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1. 发明公开

US20240141095A1 CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE 审中-公开
公开(公告)号：US20240141095A1
公开(公告)日：2024-05-02
申请号：US18547092
申请日：2022-02-08
申请人： ADEKA CORPORATION
发明人： Keisuke OTA , Kohei HIRAYAMA , Ryo OGAWA , Shinsuke YAMADA
IPC分类号： C08G59/24 , C08G59/32 , C08G59/34 , C08G59/50 , C08G59/56 , C08K3/36 , C08K5/5419 , C08L61/14 , C09J163/08
CPC分类号： C08G59/245 , C08G59/3227 , C08G59/34 , C08G59/502 , C08G59/56 , C08K3/36 , C08K5/5419 , C08L61/14 , C09J163/08 , C08K2201/005 , C08L2205/025 , C08L2205/035
摘要： Disclosed is a curable resin composition containing: (A) a cyanate ester resin; (B) an epoxy resin essentially including at least a 4-amino-3-methylphenol-type epoxy resin; and (C) a latent curing agent. Preferably, the cyanate ester resin (A) is at least one selected from the group consisting of compounds represented by formula (1) below, compounds represented by formula (2) below, and at least one of polymer of these compounds. Formula (1): NC—O-A1-Y1-A2-O—CN (See the Description for the symbols in the formula). Formula (2): (See the Description for the symbols in the formula).

2. 发明申请

US20180079939A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND UNDERFILL FILM 审中-公开
公开(公告)号：US20180079939A1
公开(公告)日：2018-03-22
申请号：US15532931
申请日：2016-02-05
申请人： DEXERIALS CORPORATION
发明人： Kenji KUBOTA , Takayuki SAITO
IPC分类号： C09J163/08 , C09J7/00 , C09J133/16 , H01L23/00 , H01L21/56 , H01L23/29 , H01L23/31
CPC分类号： C09J163/08 , C08G59/42 , C09J7/00 , C09J133/04 , C09J133/16 , C09J163/00 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01L21/563 , H01L23/293 , H01L23/3157 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16148 , H01L2224/16238 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75252 , H01L2224/7598 , H01L2224/75981 , H01L2224/81005 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/81907 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/83907 , H01L2224/92 , H01L2224/9211 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06568 , H01L2924/0665 , H01L2924/18161 , H01L2924/364 , H01L2924/384 , C08K5/18 , C08L33/08 , H01L2224/81 , H01L2224/83 , H01L2924/095 , H01L2924/0635 , H01L2924/01083 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/01051 , H01L2224/27 , H01L2224/11 , H01L21/78 , H01L2924/00012 , H01L2924/00014
摘要： A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/° C. from a temperature 10° C. higher than a minimum melt viscosity attainment temperature to a temperature 10° C. higher than the temperature.

3. 发明申请

US20160121654A1 LAMINATE, INNER LINER MATERIAL AND PNEUMATIC TIRE 审中-公开
标题翻译：层压板，内衬材料和气动轮胎
公开(公告)号：US20160121654A1
公开(公告)日：2016-05-05
申请号：US14893272
申请日：2014-06-03
申请人： THE YOKOHAMA RUBBER CO., LTD.
发明人： Hirokazu Shibata
IPC分类号： B60C1/00 , B32B27/32 , B32B27/34 , B32B27/30 , B32B25/08 , B32B25/16
CPC分类号： B60C1/0008 , B32B7/12 , B32B25/08 , B32B25/16 , B32B27/302 , B32B27/306 , B32B27/308 , B32B27/32 , B32B27/34 , B32B2274/00 , B60C5/14 , B60C2005/145 , C08C19/06 , C08K5/09 , C08L9/00 , C08L15/00 , C08L63/08 , C09J163/08
摘要： With respect to a laminate of a film formed of a thermoplastic resin or thermoplastic elastomer composition and a layer formed of a rubber composition in which an epoxidized natural rubber is blended, the adhesion between the film and the layer of the rubber composition is improved without using a large amount of the epoxidized natural rubber. A laminate of a film formed of a thermoplastic resin or thermoplastic elastomer composition and a layer formed of a rubber composition, said laminate being characterized in that: 5-60% by mass of a rubber component contained in the rubber composition is composed of an epoxidized natural rubber and 20-50% by mass of the rubber component is composed of a butadiene rubber; and the rubber composition contains an unsubstituted or substituted aromatic carboxylic acid having a pKa of 1.5-4.0 in an amount of 0.5-5 parts by mass per 100 parts by mass of the rubber component.
摘要翻译：关于由热塑性树脂或热塑性弹性体组合物形成的膜和由其中掺入环氧化天然橡胶的橡胶组合物形成的层的层压体，改善了膜和橡胶组合物层之间的粘合性，而不使用大量的环氧化天然橡胶。由热塑性树脂或热塑性弹性体组合物形成的膜和由橡胶组合物形成的层的层压体，其特征在于，所述橡胶组合物中含有的橡胶组分中的5-60质量％由环氧化物天然橡胶和20-50质量％的橡胶组分由丁二烯橡胶组成; 橡胶组合物含有每100质量份橡胶组分0.5-5质量份的pKa为1.5-4.0的未取代或取代的芳族羧酸。

