. Second and third logic paths have the logic function of the first logic path up to the last inverting stage. The last inverting stage in each path is a single device for driving the logic states of the buffer output. The second and third logic paths have power-gating that allows the input to the pull-up and pull-down devices to float removing gate-leakage voltage stress. When the second and third logic paths are power-gated, the first logic path provides a keeper function to hold the logic state of the buffer output. The buffer may be an inverter, non-inverter, or provide a multiple input logic function.
    • 具有用于驱动多个负载的大输出装置的缓冲器/驱动器配置有三个并行路径。 第一个逻辑路径由小型设备组成,并配置为提供缓冲区的逻辑功能,无需驱动大负载。 第二和第三逻辑路径具有直到最后一个反相级的第一逻辑路径的逻辑功能。 每个路径中的最后一个反相级是用于驱动缓冲区输出逻辑状态的单个器件。 第二和第三逻辑路径具有电源门控,允许上拉和下拉器件的输入漂移去除栅极泄漏电压应力。 当第二和第三逻辑路径是电源门控时,第一逻辑路径提供保持器功能以保持缓冲器输出的逻辑状态。 缓冲器可以是逆变器,非逆变器,或提供多输入逻辑功能。
    • 7. 发明授权
    • Low gate-leakage virtual rail circuit
    • 低栅极泄漏虚拟轨道电路
    • US06872991B1
    • 2005-03-29
    • US10840708
    • 2004-05-06
    • Hung C. NgoJente B. KuangKevin J. Nowka
    • Hung C. NgoJente B. KuangKevin J. Nowka
    • H03K19/00H01L27/10H01L29/76H01L29/94H01L31/062H01L31/113
    • H03K19/0016
    • Circuits within a logic domain use partitioned power supply buses. Selected of the power supply buses are coupled to the power supply voltage potentials with electronic switches with gradated conductivity and leakage current. When the circuits are actively switching during a logic operation, the power supply voltage potentials are coupled to the buses with maximum conductivity. At predetermined times later, selected of the electronic switches are switched OFF to reduce leakage current. Lower conductivity and thus lower leakage switches remain ON to ensure corresponding logic states are maintained during a controlled low leakage time period. Various logic configurations are used to switch OFF high leakage devices.
    • 逻辑域内的电路使用分区电源总线。 选择的电源总线通过具有梯度电导率和漏电流的电子开关耦合到电源电压电位。 当电路在逻辑运行期间主动切换时,电源电压电位以最大导电率耦合到总线。 在预定时间后,选择的电子开关被切断以减少漏电流。 较低的电导率和因此较低的漏电开关保持ON,以确保在受控的低泄漏时间段期间保持相应的逻辑状态。 各种逻辑配置用于关闭高泄漏设备。
    • 8. 发明授权
    • Test structure for characterizing multi-port static random access memory and register file arrays
    • 用于表征多端口静态随机存取存储器和寄存器文件阵列的测试结构
    • US08555119B2
    • 2013-10-08
    • US13459932
    • 2012-04-30
    • Leland ChangJente B. KuangRobert K. MontoyeHung C. NgoKevin J. Nowka
    • Leland ChangJente B. KuangRobert K. MontoyeHung C. NgoKevin J. Nowka
    • G11C29/00
    • G11C8/16G11C29/32G11C29/50G11C29/50012
    • A test structure for characterizing a production static random access memory (SRAM) array. The test structure includes a characterization circuit having multiple memory cell columns connected in series to form a ring configuration. The characterization circuit is fabricated on a wafer substrate in common with and proximate to a production SRAM array. The characterization circuit preferably includes SRAM cells having a circuit topology substantially identical to the circuit topology of memory cells within the production SRAM array. In one embodiment, the test structure is utilized for characterizing a multi-port memory array and includes multiple memory cell columns connected in series to form a ring oscillator characterization circuit. Each cell column in the characterization circuit includes multiple SRAM cells each having a latching node and multiple data path access nodes. Selection control circuitry selectively enables the multiple data path access nodes for the SRAM cells within the characterization circuit.
    • 用于表征生产静态随机存取存储器(SRAM)阵列的测试结构。 测试结构包括具有串联连接的多个存储单元列的表征电路,以形成环形结构。 表征电路在与生产SRAM阵列相同并且靠近生产SRAM阵列的晶片衬底上制造。 表征电路优选地包括具有与生产SRAM阵列内的存储器单元的电路拓扑基本相同的电路拓扑的SRAM单元。 在一个实施例中,测试结构用于表征多端口存储器阵列,并且包括串联连接的多个存储单元列,以形成环形振荡器表征电路。 表征电路中的每个单元列包括多个具有锁存节点和多个数据路径接入节点的SRAM单元。 选择控制电路选择性地启用表征电路内的SRAM单元的多个数据路径接入节点。
    • 9. 发明授权
    • Test structure for characterizing multi-port static random access memory and register file arrays
    • 用于表征多端口静态随机存取存储器和寄存器文件阵列的测试结构
    • US08261138B2
    • 2012-09-04
    • US11552158
    • 2006-10-24
    • Leland ChangJente B. KuangRobert K. MontoyeHung C. NgoKevin J. Nowka
    • Leland ChangJente B. KuangRobert K. MontoyeHung C. NgoKevin J. Nowka
    • G11C29/00
    • G11C8/16G11C29/32G11C29/50G11C29/50012
    • A test structure for characterizing a production static random access memory (SRAM) array. The test structure includes a characterization circuit having multiple memory cell columns connected in series to form a ring configuration. The characterization circuit is fabricated on a wafer substrate in common with and proximate to a production SRAM array. The characterization circuit preferably includes SRAM cells having a circuit topology substantially identical to the circuit topology of memory cells within the production SRAM array. In one embodiment, the test structure is utilized for characterizing a multi-port memory array and includes multiple memory cell columns connected in series to form a ring oscillator characterization circuit. Each cell column in the characterization circuit includes multiple SRAM cells each having a latching node and multiple data path access nodes. Selection control circuitry selectively enables the multiple data path access nodes for the SRAM cells within the characterization circuit.
    • 用于表征生产静态随机存取存储器(SRAM)阵列的测试结构。 测试结构包括具有串联连接的多个存储单元列的表征电路,以形成环形结构。 表征电路在与生产SRAM阵列相同并且靠近生产SRAM阵列的晶片衬底上制造。 表征电路优选地包括具有与生产SRAM阵列内的存储器单元的电路拓扑基本相同的电路拓扑的SRAM单元。 在一个实施例中,测试结构用于表征多端口存储器阵列,并且包括串联连接的多个存储单元列,以形成环形振荡器表征电路。 表征电路中的每个单元列包括多个具有锁存节点和多个数据路径接入节点的SRAM单元。 选择控制电路选择性地启用表征电路内的SRAM单元的多个数据路径接入节点。