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    • 4. 发明申请
    • MULTICHAMBER PROCESSING WITH SIMULTANEAOUS WORKPIECE TRANSPORT AND GAS DELIVERY
    • 具有同时工作运输和气体输送的多机加工
    • US20100282413A1
    • 2010-11-11
    • US12842931
    • 2010-07-23
    • Thomas Patrick NolanJeffrey Shane Reiter
    • Thomas Patrick NolanJeffrey Shane Reiter
    • C23F1/00C23C16/00C23C14/34B05C11/00
    • C23C14/568
    • A method for treating/processing substrates/workpieces in a multi-chamber treatment/processing apparatus, comprising: providing a multi-chamber treatment/processing apparatus comprising at least a pair of operatively interconnected upstream and downstream treatment/processing chambers; providing each of the chambers with at least one substrate/workpiece; treating/processing the at least one substrate/workpiece positioned in each of the chambers; evacuating process gas from each of the chambers during or upon completion of the treating/processing of the at least one substrate/workpiece positioned therein; removing the at least one substrate/workpiece from the downstream treatment/processing chamber and initiating transport of the at least one substrate/workpiece from the upstream treatment/processing chamber to the downstream treatment/processing chamber, comprising initiating a flow of the process gas to the evacuated downstream treatment/processing chamber prior to completion of transport of the substrate/workpiece.
    • 一种用于在多室处理/处理设备中处理/处理基板/工件的方法,包括:提供包括至少一对可操作地连接的上游和下游处理/处理室的多室处理/处理设备; 为每个室提供至少一个基板/工件; 处理/处理位于每个室中的至少一个基板/工件; 在处理/处理位于其中的至少一个基板/工件的期间或完成时,从每个室抽空处理气体; 从所述下游处理/处理室移除所述至少一个基板/工件,并且启动所述至少一个基板/工件从所述上游处理/处理室传送到所述下游处理/处理室,包括启动所述工艺气体流 在完成基板/工件的运输之前的抽空的下游处理/处理室。
    • 6. 发明授权
    • Data zone lube removal
    • 数据区润滑油去除
    • US07914845B2
    • 2011-03-29
    • US12179825
    • 2008-07-25
    • Jeffrey Shane Reiter
    • Jeffrey Shane Reiter
    • G11B5/71
    • G11B5/8408
    • A method of manufacturing for providing closer head-to-media spacing, and the resulting disk, includes evenly lubricating a magnetic media disk, increasing the viscosity of a selected non-data zone region of the disk, and removing at least a portion of the lower viscosity region of the lubrication layer in a data zone region of the disk, thereby decreasing the thickness of the lubrication layer in the data zone portion of the lower viscosity region, producing a magnetic media disk capable of closer head-to-media spacing in the data zone portion of the lower viscosity region of the lubrication layer than in the non-data zone portion.
    • 一种制造用于提供更接近的头对媒体间隔的方法,并且所得到的盘包括均匀地润滑磁性介质盘,增加所选择的盘的非数据区域的粘度,并且去除至少一部分 在盘的数据区域中的润滑层的较低粘度区域,从而减小了较低粘度区域的数据区域部分中的润滑层的厚度,从而产生了能够更接近头对媒体间隔的磁性介质盘 润滑层的较低粘度区域的数据区域部分比非数据区域部分的数据区域部分。
    • 8. 发明申请
    • METHOD & APPARATUS FOR MULTI-STAGE SPUTTER DEPOSITION OF UNIFORM THICKNESS LAYERS
    • 均匀厚度层的多阶段溅射沉积方法与装置
    • US20110223445A1
    • 2011-09-15
    • US12882053
    • 2010-09-14
    • Rajiv Yadav RanjanJeffrey Shane ReiterThomas Patrick Nolan
    • Rajiv Yadav RanjanJeffrey Shane ReiterThomas Patrick Nolan
    • G11B5/667
    • G11B5/851C23C14/165C23C14/185C23C14/205C23C14/352C23C14/568
    • A method of forming a uniform thickness layer of a selected material on a surface of a substrate comprises steps of: (a) providing a multi-stage cathode sputtering apparatus comprising a group of spaced-apart cathode/target assemblies and a means for transporting at least one substrate/workpiece past each cathode/target assembly, each cathode/target assembly comprising a sputtering surface oriented substantially parallel to the first surface of the substrate during transport past the group of cathode/target assemblies, the group of cathode/target assemblies adapted for providing different angular sputtered film thickness profiles; and (b) transporting the substrate past each cathode/target assembly while providing different sputtered film thickness profiles from at least some of the cathode/target assemblies, such that a plurality of sub-layers is deposited on the surface of the substrate/workpiece which collectively form a uniform thickness layer of the selected material.
    • 在衬底的表面上形成选定材料的均匀厚度层的方法包括以下步骤:(a)提供多级阴极溅射装置,其包括一组间隔开的阴极/靶组件和用于在 每个阴极/目标组件包括溅射表面,每个阴极/靶组件包括溅射表面,该溅射表面在输送通过阴极/靶组件组之前基本上平行于衬底的第一表面定向,该阴极/靶组件适于 用于提供不同的角溅射膜厚度轮廓; 并且(b)将衬底传送通过每个阴极/靶组件,同时从至少一些阴极/靶组件提供不同的溅射膜厚度分布,使得多个子层沉积在衬底/工件的表面上, 共同形成所选材料的均匀厚度层。