4. 发明申请

US20100197830A1 ADHESIVE FOR ELECTRONIC COMPONENT 有权
标题翻译：电子元件胶
公开(公告)号：US20100197830A1
公开(公告)日：2010-08-05
申请号：US12669081
申请日：2008-07-17
申请人： Akinobu Hayakawa , Hideaki Ishizawa , Kohei Takeda , Ryohei Masui
发明人： Akinobu Hayakawa , Hideaki Ishizawa , Kohei Takeda , Ryohei Masui
IPC分类号： C09J163/00
CPC分类号： H01L23/295 , C08G59/42 , C08K3/36 , C09J11/04 , C09J163/08 , H01L2924/0002 , H01L2924/00
摘要： The present invention has its object to provide an adhesive for electronic components, excellent in coatability, having high preventability of stains in bonded electronic components, and capable of providing highly reliable electronic components. The present invention relates to a liquid adhesive for electronic components, containing: a curable compound; a curing agent; and inorganic fine particles, a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 8 to 11 (including 8 and not including 11), the inorganic fine particles including a mixture of at least inorganic fine particles (A) and inorganic fine particles (B), the inorganic fine particles (A) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 30 to 50 (including 30 and 50), and the inorganic fine particles (B) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 60 or more.
摘要翻译：本发明的目的是提供一种用于电子部件的粘合剂，涂布性优异，粘合的电子部件中的污渍的防止性高，并且能够提供高可靠性的电子部件。本发明涉及一种电子部件用液体粘合剂，其含有：固化性化合物; 固化剂; 和无机细颗粒，所述液体粘合剂中的溶解度参数（SP值）在8至11（包括8并且不包括11）的范围内的液体部分，所述无机细颗粒至少包括无机细颗粒 A）和无机微粒（B），平均一次粒径为50nm以下的疏水化度（M值）为30〜50（包括30〜50）的无机微粒（A）和平均一次粒径为50nm以下，疏水度（M值）为60以上的无机微粒（B）。

5. 发明授权

US07723441B2 Low out-gassing room temperature curable rubbery polymer, preparation thereof and device comprising same 有权
标题翻译：低出气室温可固化橡胶状聚合物，其制备方法及包含其的装置
公开(公告)号：US07723441B2
公开(公告)日：2010-05-25
申请号：US11640798
申请日：2006-12-18
申请人： Paul John Shustack
发明人： Paul John Shustack
IPC分类号： C08F8/00
CPC分类号： C08L51/06 , C08C19/02 , C08F2/50 , C08F255/02 , C08F279/02 , C08K3/013 , C08K3/10 , C08K3/105 , C08K5/0025 , C08K5/053 , C08K9/06 , C08L9/00 , C08L15/00 , C08L23/16 , C08L51/04 , C08L63/08 , C08L69/00 , C08L71/02 , C08L101/06 , C08L2666/02 , C09J109/00 , C09J163/08 , C08L2666/04
摘要： Disclosed is polymer materials essentially free of silicone capable of room-temperature thermal cure and when cured having low modulus, low out-gassing rate. The material before cure typically comprises three components: (i) a cationically curable component comprising the backbone of a hydrocarbon-based rubber material essentially free of carbon-carbon double bonds and triple bonds; (ii) a hydroxyl-containing component having at least two hydroxyl groups per molecule; (iii) an initiator component having essentially no volatility at room temperature and also yield products after polymerization that have minimal or no volatility at room temperature; (iv) an optional viscosity adjustment component either homopolymerizable or capable of copolymerizing with the photo or electron beam curable material component of (i); and (v) an optional non-alkaline inert filler. Also disclosed are process for making such cured material and devices comprising such cured polymer materials.
摘要翻译：公开了基本上不含能够进行室温热固化并且固化时具有低模量，低排气速率的聚合物材料。固化前的材料通常包括三个组分：（i）阳离子可固化组分，其包含基本上不含碳 - 碳双键和三键的烃基橡胶材料的骨架; （ii）每分子具有至少两个羟基的含羟基成分; （iii）在室温下基本上没有挥发性的引发剂组分，并且还产生在室温下具有最小或没有挥发性的聚合后的产物; （iv）任选的粘度调节组分，其可均匀聚合或能够与（i）的光或可电子束固化材料组分共聚; 和（v）任选的非碱惰性填料。还公开了制备这种固化的材料和包含这种固化的聚合物材料的装置的方法。

