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1. 发明授权

US08461019B2 Method of processing device wafer 有权
标题翻译：处理器件晶圆的方法
公开(公告)号：US08461019B2
公开(公告)日：2013-06-11
申请号：US13185942
申请日：2011-07-19
申请人： Devin Martin , Mark Brown
发明人： Devin Martin , Mark Brown
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L21/67132 , B24B7/228 , B24B19/022 , B24B37/042 , H01L21/67092 , H01L21/6835 , H01L23/544 , H01L2221/68327 , H01L2221/6834 , H01L2223/54493 , H01L2224/13 , H01L2924/1461 , H01L2924/00
摘要： A method of processing a device wafer includes the carrier wafer preparing step of preparing a carrier wafer including an excessive carrier region on a surface thereof which is disposed in a position corresponding to an excessive outer circumferential region on a surface of the device wafer, the recess forming step of forming a recess in the excessive carrier region the carrier wafer, after the recess forming step, the adhesive placing step of placing an adhesive in the recess so as to project from the surface of the carrier wafer, after the adhesive placing step, the wafer bonding step of bonding the surface of the carrier wafer and the surface of the device wafer to each other, thereby securing the device wafer to the carrier wafer with the adhesive, and after the wafer bonding step, the thinning step of thinning the device wafer to a predetermined thickness by grinding or polishing a reverse side of the device wafer.
摘要翻译：一种处理器件晶片的方法包括载体晶片准备步骤，其准备载体晶片，该载体晶片在其表面上包括过量的载体区域，该载体晶片设置在与器件晶片的表面上的过度的外周区域相对应的位置，所述载体晶片在所述凹部形成步骤之后，在所述粘合剂放置步骤之后，将粘合剂放置在所述凹部中以便从所述载体晶片的表面突出的粘合剂放置步骤，晶片接合步骤，将载体晶片的表面和器件晶片的表面彼此接合，从而将器件晶片用粘合剂固定在载体晶片上，并且在晶片接合步骤之后，使设备变薄的变薄步骤通过研磨或抛光装置晶片的反面将晶片晶片制成预定的厚度。

2. 发明申请

US20130230966A1 PROCESSING METHOD FOR BUMP-INCLUDED DEVICE WAFER 有权
标题翻译：用于封装的器件滤波器的处理方法
公开(公告)号：US20130230966A1
公开(公告)日：2013-09-05
申请号：US13410794
申请日：2012-03-02
申请人： Devin Martin , Mark Brown
发明人： Devin Martin , Mark Brown
IPC分类号： H01L21/78
CPC分类号： H01L21/67092
摘要： A processing method for a bump-included device wafer which includes an adhesive providing step of providing an adhesive in an annular groove of a carrier wafer so that the adhesive projects from the upper surface of an annular projection of the carrier wafer; a wafer attaching step of attaching and fixing the front side of the device wafer through the adhesive to the front side of the carrier wafer so as to accommodate bumps in a recess of the carrier wafer after performing the adhesive providing step; and a thickness reducing step of grinding or polishing the back side of the device wafer to reduce the thickness of the device wafer to a predetermined thickness after performing the wafer attaching step.
摘要翻译：一种凸起包括器件晶片的处理方法，包括：粘合剂提供步骤，在载体晶片的环形槽中提供粘合剂，使得粘合剂从载体晶片的环形突起的上表面突出; 晶片安装步骤，通过所述粘合剂将所述器件晶片的前侧附着并固定到所述载体晶片的前侧，以便在执行所述粘合剂提供步骤之后容纳所述载体晶片的凹部中的凸起; 以及在进行晶片安装步骤之后，研磨或抛光器件晶片的背面的厚度减小步骤，以将器件晶片的厚度减小到预定厚度。

