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    • 1. 发明授权
    • Re-partitioning directories
    • 重新分区目录
    • US08037181B2
    • 2011-10-11
    • US10184870
    • 2002-06-28
    • Jeffrey ParhamMark Brown
    • Jeffrey ParhamMark Brown
    • G06F15/173
    • H04L61/1552H04L29/12132H04L67/02H04L67/1002H04L67/1023H04L69/329
    • A new method and framework for re-partitioning directory servers supporting user services in a site that receives access requests from users. According to the present invention, a management server transfers groups of directory objects from original directory servers to newly added directory servers without service interruption to users of the site. The directory objects are stored in categorical groups such that the directory objects in each group share an attribute. According to the present invention, certain groups in the original directory servers are identified for migration to the newly added servers based on a load-balancing scheme. In one embodiment, the identified groups are marked for migration to limit access to the directory objects therein. After successfully being migration, the groups are unmarked and access is resumed. In another embodiment, the management server includes a table storing location information that is updated to indicate successful transfer of the identified group of directory objects from the original server to the newly added server.
    • 一种用于重新分配目录服务器的新方法和框架,支持在用户接收访问请求的站点中的用户服务。 根据本发明,管理服务器将目录对象的组从原始目录服务器传送到新添加的目录服务器,而不会对站点的用户造成中断。 目录对象存储在分类组中,使得每个组中的目录对象共享一个属性。 根据本发明,基于负载平衡方案,识别原始目录服务器中的某些组用于迁移到新添加的服务器。 在一个实施例中,标识的组被标记为用于迁移,以限制对其中的目录对象的访问。 成功迁移后,组将被取消标记,并且恢复访问。 在另一个实施例中,管理服务器包括存储位置信息的表,其被更新以指示所识别的目录对象组从原始服务器到新添加的服务器的成功传送。
    • 3. 发明申请
    • Method for designating communication paths in a network
    • 用于指定网络中的通信路径的方法
    • US20050256879A1
    • 2005-11-17
    • US11043607
    • 2005-01-26
    • Jeffrey ParhamMark BrownWilliam LeesVan VuLaszlo LovaszNicholas HarveyKatalin Vesztergombi
    • Jeffrey ParhamMark BrownWilliam LeesVan VuLaszlo LovaszNicholas HarveyKatalin Vesztergombi
    • H04L12/56G06F17/30
    • H04L45/04H04L45/14H04L45/46
    • A method for designating communication paths in a computer network is provided, in which communication paths are designated for the transmission of data throughout a network. The network may have both recipient computers, which are the intended recipients of the data, and intermediary computers, which are not the intended recipients, but merely relay the data. Each intermediary computer is grouped with the “closest” recipient computer (i.e. the recipient computer with whom it is “least expensive” to communicate). Communication paths between the resulting groups are then identified. A representation of the network is then created. The representation replaces the intermediary computers with the inter-group communication paths, so that the inter-group communication paths appear to pass directly through the locations occupied by the intermediary computers. The created representation is then further processed so that the “least expensive” communication paths may be designated.
    • 提供了一种用于指定计算机网络中的通信路径的方法,其中指定通信路径用于在整个网络中传输数据。 网络可以具有作为数据的预期接收者的接收方计算机和不是预期接收者的中介计算机,而只是中继数据。 每个中间计算机与“最接近”的收件人计算机(即,与之通信的“最便宜”的接收者计算机)分组。 然后识别所得组之间的通信路径。 然后创建网络的表示。 该表示用组间通信路径替换中间计算机,使得组间通信路径似乎直接通过中间计算机占据的位置。 然后进一步处理所创建的表示,使得可以指定“最便宜”的通信路径。
    • 6. 发明授权
    • Method of processing device wafer
    • 处理器件晶圆的方法
    • US08461019B2
    • 2013-06-11
    • US13185942
    • 2011-07-19
    • Devin MartinMark Brown
    • Devin MartinMark Brown
    • H01L21/30H01L21/46
    • H01L21/67132B24B7/228B24B19/022B24B37/042H01L21/67092H01L21/6835H01L23/544H01L2221/68327H01L2221/6834H01L2223/54493H01L2224/13H01L2924/1461H01L2924/00
    • A method of processing a device wafer includes the carrier wafer preparing step of preparing a carrier wafer including an excessive carrier region on a surface thereof which is disposed in a position corresponding to an excessive outer circumferential region on a surface of the device wafer, the recess forming step of forming a recess in the excessive carrier region the carrier wafer, after the recess forming step, the adhesive placing step of placing an adhesive in the recess so as to project from the surface of the carrier wafer, after the adhesive placing step, the wafer bonding step of bonding the surface of the carrier wafer and the surface of the device wafer to each other, thereby securing the device wafer to the carrier wafer with the adhesive, and after the wafer bonding step, the thinning step of thinning the device wafer to a predetermined thickness by grinding or polishing a reverse side of the device wafer.
