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    • 6. 发明授权
    • Telechelic polymers and heterotelechelic polydiene block polymers with
dual cure systems
    • 具有双重固化体系的远端聚合物和异丙烯基聚二烯嵌段聚合物
    • US5576388A
    • 1996-11-19
    • US519885
    • 1995-08-28
    • David J. St. ClairJames R. Erickson
    • David J. St. ClairJames R. Erickson
    • C09K3/10C08G18/62C08G18/69C08G59/18C08G59/34C08J3/24C08L53/00C09J4/06C09J119/00C09J153/00C09J161/34C09J163/00C09J163/08C09J175/04C09J201/02C08L53/02C08L33/08C08L67/02
    • C08G59/027C08G18/6208C08G18/69C08G18/698C08G59/18C08J3/243C09J119/006C09J163/00C09J163/08C09J175/04C09J4/06C08G2170/40C08G2190/00
    • Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality. The dual curing system preferably is comprised of an isocyanate curing agent to cure through the hydroxyl groups at ambient temperatures to form a pressure sensitive adhesive or sealant and an amino resin to cure through the epoxy functionality upon baking to form a structural adhesive or sealant.
    • 压敏结构粘合剂和密封剂组合物,其包含:(a)包含95至15重量%的遥爪聚合物和5至85重量%的异丙炔基聚合物的聚合物体系,其中至少一个其上的官能团相同 作为遥爪聚合物上的功能,和(b)双重固化系统,其中固化体系的一个元素固化遥爪聚合物,并且杂多聚乙烯聚合物上的共同官能团固化,而另一个元素固化在异极性聚合物上的功能,但不固化 在固化遥爪聚合物以形成结构粘合剂或密封剂组合物所需的条件下。 在一个优选的实施方案中,聚合物体系由羟基官能的遥爪二醇或多元醇聚合物组成,并且所述聚异戊烯聚合物是也具有环氧化烯烃官能团的单羟基化聚二烯烃聚合物。 双重固化体系优选由异氰酸酯固化剂组成,以在环境温度下固化通过羟基,以形成压敏粘合剂或密封剂和氨基树脂,以在烘烤时通过环氧官能团固化以形成结构粘合剂或密封剂。
    • 10. 发明授权
    • Epoxidized viscous conjugated diene block copolymers
    • 环氧粘度共轭二烯嵌段共聚物
    • US5229464A
    • 1993-07-20
    • US692839
    • 1991-04-29
    • James R. EricksonDavid J. St. Clair
    • James R. EricksonDavid J. St. Clair
    • C08F8/08C08F297/04C08G59/34C08J3/28C08L63/08C09D153/02C09J153/02
    • C08G59/027C08F297/044C08F8/04C08F8/08C08J3/28C08L63/08C09D153/025C09J153/025C08F2800/10C08F2810/20C08J2353/00
    • A viscous block copolymer of the formula(A--B--A).sub.n --Y.sub.r --(A.sub.q --B).sub.mwherein Y is a coupling agent or coupling monomers, andwherein A and B are polymer blocks which may be homopolymer blocks of conjugated diolefin monomers, copolymer blocks of conjugated diolefin monomer or copolymer blocks of conjugated diolefin monomers and monoalkenyl aromatic hydrocarbon monomers, andwherein the A blocks have a higher number of aliphatic double bonds between a tertiary carbon atom and either a primary or secondary carbon atom per unit of block mass than do the B blocks, andwherein the A blocks have a molecular weight from about 100 to about 3000 and the B blocks have a molecular weight from about 1000 to about 15,000, andwherein p and q are 0 or 1 and n>0, r is 0 or 1, m.gtoreq.0 and n+m ranges from 1 to 100.This block copolymer is preferably partially hydrogenated, epoxidized and crosslinked through at least some of the epoxy functionality to form an adhesive, coating or sealant composition.
    • 式(ABA)n-Yr-(Aq-B)m的粘性嵌段共聚物,其中Y是偶联剂或偶联单体,其中A和B是可以是共轭二烯烃单体的均聚物嵌段的聚合物嵌段,共聚物嵌段 的共轭二烯单体或共轭二烯烃单体和单链烯基芳族烃单体的共聚物嵌段,其中A嵌段在叔碳原子和每单位嵌段质量的伯或仲碳原子之间具有更高数量的脂族双键 B嵌段,其中A嵌段的分子量为约100至约3000,B嵌段的分子量为约1000至约15,000,并且其中p和q为0或1且n> 0,r为 0或1,m≥0和n + m的范围为1至100.该嵌段共聚物优选部分氢化,环氧化并通过至少一些环氧官能团交联以形成粘合剂,涂料或密封剂组合物。