3. 发明申请

US20130023107A1 METHOD OF PROCESSING DEVICE WAFER 有权
标题翻译：处理器件波形的方法
公开(公告)号：US20130023107A1
公开(公告)日：2013-01-24
申请号：US13185942
申请日：2011-07-19
申请人： Devin Martin , Mark Brown
发明人： Devin Martin , Mark Brown
IPC分类号： H01L21/304
CPC分类号： H01L21/67132 , B24B7/228 , B24B19/022 , B24B37/042 , H01L21/67092 , H01L21/6835 , H01L23/544 , H01L2221/68327 , H01L2221/6834 , H01L2223/54493 , H01L2224/13 , H01L2924/1461 , H01L2924/00
摘要： A method of processing a device wafer includes the carrier wafer preparing step of preparing a carrier wafer including an excessive carrier region on a surface thereof which is disposed in a position corresponding to an excessive outer circumferential region on a surface of the device wafer, the recess forming step of forming a recess in the excessive carrier region the carrier wafer, after the recess forming step, the adhesive placing step of placing an adhesive in the recess so as to project from the surface of the carrier wafer, after the adhesive placing step, the wafer bonding step of bonding the surface of the carrier wafer and the surface of the device wafer to each other, thereby securing the device wafer to the carrier wafer with the adhesive, and after the wafer bonding step, the thinning step of thinning the device wafer to a predetermined thickness by grinding or polishing a reverse side of the device wafer.
摘要翻译：一种处理器件晶片的方法包括载体晶片准备步骤，其准备载体晶片，该载体晶片在其表面上包括过量的载体区域，该载体晶片设置在与器件晶片的表面上的过度的外周区域相对应的位置，所述载体晶片在所述凹部形成步骤之后，在所述粘合剂放置步骤之后，将粘合剂放置在所述凹部中以便从所述载体晶片的表面突出的粘合剂放置步骤，晶片接合步骤，将载体晶片的表面和器件晶片的表面彼此接合，从而将器件晶片用粘合剂固定在载体晶片上，并且在晶片接合步骤之后，使设备变薄的变薄步骤通过研磨或抛光装置晶片的反面将晶片晶片制成预定的厚度。

4. 发明授权

US08580655B2 Processing method for bump-included device wafer 有权
标题翻译：具有凸块的器件晶片的处理方法
公开(公告)号：US08580655B2
公开(公告)日：2013-11-12
申请号：US13410794
申请日：2012-03-02
申请人： Devin Martin , Mark Brown
发明人： Devin Martin , Mark Brown
IPC分类号： H01L21/46
CPC分类号： H01L21/67092
摘要： A processing method for a bump-included device wafer which includes an adhesive providing step of providing an adhesive in an annular groove of a carrier wafer so that the adhesive projects from the upper surface of an annular projection of the carrier wafer; a wafer attaching step of attaching and fixing the front side of the device wafer through the adhesive to the front side of the carrier wafer so as to accommodate bumps in a recess of the carrier wafer after performing the adhesive providing step; and a thickness reducing step of grinding or polishing the back side of the device wafer to reduce the thickness of the device wafer to a predetermined thickness after performing the wafer attaching step.
摘要翻译：一种凸起包括器件晶片的处理方法，包括：粘合剂提供步骤，在载体晶片的环形槽中提供粘合剂，使得粘合剂从载体晶片的环形突起的上表面突出; 晶片安装步骤，通过所述粘合剂将所述器件晶片的前侧附着并固定到所述载体晶片的前侧，以便在执行所述粘合剂提供步骤之后容纳所述载体晶片的凹部中的凸起; 以及在进行晶片安装步骤之后，研磨或抛光器件晶片的背面的厚度减小步骤，以将器件晶片的厚度减小到预定厚度。

5. 发明授权

US08869962B2 Wheel spindle drive element 有权
标题翻译：车轮主轴驱动元件
公开(公告)号：US08869962B2
公开(公告)日：2014-10-28
申请号：US13237555
申请日：2011-09-20
申请人： Mark Brown
发明人： Mark Brown
IPC分类号： F16D11/10 , F16D1/072 , F16D11/14
CPC分类号： F16D1/072 , F16D11/10 , F16D11/14 , Y10T29/49465 , Y10T29/49826
摘要： A wheel spindle drive element for a wheel disconnect system. The wheel spindle assembling onto an outer diameter of a spindle, displacing material to form a joint with high torque transmission characteristics.
摘要翻译：用于车轮分离系统的车轮主轴驱动元件。车轮主轴组装在主轴的外径上，使材料移动以形成具有高转矩传递特性的接头。

6. 发明授权

US08663974B2 Compositions and methods for capture and elution of biological materials via particulates 有权
标题翻译：通过微粒捕获和洗脱生物材料的组合物和方法
公开(公告)号：US08663974B2
公开(公告)日：2014-03-04
申请号：US13336932
申请日：2011-12-23
申请人： Mark Brown , Robert Doebler , Bruce Irvine , Tanya Ferguson , Gary Blackburn
发明人： Mark Brown , Robert Doebler , Bruce Irvine , Tanya Ferguson , Gary Blackburn
IPC分类号： C12M1/00 , C12Q1/00 , C12Q1/68 , C12Q1/02
CPC分类号： C12N1/06 , B01L3/563 , B01L3/567 , C12M47/06 , G01N33/54313 , G01N2001/2866 , G01N2001/4088
摘要： Lysing may include agitating a specimen in a chamber along with a medium that includes a particulate lysing material that has an affinity for a biological material. Lysing material may include beads or other material which may be coated that facilitates binding. The medium may include a fluid with a high salt or low pH level. Binding of biological materials to solid surfaces may be induced by particular media. The biological material may be eluted by lowering a concentration of salt or increasing a pH level. Lysing materials with two or more different affinities may be employed. Lysing materials may include particles of different sizes. Heating may be used. Lysing may be performed in a flow through apparatus. Surfaces of solid materials may be modified to capture bacteria with high cell wall lipid content.
摘要翻译：裂解可以包括在室中搅拌样品以及包含对生物材料具有亲和力的颗粒裂解材料的培养基。裂解材料可以包括可以被涂覆的珠或其它材料，其有助于结合。介质可以包括具有高盐或低pH水平的流体。生物材料与固体表面的结合可以由特定的介质诱导。可以通过降低盐的浓度或增加pH水平来洗脱生物材料。可以采用具有两种或更多种不同亲和力的裂解材料。裂解材料可以包括不同尺寸的颗粒。可以使用加热。裂解可以在流过设备中进行。可以修饰固体材料的表面以捕获具有高细胞壁脂质含量的细菌。