    • 一种处理器件晶片的方法包括载体晶片准备步骤,其准备载体晶片,该载体晶片在其表面上包括过量的载体区域,该载体晶片设置在与器件晶片的表面上的过度的外周区域相对应的位置, 所述载体晶片在所述凹部形成步骤之后,在所述粘合剂放置步骤之后,将粘合剂放置在所述凹部中以便从所述载体晶片的表面突出的粘合剂放置步骤, 晶片接合步骤,将载体晶片的表面和器件晶片的表面彼此接合,从而将器件晶片用粘合剂固定在载体晶片上,并且在晶片接合步骤之后,使设备变薄的变薄步骤 通过研磨或抛光装置晶片的反面将晶片晶片制成预定的厚度。
    • 7. 发明申请
    • INSULATED PANELS AND SYSTEMS AND METHODS FOR FORMING SEALED INSULATED PANELS
    • 用于形成密封绝缘面板的绝缘面板和系统及方法
    • US20110162307A1
    • 2011-07-07
    • US12832337
    • 2010-07-08
    • Mark BrownKyozaburo Takagi
    • Mark BrownKyozaburo Takagi
    • E04C2/284E04C2/20B23P17/00
    • E04C2/288Y10T29/49629Y10T29/49632
    • Insulated panels and methods of forming insulated panels are provided. According to the method, mold bulkhead and a sealing strip including a first anchor extension, a second anchor extension, and a panel cap are provided. The method also includes removably attaching the exterior face of the sealing strip to the interior mold surface on at least one of the plurality of mold sides, wherein the first anchor extension and the second anchor extension project into the interior mold volume, and wherein the sealing strip defines a sealed insulation zone. A curable building material is introduced into the interior mold volume to form a first slab. The first slab at least partially surrounds the first anchor extension. The method also includes inserting an insulation material layer into the interior mold volume, wherein the insulation material layer is at least partially within the sealed insulation zone. A curable building material is introduced into the interior mold volume adjacent to the insulation material layer to form a second slab. The second slab at least partially surrounds the second anchor extension. The method also includes the step of allowing the curable building material to cure to provide a cured insulated panel, wherein the panel cap defines at least a portion of at least one of the plurality of intermediate faces.
    • 提供绝缘板和形成绝缘板的方法。 根据该方法,提供了模具隔板和包括第一锚固件延伸部,第二锚固件延伸部和面板盖的密封条。 该方法还包括将密封条的外表面可拆卸地连接到多个模具侧面中的至少一个上的内部模具表面,其中第一锚固件延伸部和第二锚固件延伸部伸入内部模具体积中,并且其中密封件 条限定了密封绝缘区。 将可固化建筑材料引入内部模具体积中以形成第一板坯。 第一板坯至少部分地围绕第一锚固件延伸部分。 该方法还包括将绝缘材料层插入内部模具体积中,其中绝缘材料层至少部分地在密封绝缘区域内。 将可固化建筑材料引入与绝缘材料层相邻的内部模具体积中,以形成第二板坯。 第二平板至少部分地围绕第二锚定延伸部。 该方法还包括允许可固化建筑材料固化以提供固化的绝缘板的步骤,其中面板盖限定多个中间面中的至少一个的至少一部分。