6. 依法登记的发明

USH1597H Epoxidized diene elastomers for exterior block crosslinking 失效
标题翻译：用于外部块交联的环氧化二烯弹性体
公开(公告)号：USH1597H
公开(公告)日：1996-09-03
申请号：US423431
申请日：1995-04-18
申请人： James R. Erickson
发明人： James R. Erickson
IPC分类号： C08G59/02 , C08F8/08 , C08F297/02 , C08G59/34 , C09D153/00 , C09D163/08 , C09J153/00 , C09J163/08 , C08J3/28
CPC分类号： C08G59/027 , C08F8/04 , C08F8/08 , C08F297/02 , C08F2800/10 , C08F2800/20 , C09D153/00 , C09J153/00 , C09J163/08
摘要： An epoxidized diene block polymer comprising at least interior and exterior diene blocks wherein the exterior diene blocks contain a greater concentration of di-, tri- and tetrasubstituted olefinic epoxides than the interior blocks and wherein the exterior blocks contain from 0.2 to 10 Meq of olefinic epoxides per gram of exterior blocks and the molecular weights of the exterior blocks are from 3000 to 50,000 and the molecular weights of the interior blocks are from 15,000 to 200,000.
摘要翻译：包含至少内部和外部二烯嵌段的环氧化二烯嵌段聚合物，其中外部二烯嵌段含有比内部嵌段更大浓度的二，三和四取代的烯属环氧化物，并且其中外部嵌段含有0.2-10Mq烯属环氧化物每克外部块，外部块的分子量为3000至50,000，内部块的分子量为15,000至200,000。

7. 发明授权

US5516824A Solvent-free laminating adhesive composition 失效
标题翻译：无溶剂层压粘合剂组合物
公开(公告)号：US5516824A
公开(公告)日：1996-05-14
申请号：US337714
申请日：1995-01-23
申请人： Michael A. Masse , Paul A. Mancinelli , James R. Erickson , Steven H. Dillman , Robert C. Bening , David R. Hansen
发明人： Michael A. Masse , Paul A. Mancinelli , James R. Erickson , Steven H. Dillman , Robert C. Bening , David R. Hansen
IPC分类号： B32B27/08 , C08G59/34 , C09J153/00 , C09J153/02 , C09J163/08 , C08K5/10 , C08L63/08
CPC分类号： C08G59/027 , B32B27/08 , C09J153/005 , C09J153/025 , C09J163/08 , Y10T428/31515
摘要： A laminating adhesive comprising an adhesive composition which comprises(a) An epoxidized block copolymer of the formula(A-B-A.sub.p).sub.n -Y.sub.r -(A.sub.q -B).sub.mwherein Y is a coupling agent or coupling monomers, andwherein A and B are polymer blocks which may be homopolymer blocks of conjugated diolefin monomers, copolymer blocks of conjugated diolefin monomers or copolymer blocks of conjugated diolefin monomers and monoalkenyl aromatic hydrocarbon monomers, andwherein the A blocks have a higher number of aliphatic double bonds between a tertiary carbon atom and either a primary, secondary, or tertiary carbon atom per unit of block mass than do the B blocks, andwherein the A blocks have a molecular weight from about 100 to about 3000 and the B blocks have a molecular weight from about 1000 to about 15,000, and wherein p and q are 0 or 1 and n>0, r is 0 or 1, m.gtoreq.0 and n+m ranges from 1 to 100; and(b) at least a significant amount of a tackifying resin compatible with the polymer of (a) up to 400 phr.The invention also relates to a laminate containing the adhesive.
摘要翻译：一种层压粘合剂，其包含粘合剂组合物，其包含（a）式（AB-Ap）n-Yr-（Aq-B）m的环氧化嵌段共聚物，其中Y为偶联剂或偶联单体，并且其中A和B为聚合物嵌段，其可以是共轭二烯烃单体的均聚物嵌段，共轭二烯单体的共聚物嵌段或共轭二烯烃单体的共聚物嵌段和单链烯基芳烃单体，并且其中所述A嵌段在叔碳原子和叔碳原子之间具有更高数量的脂族双键与B嵌段相比，每单位嵌段质量的伯，仲或叔碳原子，其中A嵌段的分子量为约100至约3000，B嵌段的分子量为约1000至约15,000 并且其中p和q为0或1且n> 0，r为0或1，m≥0和n + m的范围为1至100; 和（b）至少大量的与（a）多至400phr的聚合物相容的增粘树脂。本发明还涉及含有粘合剂的层压体。