7. 发明授权

US08037181B2 Re-partitioning directories 有权
标题翻译：重新分区目录
公开(公告)号：US08037181B2
公开(公告)日：2011-10-11
申请号：US10184870
申请日：2002-06-28
申请人： Jeffrey Parham , Mark Brown
发明人： Jeffrey Parham , Mark Brown
IPC分类号： G06F15/173
CPC分类号： H04L61/1552 , H04L29/12132 , H04L67/02 , H04L67/1002 , H04L67/1023 , H04L69/329
摘要： A new method and framework for re-partitioning directory servers supporting user services in a site that receives access requests from users. According to the present invention, a management server transfers groups of directory objects from original directory servers to newly added directory servers without service interruption to users of the site. The directory objects are stored in categorical groups such that the directory objects in each group share an attribute. According to the present invention, certain groups in the original directory servers are identified for migration to the newly added servers based on a load-balancing scheme. In one embodiment, the identified groups are marked for migration to limit access to the directory objects therein. After successfully being migration, the groups are unmarked and access is resumed. In another embodiment, the management server includes a table storing location information that is updated to indicate successful transfer of the identified group of directory objects from the original server to the newly added server.
摘要翻译：一种用于重新分配目录服务器的新方法和框架，支持在用户接收访问请求的站点中的用户服务。根据本发明，管理服务器将目录对象的组从原始目录服务器传送到新添加的目录服务器，而不会对站点的用户造成中断。目录对象存储在分类组中，使得每个组中的目录对象共享一个属性。根据本发明，基于负载平衡方案，识别原始目录服务器中的某些组用于迁移到新添加的服务器。在一个实施例中，标识的组被标记为用于迁移，以限制对其中的目录对象的访问。成功迁移后，组将被取消标记，并且恢复访问。在另一个实施例中，管理服务器包括存储位置信息的表，其被更新以指示所识别的目录对象组从原始服务器到新添加的服务器的成功传送。

8. 发明申请

US20110162307A1 INSULATED PANELS AND SYSTEMS AND METHODS FOR FORMING SEALED INSULATED PANELS 有权
标题翻译：用于形成密封绝缘面板的绝缘面板和系统及方法
公开(公告)号：US20110162307A1
公开(公告)日：2011-07-07
申请号：US12832337
申请日：2010-07-08
申请人： Mark Brown , Kyozaburo Takagi
发明人： Mark Brown , Kyozaburo Takagi
IPC分类号： E04C2/284 , E04C2/20 , B23P17/00
CPC分类号： E04C2/288 , Y10T29/49629 , Y10T29/49632
摘要： Insulated panels and methods of forming insulated panels are provided. According to the method, mold bulkhead and a sealing strip including a first anchor extension, a second anchor extension, and a panel cap are provided. The method also includes removably attaching the exterior face of the sealing strip to the interior mold surface on at least one of the plurality of mold sides, wherein the first anchor extension and the second anchor extension project into the interior mold volume, and wherein the sealing strip defines a sealed insulation zone. A curable building material is introduced into the interior mold volume to form a first slab. The first slab at least partially surrounds the first anchor extension. The method also includes inserting an insulation material layer into the interior mold volume, wherein the insulation material layer is at least partially within the sealed insulation zone. A curable building material is introduced into the interior mold volume adjacent to the insulation material layer to form a second slab. The second slab at least partially surrounds the second anchor extension. The method also includes the step of allowing the curable building material to cure to provide a cured insulated panel, wherein the panel cap defines at least a portion of at least one of the plurality of intermediate faces.
摘要翻译：提供绝缘板和形成绝缘板的方法。根据该方法，提供了模具隔板和包括第一锚固件延伸部，第二锚固件延伸部和面板盖的密封条。该方法还包括将密封条的外表面可拆卸地连接到多个模具侧面中的至少一个上的内部模具表面，其中第一锚固件延伸部和第二锚固件延伸部伸入内部模具体积中，并且其中密封件条限定了密封绝缘区。将可固化建筑材料引入内部模具体积中以形成第一板坯。第一板坯至少部分地围绕第一锚固件延伸部分。该方法还包括将绝缘材料层插入内部模具体积中，其中绝缘材料层至少部分地在密封绝缘区域内。将可固化建筑材料引入与绝缘材料层相邻的内部模具体积中，以形成第二板坯。第二平板至少部分地围绕第二锚定延伸部。该方法还包括允许可固化建筑材料固化以提供固化的绝缘板的步骤，其中面板盖限定多个中间面中的至少一个的至少一部分。