8. 发明授权

US5066691A Adhesive composition for metal-clad laminates 失效
标题翻译：金属覆层压板用粘合剂组合物
公开(公告)号：US5066691A
公开(公告)日：1991-11-19
申请号：US442637
申请日：1989-11-29
申请人： Toshihisa Kumakura , Ken Nanaumi , Ryoichi Ikezawa , Hideki Eriguchi
发明人： Toshihisa Kumakura , Ken Nanaumi , Ryoichi Ikezawa , Hideki Eriguchi
IPC分类号： C09J115/00 , C09J129/14 , C09J163/08 , H05K3/38
CPC分类号： H05K3/386 , C09J115/00 , C09J129/14 , C09J163/08 , H05K2201/0133 , H05K2201/0209 , H05K2201/0355 , H05K2201/0358
摘要： An adhesive composition for metal-clad laminates which comprises:(a) 100 parts by weight of a polyvinylbutyral having an average polymerization degree of from 500 to 3,000 and a degree of butyralization of at least 60 mol %,(b) from 10 to 200 parts by weight of an epoxidized polybutadiene per 100 parts by weight of the polyvinylbutyral, the epoxidized polybutadiene having a number average molecular weight of from 1,000 to 10,000 and an epoxy equivalent weight of from 200 to 2,000, and(c) from 1 to 10 parts by weight of a hardener for the epoxidized polybutadiene per 100 parts by weight of the epoxidized polybutadiene.
摘要翻译：一种金属包覆层压体用粘合剂组合物，其包含：（a）100重量份的平均聚合度为500〜3000，丁缩醛化度为60摩尔％以上的聚乙烯醇缩丁醛，（b）10〜200 每100重量份的聚乙烯醇缩丁醛，环氧化聚丁二烯重量份，数均分子量为1,000至10,000，环氧当量为200至2,000的环氧化聚丁二烯和（c）1至10份的环氧化聚丁二烯硬化剂，每100重量份环氧化聚丁二烯。

9. 发明申请

US20150348858A1 UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME 有权
标题翻译：使用其制造半导体器件的材料和方法
公开(公告)号：US20150348858A1
公开(公告)日：2015-12-03
申请号：US14423821
申请日：2014-09-10
申请人： DEXERIALS CORPORATION
发明人： Taichi KOYAMA
IPC分类号： H01L23/29 , H01L23/00 , C08J5/18 , H01L21/56
CPC分类号： H01L23/293 , C08G59/4284 , C08J5/18 , C08J2333/16 , C08J2363/02 , C08J2433/16 , C08J2463/02 , C08L63/00 , C09J133/04 , C09J163/08 , H01L21/563 , H01L21/6836 , H01L24/81 , H01L2221/68327 , H01L2221/68377 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/83191 , H01L2924/00011 , H01L2924/01322 , H01L2924/06 , H01L2924/0635 , H01L2924/0665 , H01L2924/186 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/00 , H01L2224/81805 , C08L33/00
摘要： An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material, including an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, the minimum melt viscosity being between 1000 Pa*s and 2000 Pa*s, and gradient of melt viscosity between 10° C. higher than the minimum melt viscosity attainment temperature and a temperature 10° C. higher being between 900 Pa*s/° C. and 3100 Pa*s/° C., is applied to a semiconductor chip having a solder-tipped electrode formed thereon, and the semiconductor chip is mounted onto a circuit substrate having a counter electrode opposing the solder-tipped electrode, and the semiconductor chip and the circuit substrate are thermocompressed under bonding conditions of raising the temperature from a first temperature to a second temperature at a predetermined rate.
摘要翻译：提供了能够实现无空隙封装和优异的焊接接合性能的底部填充材料，以及制造使用其的半导体器件的方法。包括环氧树脂，酸酐，丙烯酸树脂和有机过氧化物的底部填充材料的最低熔体粘度在1000Pa·s和2000Pa·s之间，熔体粘度梯度高于10℃ 将最低熔融粘度达到温度和10℃之间的温度提高至900Pa·s /℃和3100Pa·s /℃之间的温度施加到其上形成有焊料尖端电极的半导体芯片，以及将半导体芯片安装到具有与焊料尖端电极相对的对置电极的电路基板上，并且在以预定速率将温度从第一温度升高到第二温度的接合条件下，将半导体芯片和电路基板热压。

10. 发明申请

US20140349109A1 PRESSURE SENSITIVE ADHESIVES BASED ON CARBOXYLIC ACIDS AND EPOXIDES 审中-公开
标题翻译：基于羧酸和环氧化合物的压力敏感性粘合剂
公开(公告)号：US20140349109A1
公开(公告)日：2014-11-27
申请号：US14363780
申请日：2012-12-05
申请人： State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon , State University
发明人： Kaichang Li , Anlong Li
IPC分类号： C09J163/00 , C09J7/02 , B32B37/26 , C09J163/08
CPC分类号： C09J163/00 , B32B37/26 , B32B2037/268 , C08G59/42 , C09J7/38 , C09J163/08 , C09J2463/00 , C09J2463/008 , Y10T428/287
摘要： A method for making a pressure sensitive adhesive comprising: (a) reacting (i) at least one dibasic acid or anhydride thereof with (ii) at least one epoxide having at least two epoxy groups, one diol or polyol, or one diamine at a stoichiometric molar excess of reactive carboxylic acid groups relative reactive epoxy groups, hydroxyl groups or amine groups to produce a thermoplastic prepolymer or oligomer capped with a carboxylic acid group at both prepolymer or oligomer chain ends, or a thermoplastic branched prepolymer or oligomer with at least two of the prepolymer or oligomer branches and chain ends capped with a carboxylic acid group; and (b) curing the resulting carboxylic acid-capped prepolymer or oligomer with at least one polyfunctional epoxy to produce a pressure sensitive adhesive, wherein the polyfunctional epoxy is not an epoxidized vegetable oil. A method for making a pressure sensitive adhesive comprising: (a) reacting at least one dibasic acid or anhydride thereof with at least one epoxide having at least two epoxy or oxirane groups at a stoichiometric molar excess of reactive epoxy or oxirane groups relative reactive carboxylic acid groups to produce a thermoplastic prepolymer or oligomer capped with an epoxy or an oxirane group at both prepolymer or oligomer chain ends, or a thermoplastic branched prepolymer or oligomer with at least two of the prepolymer or oligomer branches and chain ends capped with an epoxy or oxirane group; and (b) (i) curing the resulting epoxy-capped prepolymer or oligomer with at least one polybasic acid, or (ii) thermally curing the resulting epoxy-capped prepolymer or oligomer, to produce a pressure sensitive adhesive.
摘要翻译：一种制造压敏粘合剂的方法，包括：（i）使（i）至少一种二元酸或其酸酐与（ii）至少一种具有至少两个环氧基的环氧化物，一种二醇或多元醇或一种二胺在化学计量摩尔过量的反应性羧酸基团相对于反应性环氧基，羟基或胺基，以产生在预聚物或低聚物链末端用羧酸基团封端的热塑性预聚物或低聚物，或具有至少两个的热塑性支链预聚物或低聚物的预聚物或低聚物分支和用羧酸基团封端的链端; 和（b）用至少一种多官能环氧树脂固化得到的羧酸封端的预聚物或低聚物以制备压敏粘合剂，其中多官能环氧不是环氧化植物油。一种制造压敏粘合剂的方法，包括：（a）使化学计量摩尔过量的反应性环氧或环氧乙烷基团的至少一种具有至少两个环氧基或环氧乙烷基团的至少一种二元酸或其酸酐与相对反应性羧酸以产生在预聚物或低聚物链末端用环氧基或环氧乙烷基封端的热塑性预聚物或低聚物，或具有至少两个预聚物或低聚物分支的热塑性支链预聚物或低聚物，并且用环氧基或环氧乙烷封端的链端组; 和（b）（i）用至少一种多元酸固化得到的环氧基封端的预聚物或低聚物，或（ii）热固化所得环氧树脂封端的预聚物或低聚物，以产生压敏粘合剂。

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