9. 发明授权

US07946017B2 Integrated hinge and temporary door checker 失效
标题翻译：综合铰链和临时门检查
公开(公告)号：US07946017B2
公开(公告)日：2011-05-24
申请号：US12749201
申请日：2010-03-29
申请人： Mark Brown , Marc Iman , Cindy Tran , James Ritchie , Takahiro Ohno , Takashi Ogawa , Takeshi Ishikawa
发明人： Mark Brown , Marc Iman , Cindy Tran , James Ritchie , Takahiro Ohno , Takashi Ogawa , Takeshi Ishikawa
IPC分类号： B23P19/00
CPC分类号： E05D11/1042 , E05F1/1238 , E05Y2900/531 , Y10T16/5383 , Y10T16/540257 , Y10T16/54028 , Y10T16/54029 , Y10T16/625 , Y10T16/6295 , Y10T29/49815 , Y10T29/49824 , Y10T29/49826
摘要： A temporary checking device is provided that works in conjunction with elements of a vehicle hinge that remain in the vehicle's final configuration. The hinge includes a hinge pin rotatably connecting a door hinge bracket to a pillar hinge bracket. The checking device includes a spring portion that is disposed between the door hinge bracket and the pillar hinge bracket. The spring portion is compressed during movement of the door hinge bracket relative to the pillar hinge bracket from either of two rest positions. The spring portion urges the vehicle door affixed thereto back into one of the rest positions, thus allowing manufacturing operations such as painting, etc., to be performed on the vehicle.
摘要翻译：提供临时检查装置，其与保持在车辆最终配置中的车辆铰链的元件一起工作。铰链包括将门铰链支架可旋转地连接到支柱铰链支架的铰链销。检查装置包括设置在门铰链支架和支柱铰链支架之间的弹簧部分。在门铰链支架相对于支柱铰链支架从两个静止位置中的任一个移动期间，弹簧部分被压缩。弹簧部分促使车门被固定回到其中一个休息位置，从而允许在车辆上执行诸如喷漆等的制造操作。

10. 发明授权

US07585013B2 Integrated hinge and temporary door checker 有权
标题翻译：综合铰链和临时门检查
公开(公告)号：US07585013B2
公开(公告)日：2009-09-08
申请号：US12234092
申请日：2008-09-19
申请人： Mark Brown , Marc Iman , Cindy Tran , James Ritchie , Ohno Takahiro , Ogawa Takashi , Ishikawa Takeshi
发明人： Mark Brown , Marc Iman , Cindy Tran , James Ritchie , Ohno Takahiro , Ogawa Takashi , Ishikawa Takeshi
IPC分类号： B60J5/00
CPC分类号： E05D11/1042 , E05F1/1238 , E05Y2900/531 , Y10T16/5383 , Y10T16/540257 , Y10T16/54028 , Y10T16/54029 , Y10T16/625 , Y10T16/6295 , Y10T29/49815 , Y10T29/49824 , Y10T29/49826
摘要： A temporary checking device is provided that works in conjunction with elements of a vehicle hinge that remain in the vehicle's final configuration. The hinge includes a hinge pin rotatably connecting a door hinge bracket to a pillar hinge bracket. The checking device includes a spring portion that is disposed between the door hinge bracket and the pillar hinge bracket. The spring portion is compressed during movement of the door hinge bracket relative to the pillar hinge bracket from either of two rest positions. The spring portion urges the vehicle door affixed thereto back into one of the rest positions, thus allowing manufacturing operations such as painting, etc., to be performed on the vehicle.
摘要翻译：提供临时检查装置，其与保持在车辆最终配置中的车辆铰链的元件一起工作。铰链包括将门铰链支架可旋转地连接到支柱铰链支架的铰链销。检查装置包括设置在门铰链支架和支柱铰链支架之间的弹簧部分。在门铰链支架相对于支柱铰链支架从两个静止位置中的任一个移动期间，弹簧部分被压缩。弹簧部分促使车门被固定回到其中一个休息位置，从而允许在车辆上执行诸如喷漆等的制造操作。

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